PR1-200A
Positive Resist PR1-200A is a positive tone photoresist designed for 365 or 436 nm wavelength
exposure, using tools such as wafer steppers, scanning projection aligners, proximity printers and
contact printers. PR1-200A excels in applications when superior adhesion is required. Use of
adhesion promoters, such as HMDS is not recommended with PR1-200A.
These are the advantages of PR1-200A over other resists:
- superior resolution capability
- fast photospeed
- superior linewidth control due to suppression of reflective notching
- substrate adhesion which is superior to that of any commercial positive resist
- ease of removal after RIE process
- shelf life exceeding 1 year at room temperature storage.
The formulation and processing of PR1-200A were designed with regard to occupational and
environmental safety. The principal solvent in PR1-200A is 1-methoxy-2-propanol and development
of PR1-200A is accomplished in a basic water solution.
Properties
♦ Solids content (%): 7-8
♦ Principal solvent: 1-methoxy-2-propanol
♦ Appearance: red yellow liquid
♦ Coating characteristic: very uniform, striation free
♦ Film thickness information:
Coating spin speed,
40 s spin (rpm)
Film thickness after 100°C oven
bake for 15 min (nm)
3000 180-220
♦ Sensitivity (mJ/cm² for 1 μm thick film):
365 nm exposure wavelength: 70
436 nm exposure wavelength: 40
♦ Guaranteed shelf life at 25°C storage (years): 1
Processing
1 Application of resist by spin coating at selected spin speed for 40 s.
2 120°C hotplate bake for 120 s.
3 Resist exposure in a tool incorporating 365 or 436 nm wavelength.
4 Develop the resist by immersion with agitation or by spraying with aqueous Resist Developer
RD6 at a constant temperature in the 20-25 °C range until the exposed resist is developed away.
Allow an additional 4 seconds for overdevelopment. Development time for 0.2 μm thick film in RD6/water 3:1 is 10 s.