Optimal TEM specimen preparation done First Time Right

• Achieve ultimate specimen quality – free from amorphous and implanted layers

• Complements FIB technology

• Milling without introduction of artifacts

• Advanced detector technology for imaging and precise endpoint detection

• In situ imaging with ions and electrons

• Microscope connectivity for risk-free specimen handling

• Adds capability and capacity

• Fast, reliable and easy to use

首次完成最佳TEM样品制备

实现最终的样品质量——不含非晶层和植入层

补充FIB技术

铣削时不引入人工制品

用于成像和精确终点检测的先进检测器技术

离子和电子原位成像

显微镜连接实现无风险样本处理

增加功能和容量

快速、可靠且易于使用

离子束制备

将超低能量、惰性气体离子源和扫描电子柱与多个检测器相结合，以产生最佳的 TEM 样品。