TotalProtect Process - 美国专利9,543,173 B2-用施加的电压和冷却系统解封装。 
 

全自动化学芯片开封机系统----JetEtch TotalPROTECT

        美国Nisene的JetEtch TotalProtect系统配备了JetEtch Pro系列的所有强大功能。它具有CuProtect的专利偏置电压应用处理能力。它也具有特殊的冷却功能，可以对蚀刻酸进行低温环境冷却。结合偏置应用序,TotalProtect为最终用户提供了大量的蚀刻参数，可用于几乎无限的配方组合。

        The JetEtch Pro TotalProtect is the world’s most advanced decapsulation system. With an unequaled feature set, the TotalProtect can etch the widest variety of any integrated circuits of any system on the market while maintaining the integrity of sensitive internal components. It is the new gold standard. Only from Nisene Technology Group.

主要特征（Features）:

• Sub-Ambient Cooling

• Daisy-Chaining Recipes

• Same Specs as the CuProtect

What It Does.

       The TotalProtect system comes equipped with all of the great features of the JetEtch Pro decapsulation system, as you might expect. It also comes with the patented bias voltage application process capability of the CuProtect. In addition to that, it ALSO has a special cooling feature that allows sub-ambient cooling of the etching acid. When combined with the bias application process, the TotalProtect offers the end user a tremendous range of etching parameters for virtually endless recipe combinations. It’s the total package for total protection. It’s the JetEtch Pro TotalProtect.

  

开封样例 ---- SEM高倍率放大
 

Let Us Prove It To You.

        If you are interested in seeing what the TotalProtect can do and are interested in one of these systems for your facility, send us a set of samples and we’ll prove the concept for you free of charge