产品描述
产品描述 Features Wafer/substrate size from pieces up to 200 mm/8’’ Top-side and bottom-side alignment capability High-precision alignment stage Automated wedge compensation sequence Motorized and recipe-controlled exposure gap Supports the latest UV-LED technology Minimized system footprint and facility requirements Step-by-step process guidance Remote tech support Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages) Agile processing and conversion re-tooling Table top or stand-alone version with anti-vibration granite table Additional capabilities: Bond alignment IR alignment Nanoimprint lithography (NIL) Technical DataAlignment modes Top side alignment: ≤ ± 0,5 µm Bottom side aligment: ≤ ± 2,0 µm IR alignment: ≤ ± 2,0 µm/ substrate material depending Bond alignment: ≤ ± 2,0 µm NIL alignment: ≤ ± 2,0 µm Exposure source Mercury light source / UV LED light source Wedge compensation Fully automatic - SW controlled Wafer diameter (substrate size) Up to 100 / 150 / 200 mm Exposure setup Vacuum contact / hard contact / soft contact / proximity mode Exposure options Interval exposure / flood exposure / sector exposure Advanced alignment features Manual alignment / in-situ alignment verification Manual cross correction Large gap alignment System control Operation system: Windows File sharing & back-up solution / unlimited no. recipes & parameters Multi-language user GUI & support: CN, DE, FR, IT, JP, KR Real-time remote access, diagnostics & troubleshooting Nanoimprint lithography technology UV-NIL 
