表3.热机械FEA边界条件和载荷
图13:封装衬底、ASIC和MEMS(顶部无晶圆)翘曲(w)。
结论
本文介绍了一个红外传感器的封装设计,产品原型表征测试结果令人满意,测量到的FFOV角度在80°到110°之间,具体数值取决于光窗尺寸。为了降低闪光灯影响和环境噪声,封装顶部装有硅基红外滤光片,并做了表征实验。应力模拟未在材料界面上发现临界情况。封装可靠性已初步达到JEDEC L3的环境应力要求。
致谢
特别感谢Daniela Morin负责的ST微电子分析实验室,感谢Alexandra Colombo和Luca Privileggi在系统级封装物理分析和3D断层扫描方面提供的帮助。感谢Angelo Recchia和Michele Vaiana在系统电气表征方面的提供的支持。作者团队感谢ASE的Michael Chen、Chris YC Huang,ASE欧洲的Chen-Li、Sharon Liu和Christophe Zinck在首批原型制造方面给予的帮助。
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