13.220 消防 标准查询与下载

IPC MI-660 3.1-1984 薄铜复合层板(下0.030厚)

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Thin Copper-Clad Laminates (Under 0.030 Thick)

IPC MI-660 2.2-1984 灵活铜复合板

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Copper-Clad Laminate, Flexible

IPC MI-660 2.1-1984 硬铜复合板

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Copper-Clad Laminate, Rigid

IPC MI-660 9.2-1984 路由器齿片

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Router Bits

IPC MI-660 9.3-1984 进入和备份材料

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Entry and Backup Materials

IPC MI-660 9.5-1984 插脚和衬套

This document covers guidelines for selecting electrically conductive adhesives for use in assembly of components to printed circuit boards (PCB) or similar wiring interconnect systems. The focus is on the use of adhesives as solder alternatives. The process discussion attempts to stay within the bounds of the existing solder assembly infrastructure as much as possible. Both major types of adhesives, isotropic (conducting equally in all directions) and anisotropic (unidirectional conductivity), are covered. The two major divisions of polymer adhesives, thermosets and thermoplastics, are described.

Pins and Bushings

IPC MI-660 10.0-1984 其他材料

This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components and for their long-term properties as a part of the printed wiring board assembly. Applications include the foliowing: flexible PWB-to-glass, flexible PWB-to-rigid PW, flip chip-to-glass, flip chip-toflexible PWB, flip chip-to-rigid PWB, and fine pitch SMD. The adhesive film may be supplied pre-attached to a flexible circuit or other product.

Other Materials

IPC MI-660 8.2-1984 松香通量

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Rosin Flux

IPC MI-660 10.2-1984 磁带

This specification covers the requirements for high speedíhigh frequency base materials, herein referred to as laminate or bonding layer, to be used primarily for the fabrication of rigid or multilayer printed boards for high speedhigh frequency electrical and electronic circuits. This specification applies to material thickness defined in the specification sheets as measured over the dielectric only

Tape

IPC MI-660 7.2-1984 重氮片工作银盐

This International Standard relates to grid systems for printed circuits to ensure compatibility between the printed circuits and parts to be mounted on them at the intersections of the grid.

Silver Halide, Diazo Working Films

IPC MI-660 7.1-1984 艺术品

This standard establishes the requirements for exchanging material and substance data between suppliers and their customers for Electrical and Electronic Equipment (EEE). This standard applies to products, components, subitems and materials that are supplied to producers of EEE for incorporation into their products. It does not apply to packaging materials (e.g. cardboard, plastic tray). It covers materials and substances that may be present in the supplied product or subitem. It does not apply to process chemicals, unless those process chemicals constitute part of the finished product or subitem.

Artwork

CNS 3657-1973 岩棉保温材料

本标准适用于热绝缘或其它产品之岩棉，并以此作为主要材料之如岩棉板，岩棉毡，岩棉保温管，岩棉保温带及岩棉被毯等。

Rock Wool Insulating Material