共找到 1126 条与 电子元器件综合 相关的标准,共 76 页
Measurement of the dimensions of a cylindrical component with axial terminations (IEC 60294:2012)
Reliability Prediction MIL-HDBK-217 Subsidiary Specification
TEST METHOD FOR FLUID AND GREASE RESISTANCE OF THERMOSET ENCAPSULATING COMPOUNDS USED IN ELECTRONIC AND MICROELECTRONIC APPLICATIONS
5.1 Fluids and greases in contact with encapsulating compounds have the potential to adversely modify the encapsulant properties with resulting damage or loss of protection to components in electronic applications. 5.2 This test method provides a means for measuring the effect of fluids and greases on various encapsulants. 5.3 This test method is intended for use in research and evaluation. 1.1 This test method determines the resistance of encapsulating compounds to fluids or greases by measuring changes in weight (Note 1) and volume under defined conditions of time and temperature. Note 1—To provide consistency with the usage in other ASTM test methods concerned with determining the properties of plastic materials, the terms “weight” and “weigh” are used in this test method although the units of measurement are those of mass. 1.2 The values stated in SI units are standard. The values in parentheses are for information only.Note 2—There is no similar or equivalent IEC standard. 1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. See 9.1.
Standard Test Method for Fluid and Grease Resistance of Thermoset Encapsulating Compounds Used in Electronic and Microelectronic Applications
Lawfully Authorized Electronic Surveillance (LAES) - Addendum 3 -Support for BSID or Subnet
Integrated system of general technical requirements. Electronic components. General technical requirements
Integrated systems of general technical requirements and control quality. Electronic components. Total concepts
Complex system of general technical requirements. Electronic components. System of technical conditions
Complex quality control system. Electronic components. Requirements quality assurance and quality control
Electronics assembly technology. Part 3. Selection guidance of environmental and endurance test methods for solder joints
Complex quality control system. Electronic components. System of relationship between manufacturers and customers
Measurement of the dimensions of a cylindrical component with axial terminations
IEC Quality Assessment System for Electronic Components (IECQ System) - Rules of Procedure - Part 4: IECQ ECMP Scheme - Avionics Assessment Program Requirements
IEC Quality Assessment System for Electronic Components (IECQ System) - Rules of Procedure - Part 5: IECQ HSPM Scheme - Hazardous Substance Process Management Requirements
IEC Quality Assessment System for Electronic Components (IECQ System) - Rules of Procedure - Part 6: IECQ ITL Scheme - Independent Testing Laboratory Assessment Program Requirements
IEC Quality Assessment System for Electronic Components (IECQ System) - Rules of Procedure - Part 2: IECQ Approved Process Scheme
IEC Quality Assessment System for Electronic Components (IECQ System) - Rules of Procedure - Part 3: IECQ Approved Component Products, Related Materials & Assemblies Scheme
IEC Quality Assessment System for Electronic Components (IECQ System) - Rules of Procedure - Part 1: General Requirements for all IECQ Schemes
This document has been declared "Stabilized" and will no longer be subjected to periodic reviews for currency. Users are responsible for verifying references and continued suitability or technical requirements. New technology may exist.
Connector, Receptacles, Plugs, Adaptor, El, Embedded, Printed Circuit Board Lamp Lighting Panels
IEC quality assessment system for electronic components (IECQ system) - Basic rules
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