31.020 电子元器件综合 标准查询与下载

DB37/T 1882-2011 用丙烯酸杆检验声发射（AE）传感器响应一致性实施规程

Practice for Verifying Consistency of Acoustic Emission (AE) Sensor Response Using Acrylic Rods

ANSI/VITA 51.2-2011 失效可靠性的物理学预测

This specification provides standard processes, instructions and default parameters for using the Physics of Failure (PoF) approach for modeling the reliability of electronic products. It includes a discussion of the philosophy, context for use, definitions, models for key failure mechanisms, definition of the input data required, default values if technically feasible or the typical range of values as a guideline. It defines how modeling results are interpreted and used. It requires the documentation of modeling inputs, assumptions made during the analysis, modifications to the models and rationale for the analysis.

Physics of Failure Reliability Predictions

ANSI/EIA 960-A:2011 货盘组件装配.ACT

Covers requirements for Assepmbly Component Trays - ACTs used during automated assembly processes.

Assembly Component Tray- ACT

ASTM E1250-10 电子元件应用评估硅电子器件辐射硬度测试中使用的钴-60型辐射器的低能伽马元件的标准测试方法

Although Co-60 nuclei only emit monoenergetic gamma rays at 1.17 and 1.33 MeV, the finite thickness of sources, and encapsulation materials and other surrounding structures that are inevitably present in irradiators can contribute a substantial amount of low-energy gamma radiation, principally by Compton scattering (1, 2). In radiation-hardness testing of electronic devices this low-energy photon component of the gamma spectrum can introduce significant dosimetry errors for a device under test since the equilibrium absorbed dose as measured by a dosimeter can be quite different from the absorbed dose deposited in the device under test because of absorbed dose enhancement effects (3, 4). Absorbed dose enhancement effects refer to the deviations from equilibrium absorbed dose caused by non-equilibrium electron transport near boundaries between dissimilar materials. The ionization chamber technique described in this method provides an easy means for estimating the importance of the low-energy photon component of any given irradiator type and configuration. When there is an appreciable low-energy spectral component present in a particular irradiator configuration, special experimental techniques should be used to ensure that dosimetry measurements adequately represent the absorbed dose in the device under test. (See Practice E1249.)1.1 Low energy components in the photon energy spectrum of Co-60 irradiators lead to absorbed dose enhancement effects in the radiation-hardness testing of silicon electronic devices. These low energy components may lead to errors in determining the absorbed dose in a specific device under test. This method covers procedures for the use of a specialized ionization chamber to determine a figure of merit for the relative importance of such effects. It also gives the design and instructions for assembling this chamber. 1.2 This method is applicable to measurements in Co-60 radiation fields where the range of exposure rates is 7 × 10 −6 to 3 × 10−2 C kg −1 s−1 (approximately 100 R/h to 100 R/s). For guidance in applying this method to radiation fields where the exposure rate is >100 R/s, see Appendix X1. Note 18212;See Terminology E170 for definition of exposure and its units. 1.3 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only. 1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Standard Test Method for Application of Ionization Chambers to Assess the Low Energy Gamma Component of Cobalt-60 Irradiators Used in Radiation-Hardness Testing of Silicon Electronic Devices

DIN EN 61760-3:2010 表面安装技术.第3部分:通孔回流(THR)焊接用组件规范的标准方法(IEC 61760-3-2010).德文版本EN 61760-3-2010

Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering (IEC 61760-3:2010); German version EN 61760-3:2010

LST EN 61360-1-2010 电气产品相关分类方案的标准数据元素类型 第1部分：定义 原则和方法（IEC 61360-1:2009）

Standard data elements types with associated classification scheme for electric items -- Part 1: Definitions - Principles and methods (IEC 61360-1:2009)

DS/EN 61360-1:2010 电气产品相关分类方案的标准数据元素类型 第1部分：定义 原则和方法

IEC 61360-1:2009 provides a firm basis for the clear and unambiguous definition of characteristic properties (data element types) of all elements of electrotechnical systems from basic components to sub-assemblies and full systems. The principles and methods of this standard may be used in areas outside the original conception such as assemblies of components and electrotechnical systems and subsystems. In addition, this standard provides for establishing a classification hierarchy and the allocation of applicable and relevant properties to each of the classes so established in order to describe fully the characteristics of objects belonging to that class.

Standard data elements types with associated classification scheme for electric items - Part 1: Definitions - Principles and methods

NF C90-710-3*NF EN 61760-3:2010 表面安装技术.第3部分:通孔回流(THR)焊接用元部件规格的标准方法

Surface mounting technology - Part 3 : standard method for the specification of components for Through Hole Reflow (THR) soldering.

IECQ 04-5-2010 电子元器件用IEC质量评价系统(IECQ 系统).标准培训.第5部分:执行IECQ HSPM培训的标准操作规程

IEC quality assessment system for electronic components (IECQ scheme) - Standard training - Part 5: Standard operational procedures for conducting IECQ HSPM training

IECQ 04-1-2010 电子元器件用IEC质量评价系统(IECQ 系统).标准培训.第1部分:IECQ认可用IECQ培训机构要求和过程

IEC quality assessment system for electronic components (IECQ system) - Standard training - Part 1: IECQ training body requirements and process for IECQ acceptance

DS/EN 61760-3:2010 表面贴装技术 第3部分：通孔回流（THR）焊接元件规范的标准方法

IEC 61760-3:2010 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through hole reflow soldering technology. The object of this standard is to ensure that components with leads intended for through hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this standard defines test and requirements that need to be part of any component generic, sectional or detail specification, when through hole reflow soldering is intended. Further this standard provides component user

Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering

IECQ 02-2010 电子组件IEC质量评定体系(IECQ体系).程序规则.IECQ体系验收IECQ认证机构用通用要求

IEC Quality Assessment System for Electronic Components (IECQ System) - Rules of Procedure - General Requirements for the Acceptance of IECQ Certification Bodies into the IECQ System

DS/EN 61340-5-3:2010 静电 第 5-3 部分：保护电子设备免受静电现象影响 用于静电放电敏感设备的包装的特性和要求分类

IEC 61340-5-3:2010 defines the ESD protective packaging properties needed to protect electrostatic discharge sensitive devices (ESDS) through all phases of production, transport and storage. Test methods are referenced to evaluate packaging and packaging materials for these product and material properties. Performance limits are provided. This standard does not address protection from electromagnetic interference (EMI), radio frequency interference (RFI), electromagnetic pulsing (EMP) nor protection of volatile materials.

Electrostatics - Part 5-3: Protection of electronic devices from electrostatic phenomena - Properties and requirements classifications for packaging intended for electrostatic discharge sensitive devices

DIN EN 62137-1-5:2010 表面贴装技术.表面贴装焊接接点用环境及疲劳试验方法.第1-5部分:机械剪切疲劳试验(IEC 62137-1-5-2009).德文版本EN 62137-1-5-2009

The test method described in this part of IEC 62137 applies to area array packages, such as BGA.

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-5: Mechanical shear fatigue test (IEC 62137-1-5:2009); German version EN 62137-1-5:2009

IEEE 1413-2010 硬件可靠性预测的架构

Standard Framework for Reliability Prediction of Hardware

ASTM E668-10 测定电子设备在辐射硬度试验中的吸收剂量用热致发光-剂量测定法(TLD)的标准应用规程

Absorbed dose in a material is an important parameter that can be correlated with radiation effects produced in electronic components and devices that are exposed to ionizing radiation. Reasonable estimates of this parameter can be calculated if knowledge of the source radiation field (that is, energy spectrum and particle fluence) is available. Sufficiently detailed information about the radiation field is generally not available. However, measurements of absorbed dose with passive dosimeters in a radiation test facility can provide information from which the absorbed dose in a material of interest can be inferred. Under certain prescribed conditions, TLDs are quite suitable for performing such measurements. Note 28212;For comprehensive discussions of various dosimetry methods applicable to the radiation types and energy and absorbed dose-rate range discussed in this practice, see ICRU Reports 14, 17, 21, and 34.1.1 This practice covers procedures for the use of thermoluminescence dosimeters (TLDs) to determine the absorbed dose in a material irradiated by ionizing radiation. Although some elements of the procedures have broader application, the specific area of concern is radiation-hardness testing of electronic devices. This practice is applicable to the measurement of absorbed dose in materials irradiated by gamma rays, X rays, and electrons of energies from 12 to 60 MeV. Specific energy limits are covered in appropriate sections describing specific applications of the procedures. The range of absorbed dose covered is approximately from 10−2 to 104 Gy (1 to 106 rad), and the range of absorbed dose rates is approximately from 10−2 to 1010 Gy/s (1 to 1012 rad/s). Absorbed dose and absorbed dose-rate measurements in materials subjected to neutron irradiation are not covered in this practice. Further, the portion of these procedures that deal with electron irradiation are primarily intended for use in parts testing. Testing of devices as a part of more massive components such as electronics boards or boxes may require techniques outside the scope of this practice. Note 18212;The purpose of the upper and lower limits on the energy for electron irradiation is to approach a limiting case where dosimetry is simplified. Specifically, the dosimetry methodology specified requires that the following three limiting conditions be approached: (a) energy loss of the primary electrons is small, (b) secondary electrons are largely stopped within the dosimeter, and (c) bremsstrahlung radiation generated by the primary electrons is largely lost. 1.2 This standard dose not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Standard Practice for Application of Thermoluminescence-Dosimetry (TLD) Systems for Determining Absorbed Dose in Radiation-Hardness Testing of Electronic Devices

ANSI/VITA 51.3-2010 支持可靠性预测中鉴定和环境压力筛选

This standard provides rules, permissions, and observations to assure that cost effective Qualification and Environmental Stress Screening support valid reliability predictions and enhance electronics reliability. It includes a discussion of the systems engineering relationships between Qualification, Environmental Stress Screening, and reliability.

Qualification and Environmental Stress Screening in Support of Reliability Predictions

ANSI/IEEE 1413:2010 硬件可靠性预计用标准框架

This standard provides the framework for performing and reporting reliability predictions. It applies to hardware products including electronic, electrical, and mechanical devices and assemblies.

Standard Framework for Reliability Prediction of Hardware

GOST R IEC 61192-2-2010 焊接电子组件的工艺要求.第2部分:表面安装组件

Soldered electronic assemblies.Workmanship requirements. Part 2. Surface-mount assemblies

IEC TR 62152:2009 级联双端口或四端口的传输特性.术语和定义的背景

Transmission properties of cascaded two-ports or quadripols - Background of terms and definitions