31.020 电子元器件综合 标准查询与下载

SJ/Z 11388-2009 电子信息产品环保使用期限通则

本指导性技术文件提出了含有有毒有害物质或元素的电子信息产品确定环保使用期限的通用规则。 本指导性技术文件适用于《电子信息产品污染控制管理办法》调整范围内的有毒有害物质或元素的含量超出SJ/T 11363-2006规定的限量要求的电子信息产品。

General guidelines of enviroment-friendly use period of electronic information products

DS/EN 60286-3-1:2009 自动处理元件的包装 第 3-1 部分：连续带上表面贴装元件的包装 V 型 压制载带

This part of IEC 60286 is applicable to the taping of surface mount components using carrier tapes which have concave cavities formed by compression of the base material.

Packaging of components for automatic handling - Part 3-1: Packaging of surface mount components on continuous tapes - Type V - Pressed carrier tapes

DS/EN 60286-3-2:2009 自动处理元件的包装 第 3-2 部分：连续带上表面贴装元件的包装 VI 型 4 毫米宽的吸塑载带

This part of IEC 60286 is applicable to the tape packing of ultra small surface mount components using plastic blister carrier tape of 4 mm in width which has concave cavities for containing components of 1 mm in pitch of the component compartments (W4P1).

Packaging of components for automatic handling - Part 3-2: Packaging of surface mount components on continuous tapes - Type VI - Blister carrier tapes of 4 mm width

EN 60286-3-1:2009 用于自动搬运的元件包装 第 3-1 部分：表面贴装元件在连续带上的包装 V 型 压制载带

IEC 60286-3-1:2009(E) is applicable to the taping of surface mount components using carrier tapes which have concave cavities formed by compression of the base material.

Packaging of components for automatic handling – Part 3-1: Packaging of surface mount components on continuous tapes - Type V - Pressed carrier tapes

NF C93-704-1-5*NF EN 62137-1-5:2009 表面安装技术.表面安装焊接点用环境和持久测试方法.第1-5部分:机械剪切疲劳试验

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-5 : mechanical shear fatigue test.

IEC 60286-5:2003+AMD1:2009 CSV 自动搬运部件的包装 第5部分 基体 托盘

Packaging of components for automatic handling - Part 5: Matrix trays

DS/EN 60286-5/A1:2009 自动处理元件的包装 第5部分：矩阵托盘

Describes the common dimensions, tolerances and characteristics of the tray. It includes only those dimensions which are essential for the handling of the trays for the stated purpose and for placing or removing components from the trays.

Packaging of components for automatic handling - Part 5: Matrix trays

NF C93-704-1-4*NF EN 62137-1-4:2009 表面安装技术.表面安装焊点的环境和耐久性试验方法.第1-4部分:循环弯曲试验

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4 : cyclic bending test.

LST EN 60286-5-2004/A1-2009 自动搬运组件的包装 第5部分：矩阵托盘（IEC 60286-5:2003/A1:2009）

Packaging of components for automatic handling - Part 5: Matrix trays (IEC 60286-5:2003/A1:2009)

DS/EN 60286-2:2009 自动处理元件的包装 第2部分：连续带上单向引线元件的包装

This part of IEC 60286 applies to the tape package of components with two or more unidirectional leads for use in electronic equipment. In general, the tape is applied to the component leads.This standard covers requirements for taping techniques used with equipment for automatic handling, preforming of leads, insertion and other operations and includes only those dimensions which are essential to the taping of components intended for the above-mentioned purposes.

Packaging of components for automatic handling - Part 2: Packaging of components with unidirectional leads on continuous tapes

GOST R 50044-2009 电子无线电设备表面安装用电子部件.结构兼容性要求

Electronic components for surface mounting at electronic radio equipment. Constructional compatibility requirements

ANSI/GEIA STD-0010-2009 系统安全计划开发和执行用标准最优实施规程

This document outlines standard best practices for the setup, implementation, and management of system safety programs. The system safety practice as defined herein provides a consistent means of evaluating identified risks. Mishap risk must be identified, evaluated, and mitigated to a level as low as reasonably practicable. The mishap risk must be accepted by the appropriate authority and compliant with federal (and state where applicable) laws and regulations, executive orders, treaties, and agreements.

Standard Best Practices for System Safety Program Development and Execution

GOST R 53736-2009 电子元件.设计程序与投入生产.主要条款

Electronic components. Procedure of creation and launching into manufacture. Main provisions

SAE GEIASTD0010-2008 系统安全程序开发和执行的最佳标准实施规程

This document outlines a standard practice for conducting system safety. The system safety practice as defined herein provides a consistent means of evaluating identified risks. Mishap risk must be identified, evaluated, and mitigated to a level as low as reasonably practicable. The mishap risk must be accepted by the appropriate authority and comply with federal (and state, where applicable) laws and regulations, executive orders, treaties, and agreements. Program trade studies associated with mitigating mishap risk must consider total life cycle cost in any decision.

Standard Best Practices for System Safety Program Development and Execution

DS/CLC/TR 61340-5-2:2008 静电 第 5-2 部分：保护电子设备免受静电现象影响 用户指南

This technical report has been developed to support IEC 61340-5-1.The controls and limits referenced in this standard were developed to protect devices that aresusceptible to discharges of 100 V or greater using the human body model test method.However, the general concepts are still valid for devices that are susceptible to discharges ofless than 100 V.

Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide

IEC 91/784/PAS:2008 电子学装配技术.焊料连接件用环境和耐久性试验方法的选择指南

Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints

IECQ 01-2008 电子元器件用IEC质量评估体系(IECQ系统).基本规则

IEC quality assessment system for electronic components (IECQ system) - Basic rules

BS DD CLC/TS 50466:2008 电子元件的长期存储 实施规范

Long duration storage of electronic components. Specification for implementation

BS DD CLC/TS 50466:2006 电子元件的长期存储.实施规范

Although it has always existed to some extent, obsolescence of electronic components, and particularly integrated circuits, has become increasingly intense over the last few years. I ndeed, with the existing technological boom, the commercial life of a component has become very short compared with the life of industrial equipment such as those encountered in the aeronautical field, the railway industry or the energy sector. The many solutions enabling obsolescence to be resolved are now identified. However, selecting one of these solutions must be preceded by a case by case technical and economic feasibility study, depending on whether storage is envisaged for field service or production. Remedial storage as soon as components are no longer marketed. Preventive storage anticipating declaration of obsolescence. Taking into account the expected life of some installations, sometimes covering several decades, the qualification times, and the unavailability costs, which can also be very high, the solution to be adopted to resolve obsolescence must often be rapidly implemented. This is why the solution retained in most cases consists in systematically storing components which are in the process of becoming obsolescent. The technical risks of this solution are, a priori, fairly low. However, it requires the perfect mastery of the implemented process, and especially of the storage environment, although this mastery becomes critical when it comes to long term storage. All handling, protection, storage and test operations should be performed in accordance with the technology requirements of the component.

Long duration storage of electronic components - Specification for implementation

QC 001002-5-2008 电子元器件IEC质量评定体系(IECQ 计划).程序规则.第5部分:有害物质过程管理要求(IECQ HSPM)

IEC Quality assessment system for Electronic Components (IECQ Scheme) - Rules of procedure - Part 5: Hazardous substance process management requirements (IECQ HSPM)