31.020 电子元器件综合 标准查询与下载

CEA-818-E-2005 电缆兼容性要求

This section sets forth the minimum requirements that shall be met by a cable-compatible television receiver or other cable-compatible consumer device in order to support the baseline services provided by a receiver-compatible digital cable TV system that complies with the requirements of Part I.

Cable Compatibility Requirements

SN/T 2005.2-2005 电子电气产品中多溴联苯和多溴联苯醚的测定 第1部分:气相色谱-质谱法

本部分规定了电子电气产品中多溴联苯和多溴联苯醚的气相色谱-质谱测定方法。 本部分适用于电子电气产品中多溴联苯和多溴联苯醚的测定。

Determination of polybromobiphenyls and polybromobiphenyl ethers in electrical and electronic equipment-Part 2:GC-MS method

SN/T 2005.1-2005 电子电气产品中多溴联苯和多溴联苯醚的测定 第1部分:高效液相色谱法

本部分规定了电子电气产品中多溴联苯和多溴联苯醚高效液相色谱测定方法。 本部分适用于电子电气产品中多溴联苯和多溴联苯醚的测定。

Determination of polybromobiphenyls and polybromobiphenyl ethers in electrical and electronic equipment-Part 1:High performance liquid chromatography method

SN/T 2004.3-2005 电子电气产品中六价铬的测定 第3部分:二苯碳酰二肼分光光度法

本部分规定了电子电气产品中六价铬的二苯碳酰二肼分光光度测定方法。 本部分适用于电子电气产品中六价铬的测定。

Determination of Chromium(VI) in electrical and electronic equipment-Part 3:1,5-Diphenylcarbohydrazide spectrophotometric method

SN/T 2004.2-2005 电子电气产品中铅、镉、铬的测定 第2部分:火焰原子吸收光谱法

本部分规定了电子电气产品中铅、镉和铬的火焰原子吸收光谱测定方法。 本部分适用于电子电气产品各种材质中铅、镉和铬含量的测定。

Determination of lead,cadmium and chromium in electrical and electronic equipment-Part 2:Flame atomic absorption spectrometric method

SN/T 2004.1-2005 电子电气产品中汞的测定 第1部分:原子荧光光谱法

本部分规定了电子电气产品中汞的氢化物发生原子荧光光谱测定方法。 本部分适用于电子电气产品中汞的测定。

Determination of mercury in electrical and electronic equipment-Part 1:Hydride generation-atomic fluorescence spectrometric method

SN/T 2003.1-2005 电子电气产品中铅、汞、镉、铬、溴的测定 第1部分:X射线荧光光谱定性筛选法

本部分规定了电子电气产品中铅、铬、汞、镉和溴的波长色散X射线荧光光谱定性筛选方法。 本部分适用于电子电气产品中铅、铬、汞、镉和溴的定性筛选。

Determination of lead,mercury,cadmium,chromium and bromine in electrical and electronic equipment-Part 1:Qualitative screening by wavelength dispersive X-ray fluorescence spectrometric method

IPC TM-650 2.5.5.10-2005 确定嵌入式被动材料介电常数和损失正切的高频率测试

This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components and for their long-term properties as a part of the printed wiring board assembly. Applications include the foliowing: flexible PWB-to-glass, flexible PWB-to-rigid PW, flip chip-to-glass, flip chip-toflexible PWB, flip chip-to-rigid PWB, and fine pitch SMD. The adhesive film may be supplied pre-attached to a flexible circuit or other product.

High Frequency Testing to Determine Permittivity and Loss Tangent of Embedded Passive Materials

SJ 20928-2005 陶瓷无引线片式载体详细规范

本规范规定了陶瓷无引线片式载体（以下简称载体）的详细要求。

Datail specification for ceramic leadless chip carrier

NF C93-704:2005 环境和耐用试验.区域阵列式包装件表面安装板的试验方法FBGA、BGA、FLGA、LGA、SON和QFN

Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN.

QC 001002-3-2005 电子元器件IEC质量评定体系(IECQ).程序规则.第3部分:项目核准程序

IEC Quality assessment system for Electronic Components (IECQ) - Rules of procedure - Part 3: Approval procedures

DIN EN 62137:2005 环境和耐久性试验.区域阵列式包装件表面安装板的试验方法FBGA、BGA、FLGA、LGA、SON和QFN

This Standard specifies the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages an peripheral terminal type packages.

Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN (IEC 62137:2004 + Corrigendum:2005); German version EN 62137:2004

SJ 20597A-2005 金属丝网屏蔽衬垫通用规范

本规范规定了军用电子设备（如屏蔽机箱机柜、屏蔽室、方舱、通用测量设备等）进行电磁屏蔽所用的金属丝网屏蔽衬垫（以下简称丝网衬垫）的要求、质量保证规定和交货准备等。 本规范适用于军用电子设备丝网衬垫的研制、生产和验收。民用电子设备丝网衬垫的研制、生产和验收也可遵照执行。

General specification for metal shielding mash gaskets

SJ 20755A-2005 军用电磁屏蔽通风窗通用规范

本规范规定了军用电磁屏蔽通风窗（以下简称通风窗）的要求、质量保证规定和交货准备等内容。本规范适用于军用电子设备进行电磁屏蔽时，所用的各种军用电磁屏蔽通风窗的研制、生产和验收。

General specification for military vented electromagnetic shielding window

DLA DSCC-VID-V62-04741-2005 微型电路,数字线型,九通道总线LVDS收发器,单块硅

This drawing documents the general requirements of a high performance nine channel bus LVDS transceiver microcircuit, with an operating temperature range of -40°C to +85°C.

MICROCIRCUIT, DIGITAL-LINEAR, NINE CHANNEL BUS LVDS TRANSCEIVER, MONOLITHIC SILICON

DLA DSCC-VID-V62-03671 REV B-2005 微型电路,数字线型,高速差动总线收发器,单块硅

This drawing documents the general requirements of a high performance differential bus transceiver microcircuit, with an operating temperature range of -40°C to +125°C for device type 01 and -55°C to +125°C for device type 02.

MICROCIRCUIT, DIGITAL-LINEAR, DIFFERENTIAL BUS TRANSCEIVER, MONOLITHIC SILICON

IEC 62137:2005 环境和耐用试验.区域阵列式包装件表面安装板的试验方法FBGA、BGA、FLGA、LGA、SON和QFN

This International Standard specifies the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages and peripheral terminal type packa

Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

WJ 2652-2005 引信用电子元器件筛选技术要求

Technical requirement for screening of electronic elements for fuses

DLA DSCC-DWG-87053 REV C-2005 扁平封装14引脚的网络电阻器

This drawing describes the requirements for a resistor network, 14-pin, flat pack.

RESISTOR, NETWORK, 14-PIN, FLAT PACK

CEA-679-C-2005 国家可恢复安全标准(NRSS)

CEA-679-C Part A describes the physical and electrical parameters of the interface for conditional access (CA) devices for consumer electronics (CE). The purpose of this standard is to specify the interface to a CA device that performs the signal access and, optionally, descrambling and key generation. It is possible to imagine that several CA devices could be interfaced to the same CE device, simultaneously (see Annex A (informative)). This interface definition allows the entire CA system to be removable and hence replaceable. Very few constraints, if any, are placed on the CA system architecture.

National Renewable Security Standard (NRSS)