31.020 电子元器件综合 标准查询与下载

CEA-556-C-2005 运输集装箱外部标签标准

This document provides instructions for producing and applying labels containing bar code symbols or labels containing bar code and two-dimensional symbols on outer shipping containers. A brief description of the integration of Electronic Data Interchange (EDI) and bar codes in a distribution environment is included.

Outer Shipping Container Label Standard NO LONGER AVAILABLE CONTACT WWW.MHIA.ORG TO ORDER

IEEE 1100-2005 电子设备供电和接地推荐操作规程

Presents recommended design, installation, and maintenance practices for electrical power and grounding (including both safety and noise control) and protection of electronic loads such as industrial controllers, computers and other information technology equipment used in commercial and industrial applications.

Recommended Practice for Powering and Grounding Electronic Equipment IEEE Emerald Book (Color Book Series)

LST EN 61360-5-2004 具有相关电气元件分类方案的标准数据元素类型 第5部分：EXPRESS 字典方案的扩展（IEC 61360-5:2004）

Standard data element types with associated classification scheme for electric components - Part 5: Extensions to the EXPRESS dictionary schema (IEC 61360-5:2004)

QC 001002-2 AMD 1-2004 IEC电子元器件质量评定体系(IECQ-CECC).程序规则.第2部分:关于新的第5条款元器件规范和评定规范(快速程序)规则的文献工作

This standard is IEC Quality Assessment System for Electronic Components (IECQ-CECC) - Rules of procedure - Part 2: Documentation, concerning a new clause 5, Regulations for component specifications and assessment specifications (fast track); Amendment 1.

IEC Quality Assessment System for Electronic Components (IECQ-CECC) - Rules of procedure - Part 2: Documentation, concerning a new clause 5, Regulations for component specifications and assessment specifications (fast track)

QC 001002-4 AMD 2-2004 IEC电子元器件质量评定体系.程序规则.第4部分:航空电子评定项目要求,关于认证维护的监督计划

This standard is IEC Quality Assessment System for Electronic Components (IECQ-CECC) - Rules of procedure - Part 4: Avionics assessment program requirements, concerning the surveillance plan for maintenance of approval; Amendment 1.

IEC Quality Assessment System for Electronic Components (IECQ-CECC) - Rules of procedure - Part 4: Avionics assessment program requirements, concerning the surveillance plan for maintenance of approval

QC 001002-3 AMD 2-2004 IEC电子元器件质量评定体系.程序规则.第3部分:关于第2条机构认证要求的认证程序

IEC Quality Assessment System for Electronic Components (IECQ-CECC) - Rules of procedure - Part 3: Approval procedures, concerning clause 2, Requirements for the approval of an organization

BS EN 62137:2004 环境和耐用试验.区域阵列式包装件表面安装板的试验方法FBGA、BGA、FLGA、LGA、SON和QFN

This International Standard specifies the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages and peripheral terminal type packages. This standard tests for durability against mechanical and thermal stress received during or after the mounting process of discrete semiconductor devices and of integrated circuits (hereinafter both referred to as semiconductor devices) used mainly for industrial and consumer use equipment. The test method specified in this standard is an integrated one by including the evaluation method of mounting methods, mounting conditions, printed circuit boards, soldering materials, and so on. It does not specify the evaluation method of the individual semiconductor devices. Mounting conditions, printed wiring boards, soldering materials, and so on significantly affect the result of the test specified in this standard. Therefore, the test specified in this standard shall not be regarded as the one to be used to guarantee the mounting reliability of the semiconductor devices. The test method is not necessary if there is no stress (mechanical or others) from any of the tests covered in this standard.

Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

QJ 548A-2004 电子产品零件制造和机械装配通用技术要求

General technical requirements for part manufacture and mechanical assembling of electronics

DS/ES 59003:2004 电子元器件产品停产 供应商和经销商的通知

This document is applicable to suppliers and affected customers.

Product discontinuance of electronic components - Notification by suppliers and distributors

KS C IEC 60695-1-2-2004(2014) 着火危险试验第1－2部分:电工产品着火危险评定要求和试验规范编制导则电子元器件导则

Fire hazard testing－Part 1－2：Guidance for the preparation of requirements and test specifications for assessing fire hazard of electrotechnical products－Guidance for electronic components

KS C IEC 60695-1-2:2004 火灾危险试验.第1部分:电工产品火灾危险评定技术要求和试验规范制订指南.第2节:电子元件的指南

전기 부품의 화재 위험성 시험은 다음과 같이 특징 지을 수 있다. -전기 부품은 많

Fire hazard testing－Part 1－2：Guidance for the preparation of requirements and test specifications for assessing fire hazard of electrotechnical products－Guidance for electronic components

LST EN 60286-6-2004 用于自动处理的组件包装 第6部分：表面贴装元件的散装箱包装（IEC 60286-6:2004）

Packaging of components for automatic handling. Part 6: Bulk case packaging for surface mounting components (IEC 60286-6:2004)

DS/EN 61360-2/A1:2004 电气元件相关分类方案的标准数据元素类型 第2部分：EXPRESS 字典方案

This part of IEC 61360 presents a common ISO/IEC dictionary schema based on the intersection of the scopes of two base standards IEC 61360-1 and ISO 13584-42. The presented EXPRESS model represents a common formal model for the two standards and facilitates a harmonization of both. The IEC 61360-2 standard forms the master document. ISO 13584-42 contains a copy of the IEC 61360-2 EXPRESS model in an informativ annex. This standard provides a formal model for data according to the scope as given in the publications cited above, and thus provides a means for the computer-sensible representation and exchange of such data.

Standard data element types with associated classification scheme for electric components - Part 2: EXPRESS dictionary schema

DLA MIL-PRF-32159 SUPP 1-2004 空间级高性能最佳性 工业零OHM膜固定芯片电阻 常规

This supplement forms a part of MIL-PRF-32159 dated 1 July 2004.

RESISTORS, CHIP, FIXED, FILM, ZERO OHM, INDUSTRIAL, HIGH RELIABILITY, SPACE LEVEL, GENERAL SPECIFICATION FOR

KS C 6430-2004(2020) 通则可靠性保证的电子元件

General rules for reliability assured electronic components

KS C 6430-2004 保证电子元器件可靠性的通则

이 규격은 전자 부품(이하 부품이라 한다.) 중에서 특히 신뢰성 보증이 요구되는 부품에

General rules for reliability assured electronic components

DS/EN 60286-5:2004 自动处理元件的包装 第5部分：矩阵托盘

This part of IEC 60286 describes the common dimensions, tolerances and characteristics of the tray. It includes only those dimensions which are essential for the handling of the trays for the stated purpose and for placing or removing components from the trays.

Packaging of components for automatic handling - Part 5: Matrix trays

DS/EN 60286-6:2004 自动处理元件的包装 第6部分：表面安装元件的散装箱包装

This part of IEC 60286 is applicable to bulk case packaging capable of containing surface mounting components. The bulk case is designed for transport and storage of components and the supply of components directly or by an appropriate feeder to the placement machine. The bulk case is attached to the automatic handling machine by means of a coupling interface.

Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components

LST EN 61360-2-2002/A1-2004 标准数据元素类型和相关的电气元件分类方案 第2部分：EXPRESS 字典模式（IEC 61360-2:2002/A1:2003）

Standard data element types with associated classification scheme for electric components. Part 2: EXPRESS dictionary schema (IEC 61360-2:2002/A1:2003)

IPC TM-650 2.5.7-2004 介电 修订版D

Dielectric Withstanding Voltage, PCB Revision D

Dielectric Withstanding Voltage, PCB Revision D