31.020 电子元器件综合 标准查询与下载

JB/T 8205-1999 廉金属铠装热电偶电缆

本标准规定了五种廉金属铠装热电偶电缆的产品分类、技术条件、试验方法和检验规则。 本标准适用于偶丝为镍铬-镍硅、镍铬硅-镍硅镁、镍铬-铜镍、铁-铜镍、铜-铜镍的铠装热电偶电缆。对于多芯或单芯的廉金属铠装热电偶电缆本标准的某些具体规定（例如：尺寸）可以不采用。 本标准不适用于贵金属铠装热电偶电缆和核场用铠装热电偶电缆。

Sheathed base metal thermocouple cables

BS IEC 61340-5-1:1998 静电学.电子设备的静电现象的防护.一般要求

This standard specifies the general requirements for the protection of electrostatic discharge sensitive devices (ESDS) from electrostatic discharges and fields. It applies only to the manufacture and use of electronic devices. Additional information is contained in PD IEC 61340-5-2.

Electrostatics. Protection of electronic devices from electrostatic phenomena. General requirements

QC 001004-1999 IEC电子元器件质量评定体系(IECQ).规范表

IEC Quality Assessment System for Electronic Components (IECQ) - Specifications list

NF C90-711:1999 表面安装技术.第2部分:表面安装装置(SMD)的运输和存储条件.应用指南(欧洲标准EN 61760-2)

Surface mounting technology. Part 2 : transportation and storage conditions of surface mounting devices (SMD). Application guide.

CEA-633.10-1999 EIA-600同一规范介绍

This standard is concerned with conformance of an implementation to the associated protocol specifications contained in EIA-600. A dual audience is expected for this standard. The first is laboratories that may be interested in acting as conformance testing agencies. Such agencies are tasked with converting these requirements into a hardware/software test system. The CEBus Industry Council (CIC) has been charged with protecting trade and service marks associated with EIA-600. As such, CIC manages the conformance testing process for the purpose of product certification. The second audience is the set of designers of EIA-600 compatible products. Any designer of compatible products should understand the importance of the tests described in this standard, as they relate to implementing EIA-600. The second group should read this standard while considering whether its hardware and/or software implementation is likely to pass the stated tests.

Introduction to EIA-600 Conformance Specification

SJ/T 11197-1999 环氧模塑料

本标准规定了半导体工业用环氧模塑料的分类，要求，试验方法，检验规则及标志、包装、运输、贮存。 本标准适用于半导体工业中封装分立器件、中小规模集成电路、大规模集成电路、超大规模集成电路、特大规模集成电路等用环氧模塑料。

Epoxy molding compounds

SJ/T 11200-1999 环境试验 第2部分：试验方法 试验Td：表面组装元器件的可焊性、金属化层耐熔蚀性和焊接热

本标准等同采用国际电工委员会IEC68-2-58《环境试验 第2部分：试验方法 试验 Td：表面组装器件的可焊性、金属化层耐熔蚀性和耐焊接热》(1989年第1版)。

Environmental tests Part 2 Test methods - Test Td: Solderability, resistance to dissolution of metallization and soldering heat of surface mounting components

CEA-600.10-1999 CEBus标准的介绍

The EIA-600 specification covers:The overall topology of the EIA-600 network and the detailed topology for each individual medium used.

Introduction to the CEBus Standard

CEA-709.3-1999 自由拓扑双绞线信道规范

This standard was developed under the auspices of the CEMA Technology & Standards R-7.1 HCS1 Subcommittee.

Free-Topology Twisted-Pair Channel Specification

ASTM F1467-99(2005)e1 微电子装置的电离辐射效应试验中 X 射线测试仪(近似等于10 keV 辐射量子)的使用的标准指南

Electronic circuits used in many space, military and nuclear power systems may be exposed to various levels of ionizing radiation dose. It is essential for the design and fabrication of such circuits that test methods be available that can determine the vulnerability or hardness (measure of nonvulnerability) of components to be used in such systems. Manufacturers are currently selling semiconductor parts with guaranteed hardness ratings, and the military specification system is being expanded to cover hardness specification for parts. Therefore test methods and guides are required to standardize qualification testing. Use of low energy (≈10 keV) X-ray sources has been examined as an alternative to cobalt-60 for the ionizing radiation effects testing of microelectronic devices (3, 4, 5, 6). The goal of this guide is to provide background information and guidance for such use where appropriate. Note 38212;Cobalt-60The most commonly used source of ionizing radiation for ionizing radiation (“total dose”) testing is cobalt-60. Gamma rays with energies of 1.17 and 1.33 MeV are the primary ionizing radiation emitted by cobalt-60. In exposures using cobalt-60 sources, test specimens must be enclosed in a lead-aluminum container to minimize dose-enhancement effects caused by low-energy scattered radiation (unless it has been demonstrated that these effects are negligible). For this lead-aluminum container, a minimum of 1.5 mm of lead surrounding an inner shield of 0.7 to 1.0 mm of aluminum is required. (See 8.2.2.2 and Practice E1249.) The X-ray tester has proven to be a useful ionizing radiation effects testing tool because: It offers a relatively high dose rate, in comparison to most cobalt-60 sources, thus offering reduced testing time. The radiation is of sufficiently low energy that it can be readily collimated. As a result, it is possible to irradiate a single device on a wafer. Radiation safety issues are more easily managed with an X-ray irradiator than with a cobalt-60 source. This is due both to the relatively low energy of the photons and due to the fact that the X-ray source can easily be turned off. X-ray facilities are frequently less costly than comparable cobalt-60 facilities. The principal radiation-induced effects discussed in this guide (energy deposition, absorbed-dose enhancement, electron-hole recombination) (see Appendix X1) will remain approximately the same when process changes are made to improve the performance of ionizing radiation hardness of a part that is being produced. This is the case as long as the thicknesses and compositions of the device layers are substantially unchanged. As a result of this insensitivity to process variables, a 10-keV X-ray tester is expected to be an excellent apparatus for process improvement and control. Several published reports have indicated success in intercomparing X-ray and cobalt-60 gamma irradiations using corrections for dose enhancement and for electron-hole recombination. Other reports have indicated that the present understanding of the physical effects is not adequate to explain experimental results. As a result, it is not fully certain that the differences between the effects of X-ray and cobalt-60 gamma irradiation are adequately understood at this time. (See 8.2.1 and Appendix X2.) Because of this possible failure of understanding of the photon energy dependence of radiation effects, if a 10-keV X-ray tester is to be used for qualification testing or lot acceptance testing, it is recommended that such tests should ..........

Standard Guide for Use of an X-Ray Tester ([approximate]10 keV Photons) in Ionizing Radiation Effects Testing of Semiconductor Devices and Microcircuits

KS C 0235-1998 编带电子元件的（表面安装部件）

PACKAGING OF ELECTRONIC COMPONENTS ON CONTINUOUS TAPES (SURFACE MOUNTING DEVICES)

DS/EN 61709:1998 电子元件-可靠性-故障率和转换应力模型的参考条件

This document gives guidance on the use of failure rate data for the reliability prediction of components in electronic equipment. Reference conditions for failure rate data are specified, so that data from different sources can be compared on a uniform basis. If failure rate data are given in accordance with this document then no additional information on the specified conditions is required.

Electronic components - Reliability - Reference conditions for failure rates and stress models for conversion

DS/EN 160200-1:1998 分规范：质量评估的微波模块化电子单元 第1部分：能力批准程序

This CECC sectional specification in conjunction with the generic specification EN 160000 describes a system for capability approval of manufactureres of microwave modular electronic units (mmeu´s) which are not covered by other CECC specifications.

Sectional Specification: Microwave modular electronic units of assessed quality - Part 1: Capability approval procedure

DS/EN 160201:1998 空白详细规范：质量评估的微波模块化电子单元 能力批准

The document defines the requirements for a blank detail specification (BDS) and includes, as examples, formats for Customer's Detail Specification (CDS) and detail specification for Standard Catalogues Items.

Blank detail specification: Microwave modular electronic units of assessed quality - Capability Approval

NF C20-343:1998 电子元件.可靠性.换算用失效率和应力模型的基准条件

Electronic components. Reliability. Reference conditions for failure rates and stress models for conversion.

QC 001004-1998 电子元器件IEC质量评定体系.规范表.1998-06的信息内容

IEC quality assessment system for electronic components (IECQ) - Specifications list - Information current to 1998-06

QC 001005-1998 经IECQ体系(包括ISO 9000)认可的企业、产品和服务的登记表

Register of firms, products and services approved under the IECQ system, including ISO 9000

IEEE 1332-1998 电子系统和设备开发与生产的可靠性程序

Encouracges suppliers and customers to cooperatively integrate their reliability processes.

Standard Reliability Program for the Development and Production of Electronic Systems and Equipment

QC 001002-2-1998 电子元器件IEC质量评定体系.程序规则.第2部分:文献工作

IEC Quality Assessment System for Electronic Components (IECQ) —1 Standards and specifications for Qualification Approval and Capability Approval 2 Certificates of approval and attestation of conformity. 3 Regulations for Process Assessment Schedules (PASs). 4 Regulations for Technology Approval Schedules (TASs). Rules of Procedure Part 2: Documentation

IEC quality assessment system for electronic components (IECQ) - Rules of procedure - Part 2: Documentation

QC 001002-1-1998 电子元器件IEC质量评定体系.程序规则.第1部分:管理

IEC Quality Assessment System for Electronic Components (IECQ) —Rules of Procedure Part 1: Administration 1 Participation 2 Certification Management Committee.. 3 Inspectorate Co-ordination Committee 4 Working groups. 5 Secretariat 6 Financial administration 7 Amendments to the Rules of Procedure of the System . 8 Access to the System by manufacturers, specialist contractors, distributors and independent testing laboratories in non-participating countries 9 Arbitration and appeals.

IEC quality assessment system for electronic components (IECQ) - Rules of procedure - Part 1: Administration