31.020 电子元器件综合 标准查询与下载

QC 001003-1998 电子元器件IEC质量评定体系.指导性文件

IEC quality assessment system for electronic components (IECQ) - Guidance documents

QC 001002-3-1998 电子元器件IEC质量评定体系.程序规则.第3部分:验收程序

IEC quality assessment system for electronic components (IECQ) - Rules of procedure - Part 3: Approval procedures

QC 001001-1998 电子元器件IEC质量评定体系.基本规则

IEC quality assessment system for electronic components (IECQ) - Basic rules

CECC 40 401-801-1998 细节规格:固定的低能力非线绕表面装备(碎片) 电阻器 0,25.0,5.1.2 被替代EN 140401-801:2003

Detail Specification: Fixed Low Power Non-Wire Wound Surface Mounting (SMD) Resistors Thin Film, Rectangular Stability Classes 0,1; 0,5; 1 Superseded by EN 140401-801:2003

Detail Specification: Fixed Low Power Non-Wire Wound Surface Mounting (SMD) Resistors Thin Film, Rectangular Stability Classes 0,1; 0,5; 1 [Superseded By: CECC EN 140401-801]

QC 001006-1998 电子元器件IEC质量评定体系.参加国登记表

IEC quality assessment system for electronic components (IECQ) - Register of participating countries

ARMY MIL-HDBK-1184-1998 自动车辆电子元件防水测试

This commercial item description covers brown kraft paper used for general wrapping applications.

ELECTRICAL COMPONENTS FOR AUTOMOTIVE VEHICLES; WATERPROOFNESS TESTS

SJ 20715-1998 电子元器件用铍青铜板带材规范

本规范规定了电子元器件用铍青铜板带材的要求，质量保证规定、交货准备及有关规则。 本规范适用于军用电子元器件用铍青铜板带材。

Specification for copper-beryllium alloy plate and strip for use in electronic components

SJ 20716-1998 电子元器件用铍青铜线棒材规范

本规范规定了电子元器件用铍青铜线棒材的要求，质量保证规定、交货准备及有关规则。 本规范适用于军用电子元器件用铍青铜线棒材。

Specification for copper-beryllium alloy wire and bor for use in electronic components

SJ 51510/2-1998 8类不可扭毫米波软波导组件详细规范

Waveguide assemblies,millimeter,flexible,nontwistable,class 8,detail specification for

SJ 20470.2-1998 40PHX120型波导转换驱动器详细规范

Driver of waveguide switch type 40PHX120,detail specification for

ANSI/EIA 601-A:1998 在NECQ系统中电子元件性能鉴定的一般用程序

Specifies requirements for the approval and maintenance of a manufacturer's capability and the procedures for the test and release of electronic components manufactured under capability approval. Also includes requirements for generic specifications that invoke this standard.

General Procedures for Capability Approval of Electronic Components in the NECQ-System

IPC TM-650 2.5.5.5-1998 修订版C,在x波段,介电常数和损失正切(介电常数和耗散因子)的带状线测试

Stripline Test for Permittivity and Loss Tangent (Dielectric Constant and Dissipation Factor) at X-Band Revision C

Stripline Test for Permittivity and Loss Tangent (Dielectric Constant and Dissipation Factor) at X-Band Revision C

IPC TM-650 2.5.5.5.1-1998 14千兆赫电路板材料的相对复杂介电常数带状线测试

Stripline Test for Complex Relative Permittivity of Circuit Board Materials to 14 GHz

Stripline Test for Complex Relative Permittivity of Circuit Board Materials to 14 GHz

CEA-600.35-1998 射频物理层和介质规格

This document is the preliminary specification for the CEBus Radio Frequency (RF) Physical Layer and Medium portion of the Physical Layer and Medium specifications of EIA-600. Its purpose is to present all of the information necessary for the development of a RF physical layer for a CEBus device. This is one of a series of documents covering various media that comprise the CEBus standard.

RF Physical Layer and Medium Specification

CEA-600.34-1998 红外物理层和介质规格

This document is the preliminary specification for the CEBus Infrared (IR) Physical Layer and Medium portion of the Physical Layer and Medium specifications of EIA-600.

IR Physical Layer and Medium Specification

DS/EN 160000+A1:1998 通用规范：模块化电子单元（MEU）

This document is a generic specification within the CECC System for electronic components of assessed quality, which prescribes the requirements for the capability approval of manufacturers of Modular Electronic Units (MEUs).

Generic specification: Modular electronic units (MEUs)

IPC TM-650 2.5.5.9-1998 1兆赫到1.5千兆赫平行板,介电常数和损耗切线

This document covers guidelines for selecting electrically conductive adhesives for use in assembly of components to printed circuit boards (PCB) or similar wiring interconnect systems. The focus is on the use of adhesives as solder alternatives. The process discussion attempts to stay within the bounds of the existing solder assembly infrastructure as much as possible. Both major types of adhesives, isotropic (conducting equally in all directions) and anisotropic (unidirectional conductivity), are covered. The two major divisions of polymer adhesives, thermosets and thermoplastics, are described.

Permittivity and Loss Tangent, Parallel Plate, 1 MHz to 1.5 GHz

IPC TM-650 5.5.2.3-1998 试验方法2.5.17体积电阻率和外部电阻

This test describes a procedure which may be conducted to determine if a printed wiring board is constructed to withstand the dynamic vibrational stresses that may be encountered during field service. This test method provides specific parameters for one application in order to present the proper procedures. Specific test conditions must be agreed upon by the customer and the vendor.

Test Method 2.5.17 Volume Resistivity and Surface Resistance

IPC TM-650 5.5.4.4-1998 试件B-附着力、钝化、介电性、真空除气

This test measures changes in resistance of plated-through hole barrels and internal layer connections as holes are subjected to thermal cycling. Thermal cycling is produced by the application of a current through a specific coupon configuration.

Test Coupon B - Adhesion, Passivation, Dielectric Resistance, and Outgassing

IPC TM-650 5.5.2-1998 IPC-TM-650插图 修订本C

This test method is to determine the physical endurance of applied polymer solder mask to sudden changes of high and low temperature excursions to cause physical fatigue.

IPC-TM-650 Artwork Revision C