31.020 电子元器件综合 标准查询与下载

ANSI/EIA 700D000:1997 已认证质量的不连续触点的分规范

Applies to discrete contact components for use in direct current and analog applications for frequencies below 3 mhz and in digital applications requiring higher data rate frequencies.

Sectional Specification for Discrete Contacts of Certified Quality

ANSI/EIA 724:1997 产品寿命周期数据模式

Defines a product life cycle curve model for use by the electronics industry to standardize the terms and definitions used to describe the life cycle status of a product.

Product Life Cycle Data Model

SJ/T 11144-1997 电子产品分类与代码

本标准规定了电子产品的分类与代码。电子产品包括：电子系统、雷达、导航、电子对抗、通信、广播电视、电子计算机、电子医疗及电子仪器等设备；电阻器、电容器、电感器、接插件、印制板、开关、变压器和继电器等元件；电子管、半导体分立器件、半导体集成电路和微型组件等器件；以及电子材料、电子工业专用设备及行业电子产品等。 本标准适用于电子工业经济信息管理信息交换及经济统一核算，供科研、生产、规划、计划、统计、会计、业务等工作使用。 本标准是电子工业经济信息系统的重要基础标准，是各电子经济信息系统进行信息交换的共同语言。

Classification and codes for electronic products

CEA-633.37-1997 符号编码子层物理层一致性

This portion of the conformance standard specifies tests to determine conformance of a Node's Symbol Encoding Sublayer to IS-60. Part One of this standard provides an overview of the conformance philosophy. The reader is urged to review that material before attempting to use the details provided in this part.

Symbol-Encoding Sublayer Physical Layer Conformance

CEA-633.38-1997 电力线(PL)和无线电频率(RF)符号编码内层物理层一致性

This portion of the conformance standard specifies tests to determine conformance of a Node's Power Line or RF Symbol Encoding Sublayer to IS-60. Part One of this standard provides an overview of the conformance philosophy. The reader is urged to review that material before attempting to use the details provided in this part.

PL and RF Symbol-Encoding Sublayer Physical Layer Conformance

CECC 40 401-803-1997 细节规格:固定的低能力非线绕表面装备(碎片) 电阻器 0,25.0,5.1.2 被替代EN 140401-801:2003

Detail Specification: Fixed Low Power Non-Wirewound Surface Mounting (SMD) Resistors Cylindrical Stability Classes 0,25; 0,5; 1; 2 Superseded by CENELEC EN 140401-803: 2002

Detail Specification: Fixed Low Power Non-Wirewound Surface Mounting (SMD) Resistors Cylindrical Stability Classes 0,25; 0,5; 1; 2

SJ 51065/6-1997 GBX007型小型化波导射频隔离器详细规范

Detail Specification for Type GBX007 Miniature Waveguide RF Isolators

BS QC 001002-2:1997 电子元器件IEC质量评定体系实施规则.第2部分:文献,包括技术认可程序规则的新项目

Rules of Procedure of the IEC Quality Assessment System for Electronic Components (IECQ) Part 2. Documentation, including a new clause on regulations for Technology Approval Schedules 1 Standards and specifications 2 Attestation of conformity 3 Regulations for Process Assessment Schedules (PAS) 4 Regulations for Technology Approval Schedules (TAS) 4.1 Definitions 4.2 Rules for the preparation TASs 4.3 Amendments to TASs 4.4 Withdrawal of TASs

Rules of procedure of the IEC quality assessment system for electronic components (IECQ) - Documentation, including a new clause on regulations for technology approval schedules

BS CECC 00806:1997 电子元器件用质量评估协调体系.CECC认可组织的全面质量管理指南

Will assist CECC approved companies, or those seeking approval, in considering the parallel implementation of CECC procedures and TQM practices.

Harmonized system of quality assessment for electronic components - Guide to total quality management (TQM) for CECC approved organizations

DD ENV 1954-1997 燃气器具中与安全相关的电子元器件的内外故障特征

Internal and external fault behaviour of safety related electronic parts of gas appliances

BS QC 001002-3:1997 电子元器件IEC质量评定体系实施规则.认可程序,包括技术认的可新项目

Rules of Procedure of the IEC Quality Assessment System for Electronic Components (IECQ) Part 3. Approval procedures, including a new clause on Technology Approval 1 Approval of a National Supervising Inspectorate 2 Requirements for the approval of an organization 3 Qualification approval of electronic ocmponents 4 Capability approval of an electronic component manufacturing facility 5 Approval of specialist contractors' processes and/or products within the electronic components industry 6 Technology approval of electronic component manufacturers 6.1 Definitions 6.2 General procedures 6.3 Management responsibility 6.4 TA requirements 6.5 Verification 6.6 Product documentation 6.7 Procedure for TA Annexes A Application for Technology Approval, B IECQ Audit. Statement of readiness Company Declaration C Form and content of a Technology Approval Declaration Document (TADD)

Rules of procedure of the IEC quality assessment system for electronic components (IECQ) - Approval procedures, including a new clause on technology approval

ARMY MIL-R-12744 A NOTICE 2-1997 M1继电器装载.组装和包装

This notice should be filed in front of MIL-R-l2744A, dated 30 December 1960

RELAY, M1, LOADING, ASSEMBLING AND PACKING

ARMY MIL-R-46903 B NOTICE 2-1997 XM10型易爆继电器装载.组装及包装

This notice should be filed in front of MIL-R-46903BYd ated 16 August 1965 MIL-R-46903BYd ated 16 August 1965 and Validation notice 1, dated 27 August 1990 is inactive for new design and is no longer used, except for replacement purposes.

RELAY, EXPLOSIVE, XM10 LOADING, ASSEMBLING AND PACKING

BS EN 61709:2000 电子器件.可靠度.失效率的参考条件和转换的应力模型

This International Standard gives guidance on the use of failure rate data for the reliability prediction of components in electronic equipment. Reference conditions for failure rate data are specified, so that data from different sources can be compared on a uniform basis. If failure rate data are given in accordance with this standard then no additional information on the specified conditions is required. The stress models described in this standard should be used as a basis for conversion of the failure rate data at reference conditions to the actual operating conditions. Conversion of failure rate data are only permissible within the specified functional limits of the components (see Annex A).

Electronic components - Reliability - Reference conditions for failure rates and stress models for conversion

BS EN 61709:1997 电气部件 可靠性 故障率和应力模型转换的参考条件

Electronic components. Reliability. Reference conditions for failure rates and stress models for conversion

ARMY MIL-R-46450 NOTICE 2-1997 M4继电器装载.组装及包装

This notice should be filed in front of MIL-R-46450(AR) dated 30 December 1960

RELAY, M4, LOADING, ASSEMBLING AND PACKING

ARMY MIL-R-46448 NOTICE 2-1997 M2继电器装载.组装及包装

This notice should be filed in front of MIL-R-46448(AR) dated 30 December 1960

RELAY, M2, LOADING, ASSEMBLING& PACKING

ARMY MIL-R-46449 NOTICE 2-1997 M3继电器装载.组装及包装

This notice should be filed in fiont of MIL-R-46449(AR) dated 30 December 1960

RELAY, M3, LOADING, ASSEMBLING AND PACKING

ARMY MIL-R-46451 NOTICE 2-1997 M5继电器装载.组装及包装

This notice should be filed in front of MIL-R-4645 1(AR) dated 30 December 1960

RELAY, M5, LOADING, ASSEMBLING& PACKING

ARMY MIL-R-46453 D NOTICE 2-1997 M7继电器零件装载.组装及包装

This notice should be filed in front of MIL-R46453D(AR) dated 14 February 1975

RELAY, M7, PARTS FOR LOADING, ASSEMBLING AND PACKING