31.180 印制电路和印制电路板 标准查询与下载

EN IEC 61189-5-504:2020 电气材料、印制板和其他互连结构和组件的测试方法 第 5-504 部分：材料和组件的通用测试方法 过程离子污染测试（PICT）

IEC 61189-5-504:2020 is a test method designed to determine the proportion of soluble ionic residues present upon a circuit board, electronic component or assembly. The conductivity of the solution used to dissolve the ionic residues is measured to evaluate the level of ionic residues.

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)

IEC 61189-5-504:2020 电气材料、印制板和其他互连结构和组件的试验方法第5-504部分:材料和组件的一般试验方法过程离子污染试验

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination

T/GDES 38-2020 挠性印制线路板绿色制造工艺评价方法

4 工艺流程描述 5 评价内容 5.1 基本要求 5.2 评价指标要求 5.3 评价工艺流程要求 6 评价方法

Evaluation method of green manufacturing process for flexible printed circuit board

KS C IEC 61249-5-4-2019

KS C IEC 61249-7-1-2019

KS C IEC 61249-2-13-2019

KS C IEC 61249-5-1-2019

KS C IEC 61188-1-2-2019

KS C IEC 61189-1-2019

KS C IEC 61249-2-12-2019

KS C IEC 60326-10-2019

KS C IEC 61188-1-1-2019

EN IEC 62878-1:2019 器件嵌入装配技术 第1部分：器件嵌入基板的通用规范

IEC 62878-1:2019(E) specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3. This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components. The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

T/ZZB 1378-2019 单、双面碳膜印制板

本标准规定了单面和双面碳膜印制板的术语和定义、基本要求、技术要求、试验方法、检验规则、标志、包装、运输和贮存以及质量承诺。 本标准适用于刚性单面和双面碳膜印制板（以下简称“碳膜板”）。

Single or double sided printed circuit board with carbon conductor

EN IEC 62878-2-5:2019 器件嵌入装配技术 第 2-5 部分：指南 器件嵌入基板的 3D 数据格式的实现

IEC 62878-2-5:2019 specifies requirements based on XML schema that represents a design data format for device embedded substrate, which is a board comprising embedded active and passive devices whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material. This data format is to be used for simulation (e.g. stress, thermal, EMC), tooling, manufacturing, assembly, and inspection requirements. Furthermore, the data format is used for transferring information among printed board designers, printed board simulation engineer, manufacturers, and assemblers. IEC 62878-2-5:2019 applies to substrates using organic material. It neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as M-type business model in IEC 62421.

Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate

EN IEC 61188-6-4:2019 印制板和印制板组件-设计和使用-第 6-4 部分：焊盘图案设计-从焊盘图案设计的角度对表面安装元件（SMD）尺寸图的一般要求

IEC 61188-6-4:2019 specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design. The purpose of this document is to prevent land pattern design issues caused by lack of information and/or misuse of the information from SMD outline drawing as well as to improve the utilization of IEC 61188 series. This document is applicable to the SMD of semiconductor devices and electrical components.

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design

IEC TR 61189-5-506:2019 电气材料的试验方法 印制板和其他互连结构及组件.第5-506部分:材料和组件的一般试验方法.根据IEC 61189-5-501 使用细间距试验结构进行焊剂表面绝缘电阻（SIR）试验的相互比较评估

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - An intercomparison evaluatio

T/CPCA 4309.3-2019 印制板制造用刷辊 第3部分：尼龙针刷辊

本标准规定了印制板制造过程中使用的尼龙针刷辊（含磨料或不含磨料）的结构与分类、技术要求、检验方法、检验规则、标志、包装与贮存相关要求。        本标准适用于印制板制造过程中使用的尼龙针刷辊。

Brush for printed board manufacture— Part 3: Nylon bristle brush

IEC 61188-6-4:2019 印制板和印制板组件.设计和使用.第6-4部分:版图设计.从版图设计的角度看表面安装组件（SMD）尺寸图的一般要求

This part of IEC 61188 specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design. The purpose of this document is to prevent land pattern design issues caused by lack of information and/or misuse of the information from SMD outline drawing as well as to improve the utilization of IEC 61188 series. This document is applicable to the SMD of semiconductor devices and electrical components.

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of l

T/CPCA 4310-2019 印制电路板用刀具套环及其应用规范

本规范规定了印制电路板用刀具套环（简称PCB刀具套环）及其在印制电路板用刀具（简称PCB刀具）上的应用要求、检验方法、检验规则以及包装、运输、贮存。 本规范PCB刀具套环只适用于标准柄径为3.175 mm的铣刀、钻头、槽钻三种印制电路板用刀具。

Specification of cutting tools ring for printed circuit board and its application