31.180 印制电路和印制电路板 标准查询与下载

T/ZZB 1017-2019 银浆碳膜双面结合印制板

本标准规定了银浆碳膜双面结合印制板的术语和定义、基本要求、技术要求、试验方法、检验规则、标志、包装、运输和贮存以及质量承诺。 本标准适用于使用在一般消费类电子产品（如电话机、收录机、电视机以及空调的遥控器、低压控制板、仪表盘等）中的银浆碳膜双面结合印制板（以下简称“印制板”）。

Silver through hole PCB with carbon printed

T/ZZB 0831-2018 聚四氟乙烯基材的高频印制电路板

本标准规定了聚四氟乙烯基材的高频印制电路板的术语和定义、基本要求、技术要求、试验方法、检验规则、标志、包装、运输及贮存、质量承诺。 本标准适用于通讯电子、汽车电子、5G通信、电子对抗等领域的聚四氟乙烯基材的高频印制电路板（以下简称“印制电路板”）。

Polytetrafluoroethylene based high frequency printed circuit board

IEC 62899-201:2016+AMD1:2018 CSV 印刷电子产品第201部分:材料基板

Printed electronics - Part 201: Materials - Substrates

IEC 62899-201:2016/AMD1:2018 修改件1.印刷电子产品.第201部分:材料.基板

Amendment 1 - Printed electronics - Part 201: Materials - Substrates

BS EN IEC 61189-2-630:2018 电气材料、印刷板和其他互连结构和组件的测试方法 互连结构材料的测试方法 压力容器调质后的吸湿率

What is BS EN IEC 61189 ‑ 2 ‑ 630 - Test methods for materials for interconnection structures about?      BS EN IEC 61189 ‑ 2 ‑ 630 is an international standard that discusses test methods for electric materials, printed board and other interconnection structures, and assemblies   BS EN IEC 61189 ‑ 2

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Test methods for materials for interconnection structures. Moisture absorption after pressure vessel conditioning

T/CPCA 4107-2018 印制电路用高反射型覆铜箔层压板

4.1 名称：印制电路用高反射型覆铜箔层压板  4.2范围：规定了印制电路用高反射型覆铜箔层压板的产品型号、结构和材料、要求、试验方法、质量保证、包装、标志、运输及贮存。适用于高亮度LED用印制板及封装印制板。  4.3 高反射型覆铜箔层压板：定义为接收态时反射率≥80% 4.4 产品结构：高反射型覆铜板是由绝缘粘结层（由树脂体系、增强材料构成）、单面或双面覆铜箔而成。  4.5 性能要求主要规定了：  4.5.1 外观要求  4.5.2 尺寸要求包括：长度、宽度、厚度、厚度公差，弓曲扭曲及垂直度  4.5.3 化学性能要求包括：燃烧性，热应力，玻璃化温度，热分层时间，Z轴热膨胀系数及可焊性  4.5.4 物理性能要求包括：剥离强度，反射率，白度，击穿电压，耐电压，体积电阻率，表面电阻率及弯曲模量  4.5.5 环境要求包括：卤素含量及吸水率  4.5.6 试验方法包括：反射率、白度参见规范性附录A及其他试验方法见GB/T4722-2017  4.5.7  质量保证要求 4.5.8 包装、运输和贮存要求

High reflective copper clad laminates for printed circuit board

EN IEC 61189-2-630:2018 电气材料、印制板和其他互连结构和组件的试验方法 第 2-630 部分：互连结构材料的试验方法 压力容器调节后的吸湿性

IEC 61189-2-630:2018 specifies a test method to determine the amount of water absorbed by metal-clad laminates after conditioning in a pressure vessel for 1 h, 2 h, 3 h, 4 h or 5 h.

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning

IEC 61191-1:2018 印制板组件 第1部分：通用规范 使用表面贴装和相关组装技术的焊接电气和电子组件的要求

This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes.

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

IEC 62899-202-5:2018 印刷电子 第 202-5 部分：材料 导电油墨 绝缘基板上印刷导电层的机械弯曲测试

This International Standard specifies a mechanical bending test for evaluating the electrical properties of a printed conductive layer on an insulating substrate under repeated mechanical deformation.

Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate

IEC 62899-203:2018 印刷电子 第203部分：材料 半导体油墨

This part of IEC 62899 defines terms and specifies standard methods for characterisation and evaluation. This document is applicable to semiconductor inks and semiconductive layers that are made from semiconductor inks.

Printed electronics - Part 203: Materials - Semiconductor ink

IEC 61189-2-630:2018 电气材料、印制板和其他互连结构和组件的试验方法.第2-630部分:互连结构材料的试验方法.压力容器调节后的吸湿性

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures – Moisture absorption a

IEC 62899-403-1:2018 印刷电子 第 403-1 部分：可印刷性 再现性要求 印刷机评估的基本模式

This part of 62899-403 specifies commonly-utilized basic design patterns to evaluate printing machines with pattern reproducibility from the view point of printability in the field of printed electronics. These basic patterns consist of several evaluation patterns and register marks. Printability is derived from the evaluation of the reproducibility of these printed patterns produced by the printed machine.

Printed electronics - Part 403-1: Printability - Requirements for reproducibility - Basic patterns for evaluation of printing machine

T/KDLB 002-2018 刚性印制电路板外观通用准则

本标准规定了刚性印制电路板外观通用准则的术语与定义、要求、试验方法和检验规则。 本标准适用于刚性印制电路板（以下简称PCB）外观品质的控制和验收，不适用于高频等特种印制电路板的外观品质的控制和验收。

Rigid Printed Circuit Board Appearance Common Criteria

T/KDLB 001-2018 LED灯条用印制电路板

本标准规定了LED灯条用印制电路板的术语和定义、设计基准和公差、要求、性能、试验方法、检验规则和标志、包装、运输、贮存。 本标准适用于液晶显示器、灯具、背光模组等LED灯条用印制电路板(以下简称印制板)

Printed Circuit Board for LED Light Bar

BS EN IEC 61189-5-503:2017 电气材料、印刷板和其他互连结构和组件的测试方法 材料和组件的通用测试方法 电路板的导电阳极丝 (CAF) 测试

What is BS EN IEC 61189-5-503- CAF testing of circuit board about?      BS EN IEC 61189 covers test methods for electrical materials, printed boards, and other interconnection structures and assemblies. The main objective of the IEC 61189 series is to demonstrate the reliability of laminate materials and assemblies and avoid printed circuit board failures.   BS EN IEC 61189-5-503 is an international standard for electric materials that specifies the test methods for materials and assemblies which is helpful in measuring the ionic residues which are dissolved in ionic contamination solutions.     BS EN IEC 61189-5-503 ...

Test methods for electrical materials, printed board and other interconnection structures and assemblies - General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards

EN IEC 61249-2-45:2018 印制板和其他互连结构的材料 第 2-45 部分：包覆和未包覆的增强基材 非卤化环氧化物非织造/织造无碱玻璃增强热导率（1.0W/m·K）和确定的易燃性层压板

Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Nonhalogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m K) and defined flammabilit

EN IEC 61249-2-47:2018 印刷板和其他互连结构的材料 第 2-47 部分：包覆和未包覆的增强基材 非卤化环氧化物非织造/织造无碱玻璃增强热导率（2.0W/m K）和定义的可燃性层压板

Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Nonhalogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (2.0W/m K) and defined flammabilit

EN IEC 61249-2-46:2018 印刷板和其他互连结构的材料 第 2-46 部分：包层和未包层的增强基材 非卤化环氧化物非织造/织造无碱玻璃增强热导率（1.5W/m·K）和定义的可燃性层压板

Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Nonhalogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.5W/m K) and defined flammabilit

ASTM F3290-17 薄膜开关或印刷电子装置处理和使用到其最终支撑结构的标准指南

1.1 This guide covers proper handling and application of a flexible circuit membrane switch, or printed electronic assembly to its final support structure to avoid mechanical or electrical failure. 1.2 Damage of internal tactile devices or surface mount device (SMD) components can occur with excessive flexing or bending during lamination, repositioning, from uneven support surface, air entrapment, or pressing keys when unsupported. 1.3 Design considerations and material selection can impact the membrane switch or the printed electronic device’s ability to endure the mechanical stress that can occur in handling, application and use. These should be considered as early as possible in the design phase. 1.4 Recent advancements in printed electronic polymer materials have shown increased reliability from flexing and creasing, replacing copper flex circuits in many cases. 1.5 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

Standard Guide for Handling and Application of a Membrane Switch or Printed Electronic Device to its Final Support Structure

T/CPCA 6045-2017 高密度互连印制电路板技术规范

本标准规定了高密度互连印制电路板（以下简称HDI印制板）的性能和鉴定规范。内容包括设计要求、品质要求、测试方法、包装及储存。

Specification for High Density Interconnect Printed Circuit Board