31.180 印制电路和印制电路板 标准查询与下载
共找到 1626 条与 印制电路和印制电路板 相关的标准，共 109 页
Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of
- ICS
- 31.180
- CCS
- 发布
- 2016-05-12
- 实施
3.1 Resistivity is useful to suppliers and manufacturers as follows: 3.1.1 when designing membrane switch interface circuitry, 3.1.2 when selecting the appropriate conductive material, 3.1.3 for conductive material quality verification, and 3.1.4 for conductive material cure optimization and quality control. 1.1 This test method covers the determination of the electrical resistivity of a conductive material as used in the manufacture of a membrane switch. 1.2 This test method is not suitable for measuring force sensitive conductive materials. 1.3 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard. 1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
Test Method for Determining the Electrical Resistivity of a Printed Conductive Material
- ICS
- 31.180
- CCS
- 发布
- 2016-05-01
- 实施
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cy
- ICS
- 31.180
- CCS
- L30
- 发布
- 2016-04-30
- 实施
- 2016-04-30
IEC 61189-3-719:2016 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during
- ICS
- 31.180
- CCS
- 发布
- 2016-04-08
- 实施
- 2016-05-09 (7)
IEC 60947-4-3:2014 applies to a.c. semiconductor non-motor load controllers and contactors intended for performing electrical operations by changing the state of a.c. electric circuits between the ON-state and the OFF-state. Typical applications are classified by utilization categories given in Table 2. This second edition cancels and replaces the first edition published in 1999, Amendment 1:2006 and Amendment 2:2011. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) Update of the marking requirements (6.1); b) Update of the EMC requirements (8.3.2); and c) Update of the tests requirements (9.3.1, 9.4, 9.4.1.1, 9.4.1.2, 9.4.2.1, 9.4.2.2, 9.4.2.3, 9.4.2.4, 9.4.2.6). This publication is to be read in conjunction with IEC 60947-1:2007.
Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters - AC semiconductor controllers and contactors for non-motor loads
- ICS
- 31.180
- CCS
- 发布
- 2016-04-07
- 实施
Water-based cleaning agents for electronics manufacturing
- ICS
- 31.180
- CCS
- L30
- 发布
- 2016-04-05
- 实施
- 2016-09-01
Tin slag antioxidant reducing agent
- ICS
- 31.180
- CCS
- L30
- 发布
- 2016-04-05
- 实施
- 2016-09-01
Cover plate for printed board drilling
- ICS
- 31.180
- CCS
- L30
- 发布
- 2016-04-05
- 实施
- 2016-09-01
本标准规定了电子焊接用免清洗液态助焊剂的分类、技术要求、试验方法、检验规则、标志、包装、运输及储存。本标准适用于印制板组装件及电气和电子电路接点锡焊用免清洗液态助焊剂(以下简称助焊剂)。
No-clean liquid flux
- ICS
- 31.180
- CCS
- L30
- 发布
- 2016-04-05
- 实施
- 2016-09-01
银浆贯孔印制电路板的外观要求、尺寸要求、电性能要求、机械性能与其它性能要求，以及试验方法、检验规则、包装、运输、贮存等相关要求。
Silver through-hole printed circuit board
- ICS
- 31.180
- CCS
- C3972
- 发布
- 2016-03-14
- 实施
- 2016-07-25
This part of IEC 62899 defines the terms and specifies the evaluation method for substrates used in the printing process to form electronic components/devices. This international standard is also applied to the substrates which make surface treatment in order to improve their performance.
Printed electronics - Part 201: Materials - Substrates
- ICS
- 31.180
- CCS
- 发布
- 2016-02-25
- 实施
- 2018-11-19
This part of IEC 62326 specifies the properties of the printed circuit board (hereafter described as PCB) for high-brightness LEDs. Many aspects of the PCB for high-brightness LEDs are identical with those of ordinary PCBs, therefore, some aspects of this standard also describe general aspects.
Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
- ICS
- 31.180
- CCS
- L30
- 发布
- 2016-02
- 实施
- 2016-02-05
Specifications for single and double-sided carbon film printed boards
- ICS
- 31.180
- CCS
- L30
- 发布
- 2016-01-15
- 实施
- 2016-06-01
This part of IEC 61189 specifies the test methods for thermal conductivity specific to printed circuit boards for high-brightness LEDs. The test applies to printed circuit boards for high- brightness LEDs with surface mounted LEDs or with device embedded LEDs in electronic control devices (ECDs).
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs
- ICS
- 31.180
- CCS
- L30
- 发布
- 2016-01
- 实施
- 2016-01-08
IEC 61189-3-719:2016 电气材料, 印制板和其他互连结构和组合装置的试验方法. 第3-719部分: 互连结构(印制板)的试验方法. 监测温度循环期间单面金属化通孔(PTH)的电阻变化
This part of IEC 61189 specifies a test method to monitor the resistance of single plated- through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during
- ICS
- 31.180
- CCS
- L30
- 发布
- 2016-01
- 实施
- 2016-01-08
Printed boards－Part 5：Specification for single anddouble sided printed boards with plated-through holes
- ICS
- 31.180
- CCS
- 发布
- 20151230
- 实施
- 20151230
Printed boards－Part 3：Design and use of printed boards
- ICS
- 31.180
- CCS
- 发布
- 20151230
- 实施
- 20151230
