31.180 印制电路和印制电路板 标准查询与下载

GSO IEC 61189-1:2014 电气材料、互连结构和组件的测试方法 第1部分：通用测试方法和方法

This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

GSO IEC 61249-2-34:2014 印刷板和其他互连结构的材料 第2-34部分：增强基材 包覆和未包覆 非卤化改性或未改性树脂系统 具有规定相对介电常数（等于或 .

This part of IEC 61249 specifies requirements for properties of non-halogenated epoxide woven E-glass laminate sheet of a thickness of 0,05 mm up to 3,2 mm, of defined flammability (vertical burning test), copper-clad. The glass transition temperature is defined to be 150 C minimum. The relative permittivity is equal to or less than 3,7 and the dissipation factor is equal to or less than 0,007 0 at 1 GHz. Some property requirements may have several classes of performance. The class desired should be specified in the purchase order, otherwise the default class of material will be supplied.

Materials for printed boards and other interconnecting structures - Part 2-34: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or...

GSO IEC 61249-2-12:2014 印刷板和其他互连结构的材料 第2-12部分：层压和无涂层增强基材的行业规范组 具有规定可燃性的非织造氧化物芳纶层压板 铜包层

This part of IEC 61249 gives requirements for properties of epoxide non-woven aramid copper-clad laminate of defined flammability, in thicknesses of 0,05 mm up to 6,4 mm. NOTE To designate this material, the reference: 61249-2-12-FV1-IEC-EP-AP-Cu may be used; if there is no risk of confusion, the type designation may be abbreviated to read IEC-61249-2-12-FV1.

Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad

GSO IEC 61182-1:2014 印制板 电子数据描述和传输 第1部分：数字形式的印制板描述

This standard specifies record formats used to describe printed board products with detail sufficient for tooling, manufacturing and testing requirements. These formats may be used for transmitting information between a printed board designer and a manufacturing facility. The records are also useful when the manufacturing cycle includes computer-aided processes and numerically controlled machines. The information can be used for both manual and for digital interpretation. The data may be defined in either English or SI units.

Printed boards - Electronic data description and transfer - Part 1: Printed board description in digital form

GSO IEC 61188-1-2:2014 印制板和印制板组件 设计和使用 第1-2部分：通用要求 受控阻抗

This part of IEC 61188 is intended to be used by circuit designers, packaging engineers, printed board manufacturers and procurement personnel so that all may have a common understanding of each area. The aim in packaging is to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are defined as designs in which the interconnecting properties affect circuit performance and require unique considerations

Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance

GSO IEC 61249-2-10:2014 印刷板和其他互连结构的材料 第2-10部分：包覆和未包覆的增强基材 氰酸酯、溴化环氧化物、改性或未改性、具有规定可燃性的编织 E 玻璃增强层压板（ver...

This part of IEC 61249 gives requirements for properties of cyanate ester, brominated epoxide modified or unmodified woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad, in thicknesses of 0,05 mm to 3,2 mm. The flammability rating is achieved through the use of brominated fire retardants contained as an integral part of the epoxide polymeric structure. The glass transition temperature is defined to be 160 °C minimum. Some property requirements may have several classes of performance. The class desired needs to be specified on the purchase order otherwise the default class of material may be supplied.

Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (ver...

GSO IEC 61249-5-1:2014 互连结构材料 第5部分：带涂层和不带涂层的导电箔和薄膜的分规范 第1部分：铜箔（用于制造覆铜基材）

This specification gives requirements for properties of copper foil intended for use in the manufacture of copper-clad laminated sheets and of copper-clad flexible materials, used in the manufacture of printed boards. It applies to copper foil supplied in rolls, sheets or cut panels

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)

GSO IEC 61249-2-9:2014 印刷板和其他互连结构的材料 第2-9部分：增强基材 包覆和未包覆 双马来酰亚胺/三嗪改性环氧化物或未改性、编织 E 玻璃增强层压板 具有规定的可燃性（垂直 .

This part of IEC 61249 gives requirements for properties of bismaleimide/triazine modified epoxide, or unmodified, woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad in thicknesses of 0,05 mm to 3,2 mm. The flammability rating is achieved through the use of brominated fire retardants contained as an integral part of the epoxide polymeric structure. The glass transition temperature is defined to be 160 °C minimum. Some property requirements may have several classes of performance. The class desired needs to be specified on the purchase order, otherwise the default class of material may be supplied.

Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad - Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical...

GSO IEC 61249-2-22:2014 印刷板和其他互连结构的材料 第2-22部分：涂层和非涂层增强基材 用具有规定可燃性（垂直燃烧测试）的非卤化改性氧化物编织而成的无碱玻璃增强层压板和铜涂层

This part of IEC 61249 gives requirements for properties of modified non-halogenated epoxide woven E-glass laminated sheet 0,05 mm up to 3,2 mm, of defined flammability (vertical burning test), copper-clad. The flammability rating is achieved through the use of phosphorus compounds and/or aluminium hydroxide fire retardants contained as part of the polymeric structure. The glass transition temperature is defined to be between 150 °C to 190 °C. Some property requirements may have several classes of performance. The class desired should be specified on the purchase order, otherwise the default class of material will be supplied.

Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad

GSO IEC 60194:2014 印制板设计、制造和组装 术语和定义

This International Standard defines the terminology used in the field of printed circuit boards and printed circuit board assembly products.

Printed board design, manufacture and assembly - Terms and definitions

GSO IEC 61249-2-13:2014 印刷板和其他互连结构的材料 第2-13部分：层压和无涂层增强基材的行业规范组 具有规定可燃性氰酸酯的非织造芳纶层压材料 铜涂层

This part of IEC 61249 gives requirements for properties of cyanate ester non-woven aramid copper-clad laminate of defined flammability, in thicknesses of 0,05 mm up to 6,4 mm. NOTE To designate this material, the reference: 61249-2-13-FV1 0-IEC-CE-AP-Cu may be used; if there is no risk of confusion, the type designation may be abbreviated to read IEC-61249-2-13-FV1.

Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper-clad

GSO IEC 61182-2:2014 印制板组装产品 制造描述数据和运输方法 第2部分：一般要求

This part of IEC 61182 specifies the XML Schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. This format may be used for transmitting information between a printed board designer and a manufacturing or assembly facility. The data is most useful when the manufacturing cycle includes computer-aided processes and numerical control machines. The data can be defined in either English or International System of Units (SI) units.

Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements

GSO IEC 61249-4-2:2014 印制板材料和其他互连结构 第4-2部分：未涂层预浸材料的部门规范组 用具有规定可燃性的改性或未改性聚酰亚胺编织而成的 E 型玻璃增强预浸材料

This part of IEC 61249 gives requirements for properties of prepreg that is mainly intended to be used as bonding sheets in connection with laminates according to IEC 61249-2-8 when manufacturing multilayer boards according to IEC 62326-4. This material may be also used to bond other types of laminates. Prepreg according to this standard is of defined flammability (vertical burning test). The flammability rating on fully cured prepreg is achieved through the use of brominated fire retardants contained as an integral part of the polymeric structure. After curing of the prepreg according to the supplier’s instructions, the glass transition temperature is defined as 150 °C minimum

Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability

GSO IEC 61249-8-7:2014 互连结构材料 第8部分：非导电涂层和薄膜的部门规范组 第7节：标记油墨

This specification details requirements for the qualification of marking inks used for legends and other identifications used on printed boards. Information in this specification will also provide guidance regarding the suitability of printed boards which feature marking inks. Requirements for the release of products using marking inks should be included in the customer detail specification (CDS).

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks

GSO IEC 61249-4-1:2014 印制板材料和其他互连结构 第4-1部分：无涂层预浸材料部门规范组（用于制造多层板） 具有规定可燃性的 E 型编织氧化物玻璃增强预浸材料

This part of IEC 61249 gives requirements for properties of prepreg that is mainly intended to be used as bonding sheets in connection with laminates according to IEC 61249-2-7 when manufacturing multilayer boards in line with IEC 62326-4. This material may be also used to bond other types of laminates. Prepreg according to this standard is of defined flammability (vertical burning test). The flammability rating on fully cured prepreg is achieved through the use of brominated fire retardants contained as an integral part of the polymeric structure. After lamination according to the supplier’s instructions, the glass transition temperature is defined as being 120 °C minimum.

Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability

GSO IEC 61189-3:2014 电气材料、印制板和其他互连组件和结构的试验方法 第3部分：互连结构（印制板）的试验方法

This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

GSO IEC 61249-4-11:2014 印刷板材料和其他互连结构 第4-11部分：非涂层预浸料行业规范组 具有规定可燃性的非卤化氧化物编织无碱玻璃增强预浸料

This part of IEC 61249 gives requirements for properties of prepreg that is mainly intended to be used as bonding sheets in connection with laminates according IEC 61249-2-7 when manufacturing multilayer boards according to IEC 62326-4. This material may be also used to bond other types of laminates. Prepreg according to this standard is of defined flammability (vertical burning test). The flammability rating on fully cured prepreg is achieved through the use of non-halogenated fire retardants contained as an integral part of the polymeric structure. After lamination according to the supplier’s instructions, the glass transition temperature is defined to be 120 °C minimum.

Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability

DB13/T 2124-2014 有机陶瓷基覆铜箔层压板

Organic Ceramic Based Copper Clad Laminates

SJ/T 11050-2014 多层印制板用环氧玻纤布粘结片预浸料

本标准规定了多层印制板用环氧玻纤布粘结片预浸料(以下简称粘结片)的术语和定义、分类、结构和材料、技术要求、检验规则、检验方法及标志、包装、运输及储存要求。 本标准适用于多层印制板用环氧玻纤布粘结片预浸料，本标准中粘结片也可称作预浸料。

Prepreg used as bonding sheet for multilayer printed boards.Epoxy resin-impregnated glass cloth

KS C IEC 60249-1-2014(2020) 印刷电路基材 - 第1部分:测试方法

Base materials for printed circuits — Part 1: Test methods