31.180 印制电路和印制电路板 标准查询与下载
共找到 1626 条与 印制电路和印制电路板 相关的标准，共 109 页
Materials for printed boards and other interconnecting structures. Sectional specification set for prepreg materials unclad (for the manufacture of multilayer boards). High performance non-halogenated epoxide woven E-glass prepreg of defined flammability
- ICS
- 31.180
- CCS
- L30
- 发布
- 2014-02-28
- 实施
- 2014-02-28
Materials for printed boards and other interconnecting structures. Sectional specification set for prepreg materials unclad (for the manufacture of multilayer boards). High performance epoxide woven E-glass prepreg of defined flammability (vertical burnin
- ICS
- 31.180
- CCS
- L30
- 发布
- 2014-02-28
- 实施
- 2014-02-28
Materials for printed boards and other interconnecting structures. Sectional specification set for prepreg materials unclad (for the manufacture of multilayer boards). High performance epoxide woven E-glass prepreg of defined flammability (vertical burnin
- ICS
- 31.180
- CCS
- L30
- 发布
- 2014-02-28
- 实施
- 2014-02-28
Materials for printed boards and other interconnecting structures. Sectional specification set for prepreg materials unclad (for the manufacture of multilayer boards). High performance non-halogenated epoxide woven E-glass prepreg of defined flammability
- ICS
- 31.180
- CCS
- L30
- 发布
- 2014-02-28
- 实施
- 2014-02-28
Cette partie de la CEI 61249 fournit des exigences concernant les propriétés des pré-imprégnés principalement prévus pour être utilisés en tant que feuilles de collage en relation avec des stratifiés selon la CEI 61249-2-36 durant la fabrication des cartes multicouches selon la CEI 62326-4. Les cartes multicouches constituées de ces matériaux conviennent pour des processus d'assemblage sans plomb. Ce matériau peut également être utilisé pour coller d'autres types de stratifiés.Un pré-imprégné, selon la présente norme, est d'une inflammabilité définie (essai de combustion verticale). L'inflammabilité nominale d'un pré-imprégné entièrement traité est obtenue
Materials for printed boards and other interconnecting structures - Part 4-14 : sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning
- ICS
- 31.180
- CCS
- 发布
- 2014-02-01
- 实施
- 2014-02-01
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2013); German version EN 61191-2:2013
- ICS
- 31.180
- CCS
- L30
- 发布
- 2014-02
- 实施
- 2014-02-01
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2013); German version EN 61191-1:2013
- ICS
- 31.180
- CCS
- L30
- 发布
- 2014-02
- 实施
- 2014-02-01
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys (IEC 61189-11:2013); German version EN 61189-11:2013
- ICS
- 31.180
- CCS
- J33
- 发布
- 2014-02
- 实施
- 2014-02-01
Printed circuit boards. Test Methods for Influence of chemical factors and environment
- ICS
- 31.180
- CCS
- 发布
- 2014
- 实施
- 2015-06-01
5.1 Permittivity and dissipation factor are fundamental design parameters for design of microwave circuitry. Permittivity plays a principal role in determining the wavelength and the impedance of transmission lines. Dissipation factor (along with copper losses) influence attenuation and power losses. 5.2 This test method is suitable for polymeric materials having permittivity in the order of two to eleven. Such materials are popular in applications of stripline and microstrip configurations used in the 1 to 18 GHz range. 5.3 This test method is suitable for design, development, acceptance specifications, and manufacturing quality control. Note 2: See Appendix X1 for additional information regarding significance of this test method and the application of the results. 1.1 This test method permits the rapid measurement of apparent relative permittivity and loss tangent (dissipation factor) of metal-clad polymer-based circuit substrates in the X-band (8 to 12.4 GHz). 1.2 This test method is suitable for testing PTFE (polytetrafluorethylene) impregnated glass cloth or random-oriented fiber mats, glass fiber-reinforced polystyrene, polyphenyleneoxide, irradiated polyethylene, and similar materials having a nominal specimen thickness of 1/16 in. (1.68201;mm). The materials listed in the preceding sentence have been used in commercial applications at nominal frequency of 9.68201;GHz. Note 1: See Appendix X1 for additional information about range of permittivity, thickness other than 1.68201;mm, and tests at frequencies other than 9.68201;GHz. 1.3 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard. 1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
Standard Test Method for Relative Permittivity (Dielectric Constant) and Dissipation Factor of Polymer-Based Microwave Circuit Substrates
- ICS
- 31.180
- CCS
- 发布
- 2014
- 实施
Printed circuit boards. Classification of defects
- ICS
- 31.180
- CCS
- 发布
- 2014
- 实施
- 2015-06-01
IEC 61249-4-14:2009 gives requirements for properties of prepreg that are mainly intended to be used as bonding sheets in connection with laminates according to IEC 61249-2-36 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may also be used to bond other types of laminates. Prepreg according to this standard is of defined flammability (vertical burning test). The flammability rating on fully cured prepreg is achieved through the use of brominated fire retardants contained as an integral part of the polymeric structure. After curing of the prepreg according to the supplier's instructions, the glass transition temperature is defined to be 120 °C minimum.
Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burnin...
- ICS
- 31.180
- CCS
- 发布
- 2013-12-31
- 实施
IEC/PAS 62326-14:2010(E) is applicable to device embedded substrates fabricated by embedding discrete active and passive electronic devices into an inner layer of a substrate with electric connections by vias, conductor plating, conductive paste, and printing. The device embedded substrate may be used as a substrate to mount SMDs to form electronic circuits, as conductor and insulator layers may be formed after embedding electronic devices. The purpose of this PAS is to obtain common understanding in design, fabrication and use of device embedded substrates in the industry. This PAS describes the substrate embedding devices including but not limited to module, integrated passive device (IPD), microelectrochemical systems (MEMS), discrete component formed in the fabrication process of the electronic wiring board, and sheet form component. This PAS does not specify the fabrication process of device embedded substrates, via diameter/via land diameter, conductor width/conductor spacing nor conductor line density.
Printed boards - Part 14: Device embedded substrate - Terminology / reliability / design guide
- ICS
- 31.180
- CCS
- 发布
- 2013-12-31
- 实施
GSO IEC 61249-2-37:2013 印刷板和其他互连结构的材料 第2-37部分：增强基材 包覆和未包覆 具有规定可燃性的改性非卤化环氧编织 E 玻璃层压板（垂直燃烧测试） 铜包覆用于...
IEC 61249-2-37:2008 gives requirements for properties of modified non-halogenated epoxide woven E-glass laminate sheet 0,05 mm up to 3,2 mm, of defined flammability (vertical burning test), copper-clad. The glass transition temperature is defined to be 150 °C to 200 °C.
Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for ...
- ICS
- 31.180
- CCS
- 发布
- 2013-12-31
- 实施
IEC 61249-2-33:2009 specifies requirements for properties of non-halogenated modified epoxy woven E-glass laminate sheet of a thickness of 0,05 mm up to 3,2 mm, of defined flammability (vertical burning test), copper-clad. The glass transition temperature is defined to be 150 °C minimum. The relative permittivity is equal to or less than 4,1 and the dissipation factor is equal to or less than 0,0120 at 1 GHz.
Materials for printed boards and other interconnecting structures - Part 2-33: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or...
- ICS
- 31.180
- CCS
- 发布
- 2013-12-31
- 实施
IEC 62496-3-1:2009 defines the performance of flexible optical circuit boards (FOCBs) using unconnectorized optical glass fibres for controlled environment. This standard clarifies the requirements for quality classification of the flexible OCBs incorporating optical glass fibres.
Optical circuit boards - Part 3-1: Performance standards - Flexible optical circuit boards using unconnectorized optical glass fibres
- ICS
- 31.180
- CCS
- 发布
- 2013-12-31
- 实施
IEC 61249-2-32:2009 specifies requirements for properties of modified epoxide woven E-glass laminate sheet of a thickness of 0,05 mm up to 3,2 mm, of defined flammability (vertical burning test), copper-clad. The glass transition temperature is defined to be 150 °C minimum. The relative permittivity is equal to or less than 3,7 and the dissipation factor is equal to or less than 0,0070 at 1 GHz.
Materials for printed boards and other interconnecting structures - Part 2-32: Reinforced base materials, clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or les...
- ICS
- 31.180
- CCS
- 发布
- 2013-12-31
- 实施
IEC 61249-2-36:2008 gives requirements for properties of di-functional brominated epoxide woven E-glass laminate sheet 0,05 mm up to 3,2 mm, of defined flammability (vertical burning test), copper-clad. The glass transition temperature is defined to be 120 °C minimum.
Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free asse
- ICS
- 31.180
- CCS
- 发布
- 2013-12-31
- 实施
IEC 61249-2-35:2008 gives requirements for properties of modified brominated epoxide woven E-glass laminate sheet 0,05 mm up to 3,2 mm, of defined flammability (vertical burning test), copper-clad. The glass transition temperature is defined to be 150 °C to 200 °C.
Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
- ICS
- 31.180
- CCS
- 发布
- 2013-12-31
- 实施
IEC 61249-2-38:2008 gives requirements for properties of di-functional non-halogenated epoxide woven E-glass laminate sheet 0,05 mm up to 3,2 mm, of defined flammability (vertical burning test), copper-clad. The glass transition temperature is defined to be 120 °C minimum.
Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free...
- ICS
- 31.180
- CCS
- 发布
- 2013-12-31
- 实施
