31.180 印制电路和印制电路板 标准查询与下载
共找到 1626 条与 印制电路和印制电路板 相关的标准，共 109 页
Printed boards－Part 12：Specification for mass lamination panels(semi-manufactured multilayer printed boards)
- ICS
- 31.180
- CCS
- 发布
- 20131218
- 实施
- 20131218
Printed boards－Electronic data description and transfer－Part 7：Bare board electrical test information in digital form
- ICS
- 31.180
- CCS
- 发布
- 20131218
- 实施
- 20131218
Printed boards－Part 11：Specification for flex-rigidmultilayer printed boards with through connections
- ICS
- 31.180
- CCS
- 发布
- 20131218
- 实施
- 20131218
Printed boards－Electronic data description and transfer－Part 10：Electronic data hierarchy
- ICS
- 31.180
- CCS
- 发布
- 20131218
- 实施
- 20131218
Materials for printed boards and other interconnecting structures－Part 4－11：Sectional specification set for prepreg materials, unclad－Non-halogenated epoxide, woven E-glass prepreg of defined flammability
- ICS
- 31.180
- CCS
- 发布
- 2013-12-18
- 实施
Materials for printed boards and other interconnecting structures－Part 4－12：Sectional specification set for prepreg material, unclad－Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability
- ICS
- 31.180
- CCS
- 发布
- 2013-12-18
- 实施
Material for printed boards and other interconnecting structures－Part 3-5：Sectional specification set for unreinforced base materials,clad and unclad(intended for flexible printed boards)－Transfer adhesive films
- ICS
- 31.180
- CCS
- 发布
- 2013-12-18
- 实施
Materials for printed boards and other interconnecting structure－Part 3－4：Sectional specification set for unreinforced base materials,clad and unclad(intended for flexible printed boards)－Adhesive coated flexible polyimide film
- ICS
- 31.180
- CCS
- 发布
- 2013-12-18
- 实施
Printed boards and printed board assemblies－Design and use－Part 5-3：Attachment(land/joint) considerations－Components with gull-wing leads on two sides
- ICS
- 31.180
- CCS
- 发布
- 2013-12-18
- 实施
Printed boards－Part 8：Specification for single and double sidedflexible printed boards with through connections
- ICS
- 31.180
- CCS
- 发布
- 2013-12-18
- 实施
Printed board and printed board assemblies－Design and use－Part 5-8：Attachment(land/joint) considerations－Area array components(BGA, FBGA, CGA, LGA)
- ICS
- 31.180
- CCS
- 发布
- 2013-12-18
- 实施
Base materials for printed circuits-Part 2:Specifications-Specification No.5:Epoxide woven glass fabric copper-clad laminated sheet of defined flammability(vertical burning test)
- ICS
- 31.180
- CCS
- 发布
- 2013-12-18
- 实施
Rolled copper foil for printed wiring boards
- ICS
- 31.180
- CCS
- 发布
- 2013-12-18
- 实施
Base materials for printed circuits-Part 2:Specifications- No.14:Phenolic cellulose paper copper-clad laminated sheet of defined flammability(vertical burning test), economic quality
- ICS
- 31.180
- CCS
- 发布
- 2013-12-18
- 实施
Printed boards－Part 12：Specification for mass lamination panels(semi-manufactured multilayer printed boards)
- ICS
- 31.180
- CCS
- 发布
- 2013-12-18
- 实施
Printed boards－Part 9：Specification for flexible multilayer printedboards with through connections
- ICS
- 31.180
- CCS
- 发布
- 2013-12-18
- 实施
Printed boards－Part 7：Specification for single and double sided flexibleprinted boards without through connections
- ICS
- 31.180
- CCS
- 发布
- 2013-12-18
- 实施
Materials for printed boards and other interconnecting structures－Part 2-22：Reinforced base materials clad and unclad－Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad
- ICS
- 31.180
- CCS
- 发布
- 2013-12-18
- 实施
Materials for printed boards and other interconnecting structures－Part 2－2：Reinforced base materials,clad and unclad－Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad
- ICS
- 31.180
- CCS
- 发布
- 2013-12-18
- 实施
Printed boards－Electronic data description and transfer－Part 10：Electronic data hierarchy
- ICS
- 31.180
- CCS
- 发布
- 2013-12-18
- 实施
