31.180 印制电路和印制电路板 标准查询与下载

KS C IEC 60249-3-1:2013 印制电路用基材 第3部分：印制电路用的特殊材料 第1章 制造多层印制板中用作黏结片材料的预浸材料

Base materials for printed circuits－Part 3：Special materials used in connection with printed circuits－Specification No. 1：Prepreg for use as bonding sheet material in the fabrication of multiplayer printed boards

EN 61249-4-18:2013 印刷板和其他互连结构的材料 第 4-18 部分：预浸料的分规范集，未包层（用于制造多层板） 规定易燃性的高性能环氧编织无碱玻璃预浸料（v

IEC 61249-4-18:2013 gives requirements for properties of prepreg that is mainly intended to be used as bonding sheets in connection with laminates according to IEC 61249-2-39 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may be also used to bond other types of laminates. Prepreg according to this standard is of defined flammability (vertical burning test). The flammability rating on fully cured prepreg is achieved through the use of brominated fire retardants contained as an integral part of the polymeric structure. After curing of the prepreg according to the supplier's instructions, the glass transition temperature is defined to be 170 °C minimum.

Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (v

EN 61249-4-19:2013 印刷板和其他互连结构的材料 第 4-19 部分：预浸料的分规范集，未包层（用于制造多层板） 规定的高性能非卤化环氧编织无碱玻璃预浸料

IEC 61249-4-19:2013 gives requirements for properties of prepreg that is mainly intended to be used as bonding sheets in connection with laminates according to IEC 61249-2-40 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may be also used to bond other types of laminates. Prepreg according to this standard is of defined flammability (vertical burning test). The flammability rating on fully cured prepreg is achieved through the use of non-halogenated fire retardants contained as an integral part of the polymeric structure. After curing of the prepreg according to the supplier's instructions, the glass transition temperature is defined to be 170 °C minimum.

Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined

NF C93-731*NF EN 61189-11:2013 电气材料、互连结构和组件的试验方法.第11部分:焊接合金熔化温度范围的测量

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: measurement of melting temperature or melting temperature ranges of solder alloys

IEC 61249-4-19:2013 印制板和其它互连结构用材料(用于多层板制造).第4-19部分:未包覆预浸料的分规范集.无铅组件用确定可燃性高效非卤代环氧化物编织的E玻璃预浸渍材料

This part of IEC 61249 gives requirements for properties of prepreg that is mainly intended to be used as bonding sheets in connection with laminates according to IEC 61249-2-40 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may be also used to bond other types of laminates. Prepreg according to this standard is of defined flammability (vertical burning test). The flammability rating on fully cured prepreg is achieved through the use of non-halogenated fire retardants contained as an integral part of the polymeric structure. After curing of the prepreg according to the supplier's instructions@ the glass transition temperature is defined to be 170 ??minimum.

Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non- halogenated epoxide woven E-glass prepreg of define

DIN EN 61193-3:2013 质量评估体系.第3部分:印刷电路板和层板制成品和过程产品检验用抽样方案的选择和使用(IEC 61193-3-2013).德文版本EN 61193-3-2013

Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing (IEC 61193-3:2013); German version EN 61193-3:2013

IEC 61249-4-18:2013 印制板和其它互连结构用材料 第4-18部分 未包覆预浸料的分规范集(用于多层板制造) 无铅组件用确定易燃性的环氧化物编织的E玻璃预浸渍材料(垂直燃烧试验)

This part of IEC 61249 gives requirements for properties of prepreg that is mainly intended to be used as bonding sheets in connection with laminates according to IEC 61249-2-39 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may be also used to bond other types of laminates. Prepreg according to this standard is of defined flammability (vertical burning test). The flammability rating on fully cured prepreg is achieved through the use of brominated fire retardants contained as an integral part of the polymeric structure. After curing of the prepreg according to the supplier's instructions@ the glass transition temperature is defined to be 170 ??minimum.

Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (v

BS EN 61191-2:2013 印刷电路板组件. 分规范. 表面安装焊接组件的要求

Printed board assemblies. Sectional specification. Requirements for surface mount soldered assemblies

BS EN 61191-1:2013 印刷电路板组件. 总规范. 使用表面安装和相关装配技术的焊接电气和电子组件的要求

Printed board assemblies. Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

DB32/ 2538-2013 印制电路板单位产品能源消耗限额

Energy Consumption Quotas per Unit Product of Printed Circuit Boards

DIN EN 61249-2-27:2013 印制板和其它互连结构用材料. 第2-27部分:包被和非包被增强基材. 规定的易燃性包铜的双马来酰亚胺/三嗪改良型非卤代环氧编织玻璃纤维层压板 (垂直燃烧试验) (IEC 61249-2-27-2012); 德文版本EN 61249-2-27-2013

Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning te

DIN EN 61249-2-30:2013 印制板和其它互连结构用材料.第2-30部分:包被和非包被增强基材.规定的易燃性包铜的非卤代环氧改良氰酸酯玻璃纤维层压板(垂直燃烧试验)(IEC 61249-2-30-2012).德文版本EN 61249-2-30-2013

Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad (IE

IEC 91/1142/DTS:2013 IEC/TS 62878-2-1, Ed.1: 装置内埋基板. 第2-1部分: 指南. 通用技术说明

IEC/TS 62878-2-1, Ed. 1: Device Embedded Substrate - Part 2-1: Guidelines - General description of technology

DIN EN 61249-2-40:2013 印制板和其它互连结构用材料.第2-40部分:包被和非包被增强基材.规定了易燃性的高性能非卤代环氧编织E型玻璃纤维增强层压板(垂直燃烧试验)(IEC 61249-2-40-2012).德文版本EN 61249-2-40-2013

Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad

DIN EN 61249-2-39:2013 印刷电路板和其他互连结构用材料. 第2-39部分: 包被和非包被增强基材. 无铅组件用具有限定易燃性(垂直燃烧试验)的高性能环氧和非环氧编织E型玻璃层压板(IEC 61249-2-39-2012); 德文版本EN 61249-2-39-2013

Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad

IEC 91/1144/DTS:2013 IEC/TS 62878-2-4, Ed.1: 装置内埋基板. 第2-4部分: 指南. 测试元件组(TEG)

IEC/TS 62878-2-4, Ed. 1: Device Embedded Substrate - Part 2-4: Guidelines - Test element groups (TEG)

IEC 91/1143/DTS:2013 IEC/TS 62878-2-3, Ed.1: 装置内埋基板. 第2-3部分: 指南. 设计指引

IEC/TS 62878-2-3, Ed. 1: Device Embedded Substrate - Part 2-3: Guidelines - Design Guide

DB35/T 1356-2013 多层印制板用无卤环氧玻纤布粘结片预浸料

本标准规定了多层印制板用无卤环氧玻纤布粘结片预浸料的术语和定义、型号、要求、试验方法、检验规则及标志、包装、运输和贮存等内容。 本标准适用于溴（Br）、氯（Cl）含量（质量分数）分别小于0.09%，且溴和氯总含量（质量分数）小于0.15%的多层印制板用环氧玻纤布粘结片预浸材料（以下简称粘结片 ）。

Halogen-free epoxy glass fiber cloth adhesive sheet prepreg for multilayer printed board

DB35/T 1355-2013 无卤型覆铜箔环氧玻纤布层压板

本标准规定了无卤型覆铜箔环氧玻纤布层压板的术语和定义、型号、要求、试验方法、检验规则及标志、包装、运输和贮存。 本标准适用于溴（Br）、氯（Cl）含量（质量分数）分别小于0.09%，且溴和氯总含量（质量分数）小于0.15%的无卤型覆铜箔环氧玻纤布层压板（以下简称无卤型覆铜板）。

Halogen-free copper clad epoxy fiberglass cloth laminate

DIN IEC/TS 62326-19:2013 印刷电路板.第19部分:设备嵌入式衬底.设计指南(IEC 91/1084/CD-2013)

Printed boards - Part 19: Device Embedded Substrate - Design Guide (IEC 91/1084/CD:2013)