共找到 1626 条与 印制电路和印制电路板 相关的标准,共 109 页
Printed boards - Part 19: Device Embedded Substrate - Design Guide (IEC 91/1084/CD:2013)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Measurement of melting temperature or melting temperature ranges of solder alloys
Environmental Claim Validation Procedure for Halogen Free Products
Printed boards - Part 16: Device Embedded Substrate Technology - Generics (IEC 91/1081/CD:2013)
Printed boards - Part 17: Device embedded substrates - TEG (test element group) (IEC 91/1082/CD:2013)
Quality assessment systems. Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
IEC 61189-11:2013 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus, as well as for connecting components.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
IEC 61249-2-27:2012 gives requirements for properties of bismaleimide/triazine modified with non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad in thicknesses of 0,03 mm up to 1,6
Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning te
IEC 61249-2-30:2012 gives requirements for properties of non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad in thicknesses of 0,03 mm up to 1,60 mm. The flammability rating is a
Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
IEC 61249-2-40:2012 specifies requirements for properties of modified non-halogenated epoxide woven E-glass laminated sheet of a thickness of 0,05 mm up to 3,2 mm, of defined flammability (vertical burning test), copper-clad. The glass transition temperat
Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad
IEC 61249-2-39:2012 specifies requirements for properties of modified brominated epoxide woven E-glass laminated sheet of a thickness 0,05 mm up to 3,2 mm, of defined flammability (vertical burning test), copper-clad. The glass transition temperature is d
Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad
This part of IEC 61189 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus, as well as for connecting components.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies.Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad (IE
Materials for printed boards and other interconnecting structures -- Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning t
Materials for printed boards and other interconnecting structures -- Part 2-40: Reinforced base materials clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-cla
Materials for printed boards and other interconnecting structures -- Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-cla
IEC 61249-2-39:2012 specifies requirements for properties of modified brominated epoxide woven E-glass laminated sheet of a thickness 0,05 mm up to 3,2 mm, of defined flammability (vertical burning test), copper-clad. The glass transition temperature is defined to be 170 °C minimum.
Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad
IEC 61249-2-30:2012 gives requirements for properties of non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad in thicknesses of 0,03 mm up to 1,60 mm. The flammability rating is achieved through the use of non-halogenated inorganic and/or organic compounds acting as fire retardants. These fire retardants are contained as part of polymeric structure or in addition to it. The glass transition temperature is defined to be 160 °C minimum.
Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
IEC 61249-2-27:2012 gives requirements for properties of bismaleimide/triazine modified with non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad in thicknesses of 0,03 mm up to 1,60 mm. The flammability rating is achieved through the use of non-halogenated inorganic and/or organic compounds acting as fire retardants. These fire retardants are contained as part of polymeric structure or in addition to it. The glass transition temperature is defined to be 160 °C minimum.
Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning te
IEC 61249-2-40:2012 specifies requirements for properties of modified non-halogenated epoxide woven E-glass laminated sheet of a thickness of 0,05 mm up to 3,2 mm, of defined flammability (vertical burning test), copper-clad. The glass transition temperature is defined to be 170 °C minimum.
Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad
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