31.180 印制电路和印制电路板 标准查询与下载

ANSI/ASTM D1867:2013 印制电路用镀铜热固层压板的规范

Specification for Copper-Clad Thermosetting Laminates for Printed Wiring

ANSI/UL 796-2013 印制线路板的安全性标准

Standard for Safety for Printed-Wiring Boards

ANSI/UL 796a-2013 印制线路板的安全性标准

Standard for Safety for Printed-Wiring Boards

IEC 91/1084/CD:2013 IEC/TS 62326-16, Ed. 1:印刷电路板.第19部分:设备嵌入式衬底.设计指南

IEC/TS 62326-19, Ed. 1: Printed boards - Part 19: Device Embedded Substrate - Design Guide

IEC 91/1082/CD:2013 IEC/TS 62326-17, Ed. 1:印刷电路板.第17部分:装置嵌入基体.TEG(测试元件组)

IEC/TS 62326-17, Ed. 1: Printed boards - Part 17: Device embedded substrates - TEG (test element group)

IEC 91/1081/CD:2013 IEC/TS 62326-16, Ed1 印刷电路板 第16部分 设备嵌入式衬底技术 通用术语

IEC/TS 62326-16, Ed. 1: Printed boards - Part 16: Device Embedded Substrate Technology - Generics

GOST IEC 61189-3-2013 "电气材料, 印制板和其他互连结构和组合装置的试验方法. 第3部分. 互连结构 (印制板) 的试验方法"

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Part 3. Test methods for interconnection structures (printed boards)

GOST IEC 61188-5-4-2013 印制板和印制板组件. 设计和使用. 第5-4部分. 连接 (焊盘/焊点) 考虑. 两面带有J形引线的部件

Printed boards and printed board assemblies. Design and use. Part 5-4. Attachment (land/joint) considerations. Components with J leads on two sides

GOST IEC 61188-5-3-2013 印制板和印制板组件. 设计和使用. 第5-3部分. 连接 (焊盘/焊点) 考虑. 两面带有翅形引线的部件

Printed boards and printed board assemblies. Design and use. Part 5-3. Attachment (land/joint) considerations. Components with gull-wing leads on two sides

GOST IEC 62326-4-2013 印制板. 第4部分. 层间连接件的刚性多层印刷电路板. 分规格

Printed boards. Part 4. Rigid multilayer printed boards with interlayer connections. Sectional specification

GOST IEC 61188-5-5-2013 印制板和印制板组件. 设计和使用. 第5-5部分. 连接 (焊盘/焊点) 考虑. 四面带有翅形引线的部件

Printed boards and printed board assemblies. Design and use. Part 5-5. Attachment (land/joint) considerations. Components with gull-wing leads on four sides

GOST R 55490-2013 印制板. 构建和验收通用技术要求

Printed boards. General technical requirements for the construction and acceptance

GOST IEC 61188-5-8-2013 印制板和印制板组件. 设计和使用. 第5-8部分. 连接 (焊盘/焊点) 考虑. 区域阵列部件 (BGA, FBGA, CGA, LGA)

Printed boards and printed board assemblies. Design and use. Part 5-8. Attachment (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA)

GOST R 55744-2013 印刷电路板. 物理参数的试验方法

Printed circuit boards. Physical parameters test methods

GOST R 55693-2013 刚性印制板. 技术要求

Rigid printed boards. Technical requirements

GOST IEC 62326-4-1-2013 "印制板. 第4-1部分. 层间连接件的刚性多层印刷电路板. 分规格. 第1节. 能力详细规格. 性能水平A, B和C"

Printed boards. Part 4-1. Rigid multilayer printed boards with interlayer connections. Sectional specification. Section 1. Capability Detail Specification. Performance levels A, B and C

GOST R 55491-2013 电子组件的返工, 修改和维修

Rework, modification and repair of electronic assemblies

LST EN 61182-2-2-2012 印制板组装产品 制造描述数据和传输方法 第 2-2 部分：实施印制板制造数据描述的分要求（IEC 61182-2-2:2012）

Printed board assembly products - Manufacturing description data and transfer methodology -- Part 2-2: Sectional requirements for implementation of printed board fabrication data description (IEC 61182-2-2:2012)

KS C IEC 61249-4-1-2012(2017) 印制板和其他互连结构用材料第4-1部分:非包覆预浸料分规范（多层板制造用）规定可燃性的环氧编织E玻璃预浸料

Materials for printed boards and other interconnecting structures－Part 4-1：Sectional specification set for prepreg materials, unclad(for the manufacture of multilayer boards)－Epoxide woven E-glass pre

KS C IEC 61249-3-1-2012(2022) 印制板和其他互连结构用材料第3-1部分:柔性板用覆铜层压板（胶粘型和非胶粘型）

Materials for printed boards and other interconnecting structures－Part 3-1：Copper-clad laminates for flexible boards (Adhesive and non-adhesive types)