31.180 印制电路和印制电路板 标准查询与下载
共找到 1626 条与 印制电路和印制电路板 相关的标准，共 109 页
Materials for printed boards and other interconnecting structures－Part 4-1：Sectional specification set for prepreg materials, unclad(for the manufacture of multilayer boards)－Epoxide woven E-glass pre
- ICS
- 31.180
- CCS
- 发布
- 2012-11-19
- 实施
이 표준은 비아, 도체도금, 전도성 페이스트, 인쇄 등의 방법을 통해 전자적으로 연결된 기
Printed boards－Part 14：Device embedded substrate－Terminology/reliability/design guide
- ICS
- 31.180
- CCS
- L30
- 发布
- 2012-11-19
- 实施
- 2012-11-19
이 표준은 프리프레그 특성의 요구 조건을 수록하고 있다. 프리프레그는 KS C IEC 62
Materials for printed boards and other interconnecting structures－Part 4-1：Sectional specification set for prepreg materials, unclad(for the manufacture of multilayer boards)－Epoxide woven E-glass prepreg of defined flammability
- ICS
- 31.180
- CCS
- L30
- 发布
- 2012-11-19
- 实施
- 2012-11-19
Materials for printed boards and other interconnecting structures－Part 3-1：Copper-clad laminates for flexible boards (Adhesive and non-adhesive types)
- ICS
- 31.180
- CCS
- 发布
- 2012-11-19
- 实施
이 표준은 전자부품 원점에 대한 서술 및 랜드패턴 구조에 대한 기술을 다룬다. 이 표준은
Printed boards and printed board assemblies－Design and use－Part 7：Electronic component zero orientation for CAD library construction
- ICS
- 31.180
- CCS
- L30
- 发布
- 2012-11-19
- 实施
- 2012-11-19
Printed boards and printed board assemblies－Design and use－Part 7：Electronic component zero orientation for CAD library construction
- ICS
- 31.180
- CCS
- 发布
- 2012-11-19
- 实施
Materials for printed boards and other interconnecting structures－Part 4-1：Sectional specification set for prepreg materials, unclad(for the manufacture of multilayer boards)－Epoxide woven E-glass pre
- ICS
- 31.180
- CCS
- 发布
- 2012-11-19
- 实施
Materials for printed boards and other interconnecting structures－Part 3-1：Copper-clad laminates for flexible boards (Adhesive and non-adhesive types)
- ICS
- 31.180
- CCS
- 发布
- 2012-11-19
- 实施
Printed boards and printed board assemblies－Design and use－Part 7：Electronic component zero orientation for CAD library construction
- ICS
- 31.180
- CCS
- 发布
- 2012-11-19
- 实施
Printed boards－Part 14：Device embedded substrate－Terminology/reliability/design guide
- ICS
- 31.180
- CCS
- 发布
- 2012-11-19
- 实施
本标准规定了无铅焊接用覆铜箔环氧玻纤布层压板的术语和定义、型号、要求、试验方法、检验规则及标志、包装、运输和贮存。 本标准适用于玻璃纤维布浸以环氧树脂、表面覆铜箔、经热压而成的适合于无铅焊接工艺的覆铜箔 层压板（以下简称覆箔板）。
Copper clad epoxy fiberglass cloth laminate for lead-free soldering
- ICS
- 31.180
- CCS
- L30
- 发布
- 2012-11-02
- 实施
- 2013-02-01
IEC 61182-2-2:2012 provides the information on the manufacturing requirements used for fabricating printed boards. This standard determines the XML schema details, defined in the generic standard IEC 61182-2 and some of the sectional standards that are re
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
- ICS
- 31.180
- CCS
- 发布
- 2012-09-08
- 实施
- 2012-09-08
Printed board assembly products. Manufacturing description data and transfer methodology. Sectional requirements for implementation of printed board fabrication data description
- ICS
- 31.180
- CCS
- L30
- 发布
- 2012-08-31
- 实施
- 2012-08-31
This part of IEC 61182 provides the information on the manufacturing requirements used for fabricating printed boards. This standard determines the XML schema details@ defined in the generic standard IEC 61182-2 and some of the sectional standards that are required to accomplish the focused tasks. When other standards are invoked@ their requirements become a mandatory part of the fabrication details as defined in the IEC 61182-2. The IEC 61182-2 contains all the requirements necessary to build an electronic product. The cardinality indicated in the IEC 61182-2 may be superseded by a restriction of an attribute (enumerated string ID) or indication of a requirement that is noted as being optional in the generic standard. However@ this standard renders the requirement mandatory based on the supply chain communication need. In order to assist the users of this standard@ all the applicable XML schema elements that apply to the board fabrication function are listed in Annex A. The list is grouped by topics and shows the absolute path for the elements that pertain to the focus of this standard. If the parent element is not present no children are considered in the implementation either. However@ all attributes identified for a particular element follow the cardinality of the IEC 61182-2@ unless a restriction is stated in this standard.
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
- ICS
- 31.180
- CCS
- L30
- 发布
- 2012-04
- 实施
- 2012-04-30
The following changes to UL 796 are being proposed: 1) Revise requirements for testing conditions described in Paragraph 4.2; 2) Revise the dimensions of thicknesses specified in Table 9.2; 3) Add tolerance for the width of a conductor shown in Figure 10.1; and 4) Delete Section 31.4 (HDI Thermal Cycling).
Standard for Safety for Printed-Wiring Boards
- ICS
- 31.180
- CCS
- L30
- 发布
- 2012-01-01
- 实施
The following changes to UL 796F are being proposed: 1) Revise requirements for testing conditions described in Paragraph 5.1.5.3; 2) Add tolerance for the width of a conductor shown in Figure 5.6.1; 3) Clarify sample requirements for Bond Strength Test in Paragraphs 5.6.5.2 and 5.6.5.3; 4) Add requirements for evaluating asymmetrical construction samples in Paragraphs 5.9.5.7 and 5.10.5.3; 5) Add tolerance for the width of a conductor shown in Figure 5.11.2; and 6) Add sample requirements for Flammability Tests on conductive paste material in new Section 5.15.2.
Standard for Safety for Flexible Materials Interconnect Constructions
- ICS
- 31.180
- CCS
- L30
- 发布
- 2012-01-01
- 实施
To resolve comments received by UL to the following proposal for UL 796F, which was originally published on August 26, 2011: Proposal to Add Sample Requirements for Flammability Tests on Conductive Paste Material in New Section 5.15.2.
Standard for Safety for Flexible Materials Interconnect Constructions
- ICS
- 31.180
- CCS
- L30
- 发布
- 2012-01-01
- 实施
Standard for Safety for Flexible Materials Interconnect Constructions
- ICS
- 31.180
- CCS
- L30
- 发布
- 2012
- 实施
Materials for printed boards and other interconnecting structures. Part 2-4. Reinforced base materials, clad and unclad. Polyester non-woven/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad
- ICS
- 31.180
- CCS
- 发布
- 2012
- 实施
- 2013-07-01
Materials for printed boards and other interconnecting structures. Part 2-5. Reinforced base materials, clad and unclad. Brominated epoxide cellulose paper reinforced core/woven E-glass reinforced surfaces laminated sheets of defined flammability (vertica
- ICS
- 31.180
- CCS
- 发布
- 2012
- 实施
- 2013-07-01
