31.180 印制电路和印制电路板 标准查询与下载
共找到 1626 条与 印制电路和印制电路板 相关的标准，共 109 页
GOST R IEC 61249-2-6-2012 印制板和其他互连结构用材料. 第2-6部分. 包被和非包被增强基材. 规定阻燃型铜包被的溴化环氧非编织和编织E型玻璃纤维增强叠层板材(垂直燃烧试验)
Materials for printed boards and other interconnecting structures. Part 2-6. Reinforced base materials, clad and unclad. Brominated epoxide non-woven and woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-cla
- ICS
- 31.180
- CCS
- 发布
- 2012
- 实施
- 2013-07-01
Materials for printed boards and other interconnecting structures. Part 2-2. Reinforced base materials, clad and unclad. Phenolic cellulose paper reinforced laminated sheets, copper-clad and high electrical grade
- ICS
- 31.180
- CCS
- 发布
- 2012
- 实施
- 2013-07-01
Materials for printed boards and other interconnecting structures. Part 2-4. Reinforced base materials, clad and unclad. Polyester non-woven/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad
- ICS
- 31.180
- CCS
- 发布
- 2012
- 实施
- 2013-07-01
本标准规定了挠性印制电路材料耐挠曲性的试验方法。 本试验方法适合于测试覆铜板用铜箔和挠性覆铜板的耐挠曲性。
Test method for flex resistance of flexible printed circuit materials
- ICS
- 31.180
- CCS
- L 30
- 发布
- 2011-12-25
- 实施
- 2012-03-31
本标准规定了测定覆铜箔层压板层间粘合力的试验方法，以表征覆铜箔层压板绝缘层间的粘结强度状况。本试验方法包含了T型剥离法、楔形刀口分离法、垂直拉伸法三种，其中T型剥离法为仲裁法。 本试验方法适合于以玻璃纤维布为增强体系的印制电路用覆铜箔层压板。
Test method for interlayer adhesion of copper clad laminates
- ICS
- 31.180
- CCS
- L 30
- 发布
- 2011-12-25
- 实施
- 2012-03-31
Printed board assemblies -- Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
- ICS
- 31.180
- CCS
- L30
- 发布
- 2011-12-20
- 实施
本标准规定了多层印制板用粘结片的术语和定义、型号和命名、要求、试验方法、检验规则及标志、包装、运输和贮存的要求。 本标准适用于多层印制板用粘结片。
General rules for adhesive sheets for multilayer printed boards
- ICS
- 31.180
- CCS
- L 30
- 发布
- 2011-10-28
- 实施
- 2012-02-15
Materials for printed boards and other interconnecting structures－Part 4-14：Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards)－Epoxide woven E-glass p
- ICS
- 31.180
- CCS
- 发布
- 2011-07-28
- 实施
Materials for printed boards and other interconnecting structures－Part 2-18：Reinforced base materials, clad and unclad－Polyester non-woven fibreglass reinforced laminated sheet of defined flammability
- ICS
- 31.180
- CCS
- 发布
- 2011-07-28
- 实施
Materials for printed boards and other interconnecting structures－Part 2-18：Reinforced base materials, clad and unclad－Polyester non-woven fibreglass reinforced laminated sheet of defined flammability
- ICS
- 31.180
- CCS
- 发布
- 2011-07-28
- 实施
Materials for printed boards and other interconnecting structures－Part 2-34：Reinforced base materials, clad and unclad－Nonhalogenated modified or unmodified resin system, woven E-glass laminate sheets
- ICS
- 31.180
- CCS
- 发布
- 2011-07-28
- 实施
Materials for printed boards and other interconnecting structures－Part 2-35：Reinforced base materials, clad and unclad－Modified epoxide woven E-glass laminate sheets of defined flammability (vertical
- ICS
- 31.180
- CCS
- 发布
- 2011-07-28
- 实施
Materials for printed boards and other interconnecting structures－Part 2-9：Reinforced base materials clad and unclad－Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced lami
- ICS
- 31.180
- CCS
- 发布
- 2011-07-28
- 实施
Materials for printed boards and other interconnecting structures－Part 2-32：Reinforced base materials, clad and unclad－Halogenated modified or unmodified resin system, woven E-glass laminate sheets of
- ICS
- 31.180
- CCS
- 发布
- 2011-07-28
- 实施
KS C IEC 61249 시리즈 중 이 표준은 0.05 mm에서 3.2 mm까지의 두께의
Materials for printed boards and other interconnecting structures-Part 2-32:Reinforced base materials, clad and unclad-Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3
- ICS
- 31.180
- CCS
- L30
- 发布
- 2011-07-28
- 实施
- 2011-07-28
Materials for printed boards and other interconnecting structures－Part 2-31：Reinforced base materials, clad and unclad－Halogenated modified or unmodified resin system, woven E-glass laminate sheets of
- ICS
- 31.180
- CCS
- 发布
- 2011-07-28
- 实施
이 표준은 인쇄회로기판에 대한 성능인증(CA:Capability Approval) 절차를
Printed boards－Part 1：Generic specification
- ICS
- 31.180
- CCS
- L30
- 发布
- 2011-07-28
- 实施
- 2011-07-28
KS C IEC 61249 시리즈 중 이 표준은 KS C IEC 62326-4에 따라 다층
Materials for printed boards and other interconnecting structures－Part 4-15：Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards)－Multifunctional epoxide woven E-glass prepreg of defined flammability (vertica
- ICS
- 31.180
- CCS
- L30
- 发布
- 2011-07-28
- 实施
- 2011-07-28
KS C IEC 61249 시리즈 중 이 표준은 KS C IEC 62326-4에 따라 다층
Materials for printed boards and other interconnecting structures－Part 4-14：Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards)－Epoxide woven E-glass prepreg of defined flammability (vertical burning test)
- ICS
- 31.180
- CCS
- L30
- 发布
- 2011-07-28
- 实施
- 2011-07-28
KS C IEC 61249 시리즈 중 이 표준은 0.80 mm에서 1.60 mm 두께의 폴
Materials for printed boards and other interconnecting structures－Part 2-18：Reinforced base materials, clad and unclad－Polyester non-woven fibreglass reinforced laminated sheet of defined flammability (vertical burning test), copper-clad
- ICS
- 31.180
- CCS
- L30
- 发布
- 2011-07-28
- 实施
- 2011-07-28
