31.180 印制电路和印制电路板 标准查询与下载

KS C IEC 61249-2-37-2011(2016) 印制板和其他互连结构用材料第2-37部分:包层和非包层增强基材无铅装配用包铜阻燃改性无卤环氧编织E玻璃层压板（垂直燃烧试验）

Materials for printed boards and other interconnecting structures－Part 2-37：Reinforced base materials, clad and unclad－Modified non-halogenated expoide woven E-glass laminated sheets of defined flamma

KS C IEC 61249-2-34-2011(2021) 印制板和其他互连结构用材料第2-34部分:覆铜箔和非覆铜箔增强基材非卤化改性或未改性树脂系统 规定相对介电常数（1GHz时等于或小于3.7）和可燃性（垂直燃烧试验）的编织E玻璃层压板

Materials for printed boards and other interconnecting structures－Part 2-34：Reinforced base materials, clad and unclad－Nonhalogenated modified or unmodified resin system, woven E-glass laminate sheets

KS C IEC 61249-4-16:2011 印刷电路板和其他互连结构用材料.第4-16部分:非包覆预浸料(多层板结构)的分规范集.无铅化装配用指定易燃性多功能环氧化合物编织E型玻璃预浸料(垂直燃烧试验)

KS C IEC 61249 시리즈 중 이 표준은 KS C IEC 62326-4에 따라 다층

Materials for printed boards and other interconnecting structures－Part 4-16：Sectional specification set for prepreg materials,unclad (for the manufacture of multilayer boards)－Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flamma

KS C IEC 61249-4-15:2011 印刷电路板和其他互连结构用材料.第4-15部分:非包覆预浸料(多层板结构)的分规范集.无铅化装配用指定易燃性多功能环氧化合物编织E型玻璃预浸料(垂直燃烧试验)

KS C IEC 61249 시리즈 중 이 표준은 KS C IEC 62326-4에 따라 다층

Materials for printed boards and other interconnecting structures－Part 4-15：Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards)－Multifunctional epoxide woven E-glass prepreg of defined flammability (vertica

KS C IEC 61249-2-18-2011(2016) 印制板和其他互连结构用材料第2-18部分:覆层和非覆层增强基材规定可燃性聚酯无纺布玻璃纤维增强覆铜板

Materials for printed boards and other interconnecting structures－Part 2-18：Reinforced base materials, clad and unclad－Polyester non-woven fibreglass reinforced laminated sheet of defined flammability

KS C IEC 62326-4:2011 印制电路板.第4部分:层间连接的刚性多层印制电路板分规范

이 표준은 경성 다층 기판에 적용되며 제조방법과는 무관하다. 이 표준은 구매자와 생산자 간

Printed boards-Part 4:Rigid multilayer printed boards with interlayer connections-Sectional specification

KS C IEC 62326-1-2011(2016) 印制板第1部分:总规范

Printed boards－Part 1：Generic specification

KS C IEC 61249-2-31-2011(2021) 印制板和其他互连结构用材料第2-31部分:覆铜箔和非覆铜箔增强基材卤化改性或未改性树脂系统 规定相对介电常数（1GHz时等于或小于4.1）和可燃性（垂直燃烧试验）的编织E玻璃层压板

Materials for printed boards and other interconnecting structures－Part 2-31：Reinforced base materials, clad and unclad－Halogenated modified or unmodified resin system, woven E-glass laminate sheets of

KS C IEC 61249-2-32:2011 印刷电路板和其他互连结构用材料.第2-32部分:包覆和非包覆增强基材.铜包覆限定介电常数(1GHz下≤3.7)和易燃性(垂直燃烧试验)的环氧编织E型玻璃层压板材卤化的改良或非改良树脂系统

KS C IEC 61249 시리즈 중 이 표준은 0.05 mm에서 3.2 mm까지의 두께의

Materials for printed boards and other interconnecting structures-Part 2-32:Reinforced base materials, clad and unclad-Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3

KS C IEC 61249-4-17-2011(2021) 印制板和其他互连结构用材料第4-17部分:未包覆预浸料分规范集（用于多层板的制造）无铅组装用规定可燃性的非卤化环氧编织E-玻璃预浸料（垂直燃烧试验）

Materials for printed boards and other interconnecting structures－Part 4-17：Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards)－Non-halogenated epoxide

KS C IEC 61249-2-38-2011(2021) 印制板和其他互连结构用材料第2-38部分:包层和非包层增强基材规定可燃性的包铜非卤化环氧编织E玻璃层压板（垂直燃烧试验）

Materials for printed boards and other interconnecting structures－Part 2-38：Reinforced base materials, clad and unclad－Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (ve

KS C IEC 61249-4-15-2011(2016) 印制板和其他互连结构用材料第4-15部分:非包覆预浸料分规范（多层板制造用）无铅装配用规定可燃性的多功能环氧编织E玻璃预浸料（垂直燃烧试验）

Materials for printed boards and other interconnecting structures－Part 4-15：Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards)－Multifunctional epoxide

KS C IEC 61249-2-9-2011(2016) 印制板和其他互连结构用材料第2-9部分:包层和非包层增强基材双马来酰亚胺/三嗪改性环氧或未改性编织玻璃纤维增强覆铜板

Materials for printed boards and other interconnecting structures－Part 2-9：Reinforced base materials clad and unclad－Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced lami

KS C IEC 61249-2-32-2011(2021) 印制板和其他互连结构用材料第2-32部分:覆铜箔和非覆铜箔增强基材卤化改性或未改性树脂系统 规定相对介电常数（1GHz时等于或小于3.7）和可燃性（垂直燃烧试验）的编织E玻璃层压板

Materials for printed boards and other interconnecting structures－Part 2-32：Reinforced base materials, clad and unclad－Halogenated modified or unmodified resin system, woven E-glass laminate sheets of

KS C IEC 61249-2-36:2011 印刷电路板和其他互连结构用材料.第2-36部分:包覆和非包覆增强基材.无铅组件用铜包覆的规定可燃性(垂直燃烧试验)的环氧编织E型玻璃层压板材

KS C IEC 61249 시리즈 중 이 표준은 0.05 mm에서 3.2 mm까지의 두께의

Materials for printed boards and other interconnecting structures-Part 2-36:Reinforced base materials clad and unclad-Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

KS C IEC 61249-2-18:2011 印刷电路板和其他互联结构用材料.第2-18部分:包覆和非包覆增强基材.规定了易燃性的覆铜非编织玻璃纤维增强层压板(垂直燃烧试验)

KS C IEC 61249 시리즈 중 이 표준은 0.80 mm에서 1.60 mm 두께의 폴

Materials for printed boards and other interconnecting structures－Part 2-18：Reinforced base materials, clad and unclad－Polyester non-woven fibreglass reinforced laminated sheet of defined flammability (vertical burning test), copper-clad

KS C IEC 62326-4-1-2011(2021) 印制板第4部分:带层间连接的刚性多层印制板分规范第1节:性能详细规范性能等级A、B和C

Printed boards－Part 4：Rigid multilayer printed boards with interlayer connections－Sectional specification－Section 1：Capability Detail Specification－Performance levels A, B, and C

KS C IEC 61249-2-33:2011 印刷电路板和其他互连结构用材料.第2-33部分:包覆和非包覆增强基材.铜包覆限定介电常数(1GHz下≤4.1)和易燃性(垂直燃烧试验)的环氧编织E型玻璃层压板材非卤化的改良或非改良树脂系统

KS C IEC 61249 시리즈 중 이 표준은 (수직연소시험에서) 규정된 난연성 등급을

Materials for printed boards and other interconnecting structures-Part 2-33:Reinforced base materials, clad and unclad-Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less th

KS C IEC 61249-2-38-2011(2016) 印制板和其他互连结构用材料第2-38部分:包层和非包层增强基材无铅装配用包铜规定可燃性的非卤化环氧编织E玻璃层压板（垂直燃烧试验）

Materials for printed boards and other interconnecting structures－Part 2-38：Reinforced base materials, clad and unclad－Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (ve

KS C IEC 61249-4-16-2011(2021) 印制板和其他互连结构用材料第4-16部分:非包覆预浸料分规范集（用于多层板的制造）无铅组装用规定可燃性的多功能非卤化环氧编织E-玻璃预浸料（垂直燃烧试验）

Materials for printed boards and other interconnecting structures－Part 4-16：Sectional specification set for prepreg materials,unclad (for the manufacture of multilayer boards)－Multifunctional non-halo