31.200 集成电路、微电子学 标准查询与下载
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This standard aims at giving DC interface specifications for various sets of values, where each comprises the nominal value of power supply voltage, its tolerance, and the worst-case limit values of the input and output voltages for low voltage integrated circuits. It also provides two categories of interface specification for each nominal supply voltage – normal range and wide range. The normal range is based on the nominal industry standard with typical tolerance of about 10 %. The wide range covers battery operation that extends the lower limit to a practical value at which the battery will continue to operate.
Semiconductor devices - Integrated circuits - Part 2-20: Digital integrated circuits - Family specification - Low voltage integrated circuits
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- 2014-12-25
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Scope is not provided for this standard
Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section 6: Blank detail specification for microprocessor integrated circuits
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- 2014-12-25
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This report describes the minimum number of d.c. ground terminals to be allocated to each IEC 603-2* connector used in microprocessor-based systems. This report also makes recommendations and describes restrictions for the allocation of power and ground connections when using the IEC 603-2 connector in microprocessor-based systems. This report applies to both the boards and backplane connections in microprocessor systems. Note.- The words "pin" and "terminal" are used interchangeably.
Pin allocations for microprocessor systems using the IEC 60603-2 connector
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- 2014-12-25
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This part of IEC 60748-23 applies to high quality hybrids (with films) incorporating special customer quality and reliability requirements whose quality is assessed on the basis of Qualification Approval. NOTE 1 Hybrid integrated circuits may be fully or part completed. Part completed devices are those that may be supplied to customers for further processing. NOTE 2 Test methods are selected from IEC 60748-23-1. A blank detail specification (BDS) is included to assist manufacturers and users in the preparation of detail specifications.
Semiconductor devices - Integrated circuits, Part 23-5: Hybrid integrated circuits and film structures - Manufacturing line certification - Procedure for qualification approval
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Scope is not provided for this standard
Semiconductor devices - Integrated circuits - Part 21-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedures
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This International Standard establishes the general requirements for delivery of qualified products through manufacturing line approval under the IECQ system and for registration in the Qualified Manufacturer List (QML). In this standard, the term QML is also used to designate the procedure associated with manufacturing line approval. This standard also describes procedures and requirements for the approval, qualification and registration of a manufacturing line, for maintenance of the QML, for audits and for the automatic qualification of products from the approved manufacturing line. After listing a manufacturing line on a QML, the manufacturer will continually meet or improve the established baseline of certified and qualified procedures, the TQM plan, the Technology Review Board (TRB), the status reporting and quality and reliability assurance requirements for all QML products. The standard is applicable for ISO 9000 certified manufacturers of semiconductor devices from member countries of IECQ.
Integrated circuits - Part 1: Procedures for manufacturing line approval and quality management
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This part of IEC 60748 applies to a high quality approval system for hybrid integrated circuits and film structures. This checklist is intended for the use of a hybrid microcircuit manufacturer's internal assessment team. It will provide the hybrid manufacturer and the National Supervising Inspectorate (NSI) with ongoing information on process control demonstrating compliance with IEC 60748-23-1. It is not intended to include quality system requirements.
Semiconductor devices - Integrated circuits - Part 23-3: Hybrid integrated circuits and film structures - Manufacturing line certification - Manufacturers' self-audit checklist and report
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Scope is not provided for this standard
Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 5: Blank detail specification for complementary MOS digital integrated circuits (series 4000 B and 4000 UB)
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This generic specification is applicable to film integrated circuits and to hybrid film integrated circuits (F and HFICs), both passive and active, as in IEC Publication 748-1, Chapter IV, Sub-clause 2.4. It applies also to partly-completed F and HFICs supplied to customers for subsequent processing. This specification also applies to chip carrier circuits having more than one chip, provided that they, as separate products, have been interconnected by film interconnection techniques. This specification is not intended to cover printed circuit boards but is applicable to F and HFICs which may include them.
Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
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Scope is not provided for this standard
Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits - Section 2: Blank detail specification for linear analogue-to-digital converters (ADC)
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The following items are considered to standardize the electrical modeling of input signals, output signals, power supply and ground terminals of integrated circuits, in order to provide for analysis of electrical characteristics of equipment. 1) To standardize in order to solve current problems and in order to extend capabilities of analysis, on the basis of results of the past standardization activities. 2) To define more flexible description rules for electric circuits in order to provide more accurate analysis of printed circuit board. 3) To introduce the concept of modeling levels to exchange relevant data for each application. 4) To enhance electrical modeling for packages and modules.
Logic digital integrated circuits - Specification for I/O interface model for integrated circuit (IMIC version 1.3)
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Scope is not provided for this standard
Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 9: Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories
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Scope is not provided for this standard
Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section7: Blank detail specification for integrated circuit fusible-link programmable bipolar read-only memories
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The purpose of these examinations is to check the internal materials, construction and workmanship of film and hybrid integrated circuits (F and HFICs). These examinations will normally be used prior to tapping or encapsulation to detect and eliminate the F and HFICs with internal defects that could lead to device failure in normal application. Other acceptance criteria may be agreed upon with the purchaser or supplier.
Semiconductor devices - Integrated circuits - Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits - Section 1: Requirements for internal visual examination
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- 2014-12-25
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Scope is not provided for this standard
Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 10: Blank detail specification for integrated circuit dynamic read/write memories
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This sectional specification applies to encapsulated semiconductor integrated circuits, including multichip integrated circuits, but excluding hybrid circuits.
Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
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This part of IEC 60748 specifies a set of measuring methods and requirements for testing ADCs under dynamic conditions, together with associated terminology and characteristics.
Semiconductor devices - Integrated circuits - Part 4-3: Interface integrated circuits - Dynamic criteria for analogue-digital converters (ADC)
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Scope is not provided for this standard
Semiconductor devices - Integrated circuits - Part 2-1: Digital integrated circuits - Blank detail specification for bipolar monolithic digital integrated circuit gates (excluding uncommitted logic arrays)
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.(This publication forms part of the IEC Quality Assessment System for Electronic Components (IECQ This publication is a generic specification for semiconductor devices: discrete devices and integrated circuits, including multichip integrated circuits, but excluding hybrid circuits. It defines general procedures for quality assessment to be used in the IECQ System and gives general rules for: measurement methods of electrical characteristics; climatic and mechanical tests; endurance tests. NOTE - This publication must be supplemented by the approved sectional, family and blank detail specifications, .where they exist, appropriate to the specific individual type or types
Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits
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The measurement procedure of this part of IEC 61967 defines a method for measuring the electromagnetic radiated emission from an integrated circuit (IC) using an IC stripline in the frequency range of 150 kHz up to 3 GHz. The IC being evaluated is mounted on an EMC test board (PCB) between the active conductor and the ground plane of the IC stripline arrangement.
Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method
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