31.200 集成电路、微电子学 标准查询与下载
共找到 3192 条与 集成电路、微电子学 相关的标准，共 213 页
EC 62433-2:2008 specifies macro-models for ICs to simulate conducted electromagnetic emissions on a printed circuit board. The model is commonly called Integrated Circuit Emission Model - Conducted Emission (ICEM-CE). The ICEM-CE model can also be used for modelling an IC-die, a functional block and an Intellectual Property block (IP). The ICEM-CE model can be used to model both digital and analogue ICs. Basically, conducted emissions have two origins: - conducted emissions through power supply terminals and ground reference structures; - conducted emissions through input/output (I/O) terminals. The ICEM-CE model addresses those two types of origins in a single approach. This standard defines structures and components of the macro-model for EMI simulation taking into account the IC's internal activities. This standard gives general data, which can be implemented in different formats or languages such as IBIS, IMIC, SPICE, VHDL-AMS and Verilog. SPICE is however chosen as default simulation environment to cover all the conducted emissions. This standard also specifies requirements for information that shall be incorporated in each ICEM-CE model or component part of the model for model circulation, but description syntax is not within the scope of this standard.
EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE)
- ICS
- 31.200
- CCS
- 发布
- 2013-12-31
- 实施
IEC/TR 62433-2-1:2010 covers black box modelling which has the potential to make the modelling of conducted emission very simple, very fast, and can provide complete protection of proprietary information of IC vendors. This technical report is intended to provide the theoretical background on black box modelling for IC conducted emission.
EMC IC modelling - Part 2-1: Theory of black box modelling for conducted emission
- ICS
- 31.200
- CCS
- 发布
- 2013-12-31
- 实施
Integrated circuits. Measurement of impulse immunity. Non-synchronous transient injection method
- ICS
- 31.200
- CCS
- L55
- 发布
- 2013-10-31
- 实施
- 2013-10-31
Testing of materials for semiconductor technology - Surface analysis of silicon wafers by multielement determination in aqueous analysis solutions using mass spectrometry with inductively coupled plasma (ICP-MS)
- ICS
- 31.200
- CCS
- L40
- 发布
- 2013-10
- 实施
INTRODUCTION This blank detail specification is one of a series of blank detail specifications for semiconductor devices and shall be used with the following IEC publications: 747-10/QC 700000: Semiconductor devices - Discrete devices and integrated circuits - Part 10: Generic specification for discrete devices and integrated circuits. 748-11/QC 790100: Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits.
Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits - Section 1: Blank detail specification for linear digital-to-analogue converters (DAC)
- ICS
- 31.200
- CCS
- 发布
- 2013-09-09
- 实施
This part of IEC 60748 gives requirements for the following categories or subcategories of interface integrated circuits. Category I: – subcategory A: line circuits (transmitters and receivers); – subcategory B: sense amplifiers; – subcategory C: peripheral drivers (including memory drivers) and level shifters; – subcategory D: voltage comparators. Category II: – linear and non-linear analogue-to-digital and digital-to-analogue converters. Category III: – control circuits for switch-mode power supplies. Category IV: – companding PCM coder-decoders (CODEC). Category V: – digital interface integrated circuits (UBF). Category VI: – integrated service digital network (ISDN). As stated in the foreword, this standard is to be used in conjunction with IEC 60747-1 and IEC 60748-1. In these standards, the user will find all basic information on: – terminology; – letter symbols; – essential ratings and characteristics; – measuring methods. The sequence of the different chapters is in accordance with IEC 60747-1, 2.1, chapter III.
Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits
- ICS
- 31.200
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- 发布
- 2013-09-09
- 实施
This International Standard specifies a method for measuring the immunity of an integrated circuit (IC) to radio frequency (RF) radiated electromagnetic disturbances. The frequency range of this method is from 150 kHz to 1 GHz, or as limited by the characteristics of the TEM cell.
Integrated circuits - Measurement of electromagnetic immunity - Part 2: Measurement of radiated immunity - TEM cell and wideband TEM cell method
- ICS
- 31.200
- CCS
- 发布
- 2013-09-09
- 实施
Integrated circuits - Measurement of impulse immunity - Part 3: Non-synchronous transient injection method
- ICS
- 31.200
- CCS
- L55
- 发布
- 2013-07
- 实施
IEC/TS 61967-3, Ed. 2: Integrated Circuits - Measurement of Electromagnetic Emissions - Part 3: Measurement of radiated emissions - Surface scan method
- ICS
- 31.200
- CCS
- L56
- 发布
- 2013-07
- 实施
IEC/TS 62132-9, Ed. 1: Integrated circuits, measurement of electromagnetic immunity - Part 9: Measurement of radiated immunity - Surface scan method
- ICS
- 31.200
- CCS
- L06
- 发布
- 2013-05
- 实施
Blank Detail Specification : Digital Microprocessor Integrated Circuits
- ICS
- 31.200
- CCS
- L56
- 发布
- 2013-04-06
- 实施
- 2013-04-06
Family Specification : TTL Advanced Schottky Digital Integrated Circuits - Series 54AS, 74AS
- ICS
- 31.200
- CCS
- L56
- 发布
- 2013-04-06
- 实施
- 2013-04-06
Family specification : Digital Integrated HC MOS Circuits - Series HC/HCT/HCU
- ICS
- 31.200
- CCS
- L55
- 发布
- 2013-04-06
- 实施
- 2013-04-06
Family Specification : TTL FAST Digital Integrated Circuits - Series 54F, 74F
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- 31.200
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- L56
- 发布
- 2013-04-06
- 实施
- 2013-04-06
DIN EN 62132-8:2013 集成电路.电磁抗扰度的测量.第8部分:辐射抗扰度测量.集成电路(IC)电介质条状线法(IEC 62132-8-2012).德文版本EN 62132-8-2012
Integrated circuits - Measurement of electromagnetic immunity - Part 8: Measurement of radiated immunity - IC stripline method (IEC 62132-8:2012); German version EN 62132-8:2012
- ICS
- 31.200
- CCS
- L56
- 发布
- 2013-03
- 实施
- 2013-03-01
IEC/TS 61967-3, Ed. 2: Integrated circuits - Measurement of electromagnetic emissions - Part 3: Measurement of radiated emissions - Surface scan method
- ICS
- 31.200
- CCS
- L56
- 发布
- 2013-02
- 实施
Integrated circuits - Measurement of electromagnetic immunity -- Part 8: Measurement of radiated immunity - IC stripline method (IEC 62132-8:2012)
- ICS
- 31.200
- CCS
- 发布
- 2013-01-18
- 实施
- 2013-01-18
Surface Mount Chip Bead Qualification Specification
- ICS
- 31.200
- CCS
- 发布
- 2013-01-01
- 实施
IEC/TS 62132-9, Ed. 1: Integrated circuits, measurement of electromagnetic immunity - Part 9: Measurement of radiated immunity - Surface scan method
- ICS
- 31.200
- CCS
- L56
- 发布
- 2013-01
- 实施
Integrated microcircuits. Basic parameters
- ICS
- 31.200
- CCS
- 发布
- 2013
- 实施
- 2015-01-01
