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This Sectional Specification relates to battery holders of assessed quality. The purpose of this specification is to provide a means of interchangeability between qualified devices and compatibility between the board and the battery holder and to provide
Sectional Specification for Battery Holders for Use in Electronic Equipment
The cylindrical battery holders of assessed quality covered by this Detail Specification have
Detail Specification for Cylindrical Battery Holders, Standard Profile, for Use in Electronic Equipment
The ball grid array (BGA) burn-in sockets of assessed quality covered by this Detail Specification shall have
Blank Detail Specification for Burn-In Sockets Used with Ball Grid Array Devices for Use in Electronic Equipment
This recommended practice provides guidelines for the establishment of an induction hardening process for steel components. It is intended to be used as a guide for designers of induction hardened parts, for process auditors, and for purchase specifications and/or process sheets as applicable. Induction heat treatment is intended for hardening of only selected areas of plain carbon or alloy steel components. A prior heat treatment may be specified for improved response of the overall component to induction hardening, or for control of properties in the balance of the part. AMS 2759 is recommended for such prior heat treatment.
Induction Hardening of Steel Components
This test procedure details a standard method to determine the integrity of the seal of the shell,insert and contact interfaces in an electrical connector.
TP-02C Air Leakage Test Procedure for Electrical Connectors
This standard defines the dimensions and interconnections of 88.9 mm (3.5 in) small form factor disk drives.The purpose of this standard is to define the external aracteristics of small form factor disk drives so that products from different vendors may
Specification for Small Form Factor 88.9 mm (3.5 in) Disk Drives
This standard establishes a test method to determine the abiity of the connector-to-wire and interface area seals of a mated connector assembly to perform satisfactorily during and subsequent to simulated rapid descents from high altitude with attendant m
TP-03B Altitude Immersion Test Procedure for Electrical Connectors
This standard applies to electrical connectors, contacts and sockets.
TP-54A Magnetic Permeability for Test Procedure for Electrical Connectors, Contacts, and Sockets
This specification has been declared "NONCURRENT" by the Aerospace Materials Division, SAE, as of August, 2007. It is recommended, therefore, that this specification not be specified for new designs. "NONCURRENT" refers to those specifications which have previously been widely used and which may be required for production or processing of existing designs in the future. The Aerospace Materials Division, however, does not recommend these specifications for future use in new designs.This specification covers a series of iron-nickel, iron-nickel-cobalt, and iron-nickel-chromium alloys used for sealing to glasses and ceramics in electronic applications.
Iron-Nickel Alloys for Sealing to Glasses and Ceramics
This specification has been declared "NONCURRENT" by the Aerospace Materials Division, SAE, as of August, 2007. It is recommended, therefore, that this specification not be specified for new designs. "NONCURRENT" refers to those specifications which have previously been widely used and which may be required for production or processing of existing designs in the future. The Aerospace Materials Division, however, does not recommend these specifications for future use in new designs.This specification covers a series of iron-nickel, iron-nickel-cobalt, and iron-nickel-chromium alloys used for sealing to glasses and ceramics in electronic applications.
Iron-Nickel Alloys for Sealing to Glasses and Ceramics Should Be Used Instead of MIL-I-23011C, Which Was Cancelled on October 5, 1998
This sectional specification relates to the bum-in sockets for Ball Grid Array (BGA) devices of assessed quality. The purpose of this specification is to provide a means of interchangeability between qualified devices and compatibility between the board a
Sectional Specification for Burn-In Sockets Used with Ball Grid Array Devices for Use in Electronic Equipment
Specification for Small Form Factor Power Connector Pin Dimensions
Specification for Small Form Factor Power Connector Pin Dimensions
1.1 This practice describes the apparatus, procedure, and conditions required to create and maintain the salt spray (fog) test environment. Suitable apparatus which may be used is described in Appendix X1. 1.2 This practice does not prescribe the type of test specimen or exposure periods to be used for a specific product, nor the interpretation to be given to the results. 1.3 The values stated in SI units are to be regarded as standard. The inch-pound units in parentheses are provided for information and may be approximate. 1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
Standard Practice for Operating Salt Spray (Fog) Apparatus
This document defines the means for review and registration of new technologies pertaining to automated handihg of electronic components.
Electronic Industries Association - Automated Component Handling Committee - Guidelines and Procedures for Registration of New Technologies for Automated Component Handling for Publication in ACH-2000
Generic Specification for Sockets for Use in Electronic Equipment
Generic Specification for Sockets for Use in Electronic Equipment
The pin grid array (PGA) sockets of assessed quality covered by this detail specification have:- Maximum enclosure dimensions as shown in figure 1.- A working voltage not xceeding 250 volts (rms).
Detail Specification for Mechanically Actuated (Zero and Low Insertion Force) Sockets for Pin Grid Array Devices with 2.54 mm X 2.54 mm (0.1 in X 0.1 in) Spacing for Use in Electronic Equipment
The purpose of this procedure is to determine the presence of mechanical damage, wearthrough,and other gross defects in the contact finish. Most contact finishes are intended to be protective, and the presence of gross defects in the finish indicates a se
TP-85 General Test Procedure for Assessing Wear and Mechanical Damage Testing of Contact Finishes for Electrical Connectors
The objective of this test procedure is to determine the &&venes of polarizationlcoding keys when a connector pair is misregistered (improperly mated).
TP-86 Polarizing/Coding Key Overstress Test Procedure for Electrical Connectors and Sockets
This generic specification applies to electromechanical sockets of assessed quality for use in direct current, analog, and digital applications. This generic specification shall be used in conjunction with the basic specification EIA-364 "Electrical Conn
Generic Specification for Sockets for Use in Electronic Equipment
The ability of a material to resist abrading and wear as from sand A test in which certain parameters, such as voltage and temperature,ACCEPTANCE tests and as agreed by purchaser and vendor.
Glossary of Electrical Connector Related Terms
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