共找到 169 条与 黑色金属合金综合 相关的标准,共 12 页
This Sectional Specification relates to the sockets for Multi-Package Modules of assessed qualtty. The purpose of this Specification is to provide a means of assuring nterchange - ability between devices and compatibilrty between the board and the socke
Sectional Specification for Multi-Package Module Sockets for Use in Electronic Equipment
This Sectional Specification relates to the plug-in sockets designed for In-Line electronic packages of assessed quality. The purpose of these sockets is to provide interchangeable devices for use on panel boards, printed circuit boards, etc. to mate wit
Sectional Specification for In-Line Package Sockets for Use in Electronic Equipment
This Sectional Specification relates to the sockets for chip carriers of assessed quality. The purpose of this Specification is to provide a means of assuring interchangeability between devices and compatibility between the board and the chip carrier and
Sectional Specification for Sockets for Chip Carriers for Use in Electronic Equipment
The Chip Carrier Sockets of assessed quality covered by this detail specification shall have
Detail Specification for Chip Carrier Sockets for Leadless Type A (1.27 mm (.050") Spacing) Chip Carriers for Use in Electronic Equipment
The Pin Grid Array Sockets of assessed quality covered by this detail specification have
Blank Detail Specification: Sockets for Pin Grid Array Devices with 2.54 mm X 2.54 mm (0.1" X 0.1") Spacing for Use in Electronic Equipment
The Pin Grid Array Sockets of assessed quality covered by this detail specification have
Detail Specification for Non-Mechanically Actuated Sockets for Pin Grid Array Devices with 2.54 mm X 2.54 mm (0.1" X 0.1") Spacing for Use in Electronic Equipment
This sectional specification relates to the sockets for Pin Grid Array devices of assessed quality . The purpose of this specification is to provide a means of nterchangeability between qualified devices and compatibility between the board and the Pin Gr
Sectional Specification Sockets for Pin Grid Array Devices With 2.54 mm x 2.54 mm (0.1" x 0.1") Spacing for Use in Electronic Equipment
Leaded Electronic Component parts are subjected to a wide variety of internal stresses during the soldering of their terminations by solder dips, soldering irons, or automatic wave soldering techniques.
Ceramic Capacitor Applications Guide Soldering and Solderability Maintenance of Leaded Electronic Components
This Standard does not purport to address all safety problems associated with its use or all applicable regulatory requirements.It is the responsibility of the user of this Standard to establish appropriate safety and health practices and to determine the
EIA Standards for Electron Tubes
The purpose of this procedure is to determine the magnitude of porosity as well as other surface defects inherent in application of noble metal contact finishes. It is the intent that the defined methods be used as an evaluation technique for the acceptab
TP-60 General Methods for Porosity Testing of Contact Finishes for Electrical Connectors
This sectional specification relates to the sockets, for plug-in relays, of assessed quality. The purpose of this specification is to provide a means of assuring interchangeability between these devices, compatibility between these sockets and their asso
Sectional Specification Sockets for Relays for Use in Electronic Equipment
Sectional Specification Sockets for Relays for Use in Electronic Equipment
Sectional Specification Sockets for Relays for Use in Electronic Equipment
This publication contains those passive product outlines (including electro-mechanical outlines) and other associated drawings that have been registered and assigned a formal designation. Product outlines that have been- accepted as standards are indicate
Parts Division Publication 100 Registered and Standard Mechanical Outlines for Electronic Parts
This test method forms a part of the latest revision of EIA Recommended Standard EIA/RS-186, which contains test guidance,definitions and standard test conditions.
Passive Electronic Component Parts, Test Method for; Method 14: Panel Seal Test
In this standard the following definitions will apply. They are taken from IEEE Standards on Electron Tubes : Definitions of Terms, 1957 (IEEE Publication 160). Electrode (Electron Tubes). A conducting element that performs one or more of the functions o
Measurement of Direct Interelectrode Capacitances of Electron Tubes
This standard covers definitions, classifications,terminology, notation, and performance characteristics of relays for general switching purposes. It also includes military relays, relays for use in electronic circuits, relays for unusual environmental co
Relays for Electronic Equipment, EIA/NARM Standard Definitions and Terminology for
This EIA Engineering Bulletin was developed by the Association staff personnel from information supplied by member companies.We appreciate the efforts of Pat Lannon (AMP, Inc.) who initiated this project.
List of Approval Agencies, U.S. and Other Countries, Impacting Electronic Components and Equipment
The following details apply to the standard illuminated non-sensitive puchbutton switches covered by this detail specification: Will snap-in mount in a .625 -+ .O05 (15.88 -+ .13 mm) square panel cutout.
Detail Specification Illuminated and Non-Illuminated Non-Sensitive Pushbutton Switches, .625 Square Mounting, One and Two Pole, 1.0 Ampere
It shall be standard to assign type designations to this category of cathode ray picture tubes as follows:The designation shall consist of three symbols and one or more suffix letter symbols, if required. These symbols shall have the following significanc
Electron Tubes, Type Designation System for
This Test Method forms a part of the EIA Standard RS-186 which contains test guidance, definitions and standard test conditions.
Passive Electronic Component Parts, Test Methods for; Method 8: Vibration, High Frequency
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