共找到 597 条与 胶粘剂 相关的标准,共 40 页
IPC-A-22 — Underwriters Laboratories
Factors Affecting Insulation Resistance Performance of Printed Boards
This document describes the design and assembly challenges for implementing Ball Grid Array (BGA) and Fine Pitch BGA (FBGA) technology. The effect of BGA and FBGA on current technology and component types is also addressed. The focus on the information contained herein is on critical inspection, repair, and reliability issues associated with BGAs.
Surface Insulation Resistance of Raw Printed Wiring Board Material
Adhesive, Elastomeric, for Installation of Quarry Tiles, Standard for
Adhesif Elastomere Pour L'Installation De Carreaux De Carriere
Adhesive, Epoxy and Modified Mortar Systems, for Installation of Quarry Tiles, Standard for
Systemes Adhesifs Epoxydiques Et De Mortier Modifie Pour L'Installation De Carreaux De Carriere
Adhesive, Organic, for Installation of Ceramic Wall Tile, Standard for Amendment 1: June 1978
Norme: Adhesif Organique Pour L'Installation Des Carreaux De Ceramique Pour Murs
Adhesive, Flexible, for Bonding Cellular Polystyrene Insulation, Standard for Amendment 1: November 1983
Standard for Adhesif Souple Pour Isolant En Polystyrene Expanse
TThis specification covers a classroom training aid for the Waterbury variable stroke axial piston pump, used as a variable speed gear.
ADHESIVE (FOR PLASTIC INHIBITORS)
This specification was approved by the Commissioner, Federal Supply Service, General Services A d m i n i s t r a t i o n , for the u s e o f all Federal agencies.
ADHESIVE, EPOXY, SILVER FILLED, CONDUCTIVE
Th:s specification covers two types of rubber base adhesive which is relatively colorless, f a s t d r y i n g , and packaged in a pressurized container commonly known as an aerosol dispenser.
ADHESIVE, RUBBER BASE (IN PRESSURIZED DISPENSERS)
This standard establishes qualification and conformance requirements for electrical insulating compounds (conformal coatings). It has been designed and constructed with the intent of obtaining maximum confidence in the materials with minimum test redundancy. This standard covers:
Insulation Resistance, Connectors; Revision A - July 1975
This specification covers one type of rubber adhesive, comnonly knowii as rubber ce:snt, suitable 2. APPLICABLE DOCUMENTS 2.1 The following documents, of the issues i n e f f e c t on date of i n v i t a t i o n for bids o r request Federal Specifications: for mounting photographic prints, maps, drawings and charts and for general paper-to-paper bonding. for proposal, form a part of This Specification to the extent specified herein:
ADHESIVE, RUBBER (FOR PAPER BONDING)
This specification sets the requirements for the use of Electroless Nickel/Immersion Gold (ENIG) as a surface finish for printed circuit boards. This specification is intended to set requirements for ENIG deposit thicknesses based on performance criteria. It is intended for use by supplier, printed circuit manufacturer, electronics manufacturing services (EMS) and original equipment manufacturer (OEM).
Insulation Resistance, Multilayer Printed Wiring (Within a Layer)
The IPC Test Methods Manual is divided into several major sections to provide a systematic
Terminal Bond Strength, Flexible Printed Wiring
This standard establishes requirements and other considerations
Interconnection Resistance, Multilayer Printed Wiring
This standardization handbook was developed by the Department of Defense in accordance with established procedure.
ADHESIVES: A GUIDE TO THEIR PROPERTIES AND USES AS DESCRIBED BY FEDERAL AND MILITARY SPECIFICATIONS
Standard for: Adhesive, Rubber, Office Type Amendment 3 Sept 1975
Norme: Adhesif De Caoutchouc, Pour Bureau
Adheswes for cold solvent welding of pipes and their elements for pipes general quality zequirements test methods Zusammenhang mit den von der International Organization for Standardization (ISO) in Vordereitung betmdlichen Empfehlungen siehe Erlauterung
Adhesives for Bonding Pipes and Pipe System Elements of Rigid PVC; General Quality Requirements and Testings
Thin specification covers epoxy resin adhesives for structural bondings such as the fabrication and repair of airframe parts, components, -. id other applications requiring bonding of a similar 0M1M%,
ADHESIVE, EPOXY RESIN, METAL TO METAL STRUCTURAL BONDING
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