L10 电子元件综合 标准查询与下载

IPC 2221A-2003 印刷电路板的设计通用标准

This standard establishes the generic requirements for the design of organic printed boards and other forms of component mounting or interconnecting structures. The organic materials may be homogeneous, reinforced, or used in combination with inorganic materials; the interconnections may be single, double, or multilayered.

Generic Standard on Printed Board Design [Superseded: IPC D-275]

IPC 0040-2003 光电子组装和封装技术

This document addresses the implementation of optical and optoelectronic packaging technologies.

Optoelectronics Assembly and Packaging Technology

IEC 60512-11-7:2003 电子设备用连接器.试验和测量方法.第11-7部分:气候试验.试验11g:流动混合气体腐蚀试验

Defines a standard test method to assess the effects of a controlled atmosphere polluted by gases at very low concentration on electrical contacts or connections.

Connectors for electronic equipment - Tests and measurements - Part 11-7: Climatic tests; Test 11g: Flowing mixed gas corrosion test

KS C IEC 60512-9:2003 电子设备用机电元件.基本试验程序和测量方法.第9部分:其他试验.0项:通用

이 규격에서 정의하고 있는 세부 명세에 따른 시험은 IEC TC 48(1)의 업무범위

Electromechanical components for electronic equipment-Basic testing procedures and measuring methods-Part 9:Miscellaneous tests

BS EN 62090:2003 使用条形码和二维符号的电子元器件的产品包装标签

This standard applies to labels on the packaging of electronic components for automatic handling. These labels use linear bar code and two-dimensional (2D) symbols. Labels for direct product marking and shipping labels are excluded. Labels required on the packaging of electronic components that are intended for the retail channel of distribution are also excluded from this standard. Bar code and 2D symbols markings are used, in general, for automatic identification and automatic handling of components in electronics assembly lines. Intended applications include systems that automate the control of component packages during production, inventory and internal distribution.

Product package labels for electronic components using bar code and two-dimensional symbologies

IEC 60512-23-3:2000/COR1:2003 电子设备用电机元件.基本测试程序和测量方法.第23-3部分:试验23c:连接器和附件的屏蔽效果

This standard is Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 23-3: Test 23c: Shielding effectiveness of connectors and accessories; Corrigendum 1.

Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 23-3: Test 23c: Shielding effectiveness of connectors and accessories

KS C 5116-2003 电子仪器的固定碳合成电阻器

이 규격은 KS C 5115-1에 따라 주로 전자 기기에 사용하는 고정체 저항기(이하

Fixed carbon composition resistors for use in electronic equipment

KS C 6035-2003 电子设备用固定电容器试验法

이 규격은 주로 전자 기기에 사용하는 고정 커패시터(이하 커패시터라 한다.)의 시험 방

Test methods of fixed capacitors for electronic equipment

IEC 60286-2:2003 自动装配元件的封装.第2部分:具有单向引线的元件在连续带上的带式封装

Packaging of components for automatic handling - Part 2: Tape packaging of components with unidirectional leads on continuous tapes

DLA SMD-5962-97564 REV B-2003 16-BIT类似体到平行接口数字转换器硅单片电路数字线型微电路

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

MICROCIRCUIT, DIGITAL-LINEAR, 16-BIT ANALOG-TO- DIGITAL CONVERTER WITH PARALLEL INTERFACE, MONOLITHIC SILICON

DLA MIL-PRF-20 K-2003 可靠性和非既定的陶瓷介电常数(温度补偿)固定电容器的一般规格

This specification covers the general requirements for established reliability (ER) and non-ER, emperature compensating, fixed capacitors for use primarily where compensation is necessary for circuitapplications due to temperature changes, in bypass and coupling applications. Capacitors meeting the ER requirements specified herein have a failure rate level (FRL) ranging from 1.0 percent per 1,000 hours to 0.00l percent per 1,000 hours. These failure rate levels are established at a 90-percent confidence level based on the life test parameters specified and are maintained at a 10-percent producer's risk. An acceleration factor of 8:1 has been used to relate the life test data at 200 percent of rated voltage at the applicable high test temperature to the rated voltage at the applicable high test temperature. A part per million (ppm) quality system is used for documenting and reporting the average outgoing quality of ER capacitors supplied to this specification. Statistical process control (SPC) techniques are required in the manufacturing process to minimize variation in production of ER capacitors supplied to the requirements of this specification.

CAPACITOR, FIXED, CERAMIC DIELECTRIC (TEMPERATURE COMPENSATING), ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR

DLA MIL-PRF-20 K SUPP 1-2003 可靠性和非既定的陶瓷介电常数(温度补偿)固定电容器的一般规格

This supplement forms a part of MIL-PRF-20K, dated 14 November 2003.

CAPACITOR, FIXED, CERAMIC DIELECTRIC (TEMPERATURE COMPENSATING), ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR

DLA MIL-PRF-15733 H SUPP 1-2003 射频干扰滤光片和电容器 常规

The activities listed above were interested in this document as of the date of this document. Since organizations and responsibilities can change, you should verify the currency of the information above using the ASSIST Online database at www.dodssp.daps.mil.

FILTERS AND CAPACITORS, RADIO FREQUENCY INTERFERENCE, GENERAL SPECIFICATION FOR

IPC 2251-2003 高速电子电路包装的设计指南,取代IPC-D-317A-317A:1995年1月

This standard establishes requirements and other considerations

Design Guide for the Packaging of High Speed Electronic Circuits

DLA MIL-C-5 F-2003 电容器,固定的,云母介质,通用规格

This specification covers the general requirements for molded and dipped mica dielectric, fixed capacitors intended primarily for use in high-stability, low-loss radio-frequency applications such as tuned circuits (see 6.1). This is a graded specification covering ranges in temperature oefficient, capacitance, tolerance, temperature, and vibration.

CAPACITORS, FIXED, MICA DIELECTRIC, GENERAL SPECIFICATION FOR

DLA DSCC-DWG-90029 REV B-2003 铁氧体屏蔽珠

NOTICE OF REVISION (NOR) (YYMMDD) Form Approved OMB No.0704-0188

SHIELDING BEADS, FERRITE

DLA DSCC-DWG-84084 REV H-2003 密封抑制射频/电磁干扰过滤器和电容器

This drawing and MIL-PRF-28861describes the complete requirements for radio requency/electromagnetic interference suppression, hermetically sealed, filters and capacitors

FILTERS AND CAPACITORS, RADIO FREQUENCY/ELECTROMAGNETIC INTERFERENCE SUPPRESSION, HERMETICALLY SEALED

DLA DSCC-DWG-84127 REV C-2003 铁氧体屏蔽珠

Paragraph 3.3, delete the last sentence.

SHIELDING BEADS, FERRITE

DLA MIL-PRF-31033 A-2003 平圆形的高性能最佳性 陶瓷介质固定电容器

This specification covers the requirements for high reliability, discoidal, ceramic dielectric, fixed capacitors. This specification provides for two levels of product requirements: Class B and class S. Capacitors furnished to the requirements of this specification are intended for use in Radio Frequency/ Electromagnetic Interference (RFI/EMI) suppression filters covered by MIL-PRF-28861. This specification establishes a Qualified Manufacturers List (QML) for discoidal capacitors that requires demonstration of control of the quality system and manufacturing process and qualification of representative discoidal capacitor designs.

CAPACITORS, FIXED, CERAMIC DIELECTRIC, HIGH RELIABILITY, DISCOIDAL, GENERAL SPECIFICATION FOR

ANSI/EIA 481-C:2003 自动装配用表面安装元件的8mm至200mm压纹载体带式封装以及8mm和12mm穿孔载体带式封装

Covers requirements for taping surface mount components

8 mm through 200 mm Embossed Carrier Taping and 8 mm &12 mm Punched Carrier Taping of Surface Mount Components for Automatic Handling