L10 电子元件综合 标准查询与下载

ANSI/EIA 632:2003 系统工程设计方法

(SP-5022) Intended to enable an enterprise to strengthen its competitiveness in global markets by engineering and producing quality systems, and by delivering it products on time at an affordable price or cost. The focus, therefore, is on conceptualizing, creating, and realizing a system and the products that make up a system.

Processes for Engineering a System

KS C IEC PAS 62162:2002 微型电子元件的静电放电耐受阈值的电器传导荷电元件模型试验方法

박막 회로, 표면 탄성파(SAW) 부품, 광전 부품, 하이브리드 집적 회로(HICs)

Field－induced charged－device model test method for electrostatic discharge withstand thresholds of microelectronic components

KS C IEC 60512-6-5:2002 电子设备用机电元件.基本试验程序和测量方法.第6部分:动态应力试验.第5节:6c试验:无规则振动V

이 규격은 규정된 불규칙 진동의 가혹성(severities)을 견디어 내는 부품의 성능

Electromechanical components for electronic equipment-Basic testing procedures and measuring methods-Part 6:Dynamic stress tests-Section 5:Test 6e:Random vibration

KS C IEC 60512-1-3:2002 电子设备用机电元件.基本试验程序和测量方法.第1部分:一般检测.第3节:试验1c.电接合长度

이 규격에서 정의하고 있는 세부 명세에 따른 시험은 IEC TC 48의 업무범위 내에서

Electromechanical components for electronic equipment-Basic testing procedures and measuring methods-Part 1:General examination-Section 3:Test 1c-Electrical engagement length

KS C 6308-2002 电子设备用小型电源变压器

이 규격은 주로 전자 기기에 사용하는 출력 1 kVA 이하, 주파수 60 Hz의 철심형 단

Power transformer for electronic equipment

KS C IEC 60512-4:2002 电子设备用机电元件.基本试验规程和测量方法.第4部分:动态应力试验

이 규격(부)에서 정의하고 있는 세부 명세에 따른 시험은 IEC TC 48(1)의 업무

Electromechanical components for electronic equipment-Basic testing procedures and measuring methods-Part 4:Dynamic stress tests

KS C IEC 60512-11-1:2002 电子设备用机电元件.基本试验程序和测量方法.第11部分:气候试验.第1节:11a:气候顺序

이 규격(부)에서 정의하고 있는 세부 명세에 따른 시험은 IEC TC 48의 업무 범위

Electromechanical components for electronic equipment-Basic testing procedure and measuring methods-Part 11:Climate tests-Section 1:Test 11a-Climatic sequence

KS C IEC 60512-1-4:2002 电子设备用机电元件.基本试验程序和测量方法.第1部分:总则.第4节:试验1d:接触保护效果(防碰擦)

이 규격에서 정의하고 있는 세부 명세에 따른 시험은 IEC TC 48의 업무 범위 내에

Electromechanical components for electronic equipment-Basic testing procedures and measuring methods-Part 1:General-Section 4:Test 1d:Contact protection effectiveness(scoop-proof)

KS C IEC 61261-2-1:2002 电子设备用压电陶瓷滤波器.IEC质量评定系统的电子元件的规范.第2部分:分规范.合格评定.第1节:空白详细规范.E级评定

서&##8195;문&##8195;이 규격은 1994년에 제1판으로 발행된 IEC

Piezoelectric ceramic filters for use in electronic equipment-A specification in the IEC quality assessment system for electronic components(IECQ)-Part 2:Sectional specification-Qualification approval-Section 1:Blank detail specification-Assessment level

KS C 6422-2002 电子设备用固定纸和塑料膜电容器通则

이 규격은 주로 전자 기기에 사용하는 종이 및 플라스틱 필름을 주된 유전체로 한 고정 커패

General rules of fixed paper and plastic film capacitorsfor use in electronic equipment

KS C 6410-2002 电子设备用2类瓷介固定电容器

이 규격은 KS C 6029에 따라 주로 티탄산바륨계 자기를 유전체로하고, 금속막을 전극으

Fixed ceramic capacitors(Class 2) for electronic equipment

KS C 6423-2002 电子设备用固定云母电容器

이 규격은 주로 전자 기기에 사용하는 마이카를 유도체로 한 고정 커패시터(이하 커패시터라

Fixed mica capacitors for use in electronic equipment

DLA MIL-HDBK-660A CHG NOTICE 1-2002 硬式波导装置制作(弯头和扭转)

This handbook is intended f o r the e l e c t r o n i c i n s t a l l a t i o n s technician t o be used as a guide for f a b r i c a t i n g rectangular waveguide bends and twists used i n the microwave region of t h e e l e c t r o n i c spectrum.

FABRICATION OF RIGID WAVEGUIDE ASSEMBLIES (SWEEP BENDS AND TWISTS)

ANSI/EIA 4899:2002 起草电子元器件管理方案的标准

Defines the requirements for developing an Electronic Components Management Plan to assure customers and regulatory agencies that all of the electronic components in the equipment of the plan owner are selected and applied in controlled processes and that the Technical Requirements are accomplished.

Standard for Preparing an Electronic Components Management Plan

DLA SMD-5962-88719 REV C-2002 硅单片12位四方D/A转换器线性微电路

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

MICROCIRCUIT, LINEAR, 12-BIT, QUAD D/A CONVERTER, MONOLITHIC SILICON

IPC CC-830B-2002 电气绝缘复合印刷线路组装的条件和执行

This standard establishes qualification and conformance requirements for electrical insulating compounds (conformal coatings). It has been designed and constructed with the intent of obtaining maximum confidence in the materials with minimum test redundancy. This standard covers:

Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies Incorporates Amendment 1: October 2008

QX 10.1-2002 电涌保护器 第1部分:性能要求和试验方法

QX10.1 的本部分规定了电涌保护器的性能要求和试验方法。 本部分适用于连接至低压配电系统和连接至电信及信号网络的电涌保护器。

Surge protective devices - Part 1: Performance requirements and testing methods

IPC 2252-2002 射频/微波电路板设计指南

This standard establishes requirements and other considerations

Design Guide for RF/Microwave Circuit Boards

JEDEC JESD82-5-2002 符合JESD21-C, PC133 注册DIMM应用软件的3.3V,零延迟分布装置的描述

This standard defines pinout, functionality, DC and AC interface parameters, and test loading for the functions known as the '2509 and '2510. The scope of the specification is restricted to those parameters critical to operation with the PC133 Registered DIMM applications.

Description of a 3.3 V, Zero Delay Clock Distribution Device Compliant with JESD21-C, PC133 Registered DIMM Specification

JEDEC JESD62-A-2002 电子元件的外部鉴定和管理系统

Component quality and reliability can be improved by the implementation of an Outlier Identification and Management system (OIMS) that utilizes a statistical method of identifying and potentially removing parts with electrically abnormal characteristics (outliers), with the goal of fine-tuning manufacturing processes and minimizing the probability of customer impact. An OIMS program can be implemented across an entire spectrum of processes including, but not limited to, fabrication, assembly, test, packaging, and handling operations.

Outlier Identification and Management System for Electronic Components