L10 电子元件综合 标准查询与下载

KS C 5115-4101-2001 电子仪器的固定电阻器.第4部分:空白详细规范:可焊接轴向导线的固定功率线圈电阻器.稳定性等级5%.评估标准E

표준 실장 방법 이 저항기는 단자 포스트에 납땜하도록 설계되었다. 저항기 본체의 고온으로

Fixed resistors for use in electronic equipment-Part 4:Detail specification:Fixed power wirewound resistors withsolderable axial wire leads-Stability class 5 %-Assessment level E

KS C 5115-4102-2001 电子仪器的固定电阻器.第4部分:空白详细规范:可焊接轴向导线的固定功率线圈电阻器.稳定性等级1%.评估标准E

권장 실장 방법 이 저항기는 인쇄 기판에 납땜하거나 단자 포스트에 고정하도록 설계되었다.

Fixed resistors for use in electronic equipment-Part 4:Detail specification:Fixed power wirewound resistors withsolderable axial wire leads-Stability class 1 %-Assessment level E

ECA EIA-540J0AB-2001 用于电子设备的触点式空间电池座的详细规范

The cylindrical battery holders of assessed quality covered by this Detail Specification have Maximum enclosure dimensions as shown in figure 2.

Detail Specification for Coin Cell Battery Holders for Use in Electronic Equipment

DLA MIL-C-11015 E-2001 电容器,固定的,陶瓷介质(通用)

This specification covers the general requirements for general purpose, ceramic dielectric, insulated, fixed capacitors for use in applications where variations in capacitance with respect to temperature, voltage, frequency, and life can be tolerated.

CAPACITORS, FIXED, CERAMIC DIELECTRIC (GENERAL PURPOSE),

DLA MIL-C-11015 E SUPP 1-2001 电容器,固定的,陶瓷介质(通用)

This supplement forms a part of MIL-C-11015E, dated 14 May 2001.

CAPACITORS, FIXED, CERAMIC DIELECTRIC (GENERAL PURPOSE),

DLA DSCC-DWG-97007 REV A-2001 固定陶瓷介质馈穿非全密封的电容器

This drawing and MIL-PRF-28861 describe the requirements for feedthrough capacitors.

CAPACITORS, FIXED, CERAMIC DIELECTRIC, NON-HERMETICALLY SEALED, FEED-THROUGH

IEC PAS 62239:2001 电子元件管理计划

Electronic component management plans

DLA DSCC-DWG-01001-2001 氧化铝两极化电解的固定电容器

This drawing and MIL-PRF-39018 describes the requirements for aluminum oxide, electrolytic capacitors.

CAPACITORS, FIXED, ELECTROLYTIC, POLARIZED, ALUMINUM OXIDE

IPC 9252-2001 电气试验无载印制电路板的准则和规定

This document is presented to assist in selecting the test analyzer, test parameters, test data, and fixturing required to perform electrical test(s) on all unpopulated printed boards without embedded components (i.e., resistors, capacitors, etc.).

Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards

IEC 60512-1-100:2001 电子设备用连接器 试验和测量 第1-100部分：总则 可应用的出版物

Connectors for electronic equipment - Tests and measurements - Part 1-100: General; Applicable publications

IEC 60512-1:2001 电子设备用连接器 试验和测量 第1部分：总则

This part of IEC 60512 is intended to be used as a basic specification. It contains basic test methods and procedures which, when required by the detail specification, are used for testing connectors within the scope of technical committee 48. They may also be used for similar devices when specified in a detail specification. The object of this standard is to establish test methods and measurement procedures for use in specifications for connectors. This standard is to be used in conjunction with the generic, sectional and detail specification which will select and prescribe the tests to be used, the required degree of severity for each of them and the permissible performance limits. The detail specification will also specify the deviations in procedure, which may be inevitable when applying a test to the type of component under consideration, and it will further specify any special procedures which may be required. In the event of conflict between this basic specification and any individual component specification, the requirements of the component specification will apply. NOTE 1 RF connectors will not be dealt with by this technical committee as they will be covered by technical committee 46, together with r.f. cables. NOTE 2 Sockets for components such as crystals or electronic tubes will be considered in co-operation with the relevant technical committee. NOTE 3 Safety requirements for switches will not be developed by this technical committee as they are covered by subcommittee 23J.

Connectors for electronic equipment - Tests and measurements - Part 1: General

ECA EIA-540B0AA-A-2001 用于电子设备的1.27mm空间的BGA插座的详细规范

This specification covers interconnect systems typically used for production ball grid array (BGA) devices with pin counts of 1089 and greater.

Detail Specification for Production Ball Grid Array (BGA) High Pin Count (1089 Pins and Greater) Socket for Use in Electronic Equipment Revision of EIA-540B0AA

IPC 2541-2001 电子产品制造车间的设备沟通讯息 (CAMX)通用要求,

The IPC-2541 standard defines an XML encoding schema to facilitate plug-and-play characteristics in a factory’s shop-floor information system. This standard describes the generic event message content, and should be used together with the IPC-2540 series sectional documents, which define the set of messages and key attributes of specific classes of equipment used in the electronics manufacturing area.

Generic Requirements for Electronics Manufacturing Shop-Floor Equipment Communication Messages (CAMX)

IPC 2576-2001 作为已建成的产品数据-产品数据交换(PDX),电子制造业供应链沟通的分段要求

This standard defines an XML encoding scheme that captures the configuration data from manufacturing operations. The IPC-2576 standard defines how manufacturing product genealogy information is exchanged between supply chain partners. Information represented in this standard includes such things as: manufacturing site, manufacturing date, part number, serial number, manufacturing batch/lot, component and sub-assembly data.

Sectional Requirements for Electronics Manufacturing Supply Chain Communication of As-Built Product Data - Product Data eXchange (PDX)

DLA DSCC-DWG-93014 REV A-2001 插入式电子元件单列直插式封装插槽

Dimensions are in inches. Metric equivalents are given for general information only. Metric equivalents are in parentheses. Unless otherwise specified, all tolerance shall be ± .005 inch (0.13 mm). Part is to be free of burrs and sharp edges except as noted. Dimensions apply after plating. Retention design may be barbed or knurled.

SOCKET, PLUG-IN ELECTRONIC COMPONENTS, SINGLE IN-LINE

DLA SMD-5962-94755 REV B-2001 12-BIT连续6微秒类似体到数字转换器硅单片电路线型微电路

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

MICROCIRCUIT, LINEAR, 12-BIT, SERIAL SIX MICROSECOND ANALOG-TO-DIGITAL CONVERTER, MONOLITHIC SILICON

DLA SMD-5962-95579 REV A-2001 超高速增加12-BIT直流电和交流电转换器硅单片电路线型微电路

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V).

MICROCIRCUT, LINEAR, ULTRAHIGH SPEED MULTIPLYING 12-BIT D/A CONVERTER, MONOLITHIC SILICON

DLA SMD-5962-95592 REV A-2001 劳固连续的16-BIT交流电和直流电转换器多片硅单片电路线型微电路

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

MICROCIRCUIT, DIGITAL-LINEAR, FAST, SERIAL, 16-BIT, A/D CONVERTER, MULTICHIP SILICON

IEC 60512-23-3:2000 电子设备用电机元件.基本试验程序和测量方法.第23-3部分:试验23c.连接件和附属件的屏蔽效应

This part of IEC 60512 defines a standard test method for measuring the shielding effec-tiveness of a connector, or a connector fitted with an accessory and terminated with a cable. The complete assembly has a continuous 360°shielding capability throughout its length. This test method utilizes the principle that the intrinsic shielding property of the connector/accessory/cable assembly is its surface transfer impedance which can be expressed as the longitudinal voltage inside the shield, relative to the current flow on the outside shell. The test method is based on two impedance matched circuits. See figure 1 for the measurement principle. The connector under test is integrated into the secondary circuit 02. The impedance matched injection line of the primary circuit 01, which activates the electromagnetic field, runs parallel to the surface of the test sample under test. This test is suitable for measuring the shielding effectiveness of a connector fitted with triaxial contacts terminated with shielded, twisted pair cables as used in data bus systems. NOTE This standard has been adopted by AECMA as EN 2591-212 and, as such, should not be amended without direct consultation and liaison with the AECMA organization.

Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 23-3: Test 23c: Shielding effectiveness of connectors and accessories

IEC PAS 62189:2000 偏值寿命

Bias Life PURPOSE APPARATUS PROCEDURE COOL-DOWN MEASUREMENTS FAILURE CRITERIA SUMMARY

Bias life