L10 电子元件综合 标准查询与下载

IEC 60512-1-4:1997/COR1:2000 电子设备用机电元件.基本测试程序和测量方法.第1部分:总则.第4节:试验1d:触点防护效果(防碰擦)

This standard is Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 1: General - Section 4: Test 1d: Contact protection effectiveness (scoop-proof); Corrigendum 1.

Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 1: General - Section 4: Test 1d: Contact protection effectiveness (scoop-proof)

IEC PAS 62206:2000 功率与温度循环

Power and temperature cycling

SJ/T 10798-2000 电子元器件详细规范.MF11型直热式负温度系数热敏电阻器.评定水平E

Detail specification for electronic component.Directly heated negative temperature coefficient thermistor for style MF11.Assessment level E

EIA-654-2000 电线和电气元件的焊接热试验过程的耐受

EL4 Engineering Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standards and Publications shall not in any respect preclude any member or nonmember of EL4 fiom manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than EIA members, whether the standard is to be used either domestically or internationally

Resistance to Soldering Heat Test Procedure for Wire and Electrical Components

NF C96-627-1-3*NF EN 61338-1-3:2000 波导型电介质谐振器.第1-3部分:一般信息和试验条件.在微波频率下电介质谐振器材料用复合式相关电容率的测量方法

Waveguide type dielectric resonators - Part 1-3 : general information and test conditions - Measurement method of complex relative permittivity for dielectric resonator materials at microwave frequency.

IEC PAS 62159:2000 电子配件生产商资格证明纲要

Electronic Assembly Manufacturers' Qualification Profile (AQP) Company and Site Description Site Capability Snap Shot Equipment Profile (Pre-site Audit) Technology Profile Specifics Quality Profile Manufacturing History Identification of Previous Audits Financial Review (optional) MQP Electronic Data Format (See included floppy disk) Glossary of Terms

Electronic Assembly Manufacturers' Qualification Profile (AQP)

KS C 6071-2000 电子设备用开关通用技术条件

이 규격은 주로 전자 기기에 사용하는 정격 전압 500V(주파수 60Hz의 교류 또는 직류

Generic specification of switches for use in electronic equipment

IPC 2615-2000 印制电路板尺寸和公差

This Standard covers dimensioning and tolerancing of electronic packaging as it relates to printed boards and the assembly of printed boards. The concepts defined in this Standard are derived from ASME Y14.5” 1994. Printed boards have such wide applications that there may be times where this standard does not address a specific case. In those cases, the user is referred to ASME Y14.5M 1994 for use of additional dimensioning and tolerancing concepts.

Printed Board Dimensions and Tolerances

ECA 540HAAA-2000 电子设备用圆栅极阵列器件烧进插孔的详细规范

The ball grid array (BGA) burn-in sockets of assessed quality covered by this Detail Specification have Maximum enclosure dimensions as shown in figure 2.

Detail Specification for Burn-In Sockets Used with Ball Grid Array Devices for Use in Electronic Equipment

ECA EIA-540J000-2000 用于电子设备的电池座的分规范

This Sectional Specification relates to battery holders of assessed quality. The purpose of this specification is to provide a means of interchangeability between qualified devices and compatibility between the board and the battery holder and to provide

Sectional Specification for Battery Holders for Use in Electronic Equipment

ECA EIA-540HA00-2000 用于电子设备的使用球形栅极排列装置的预烧插座的空白详细规范

The ball grid array (BGA) burn-in sockets of assessed quality covered by this Detail Specification shall have

Blank Detail Specification for Burn-In Sockets Used with Ball Grid Array Devices for Use in Electronic Equipment

ECA EIA-540J0AA-2000 用于电子设备的圆柱形电池座标准文件的详细规范

The cylindrical battery holders of assessed quality covered by this Detail Specification have

Detail Specification for Cylindrical Battery Holders, Standard Profile, for Use in Electronic Equipment

BS DD ENV 50247-2:2000 尖顶元件信息标准1.2.SGML说明和SGML文献类型定义(DTDs)

To model electric component data and to define an interchange format for that data which is independent of the component supplier.

Pinnacles Component Information Standard 1.2. The SGML declaration and SGML document type definitions (DTDs)

IEC 60512-20-2:2000 电子设备用机电元件-基本试验程序和测量方法 第20-2部分:试验20b:易燃性试验 防火性

This part of IEC 60512, when required by the detail specification, is used for testing electromechanical components within the scope of IEC technical committee 48. This test may also be used for similar components when specified in a detail specification. The object of this test is to detail a standard method to assess the ability of a connector to withstand specified flame and vibration during a 20 min exposure by providing specified electrical performance for the first 6 min of exposure and preventing the flame from penetrating the fireproof bulkhead on which the connector is mounted throughout the test.

Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 20-2: Test 20b - Flammability tests - Fireproofness

IPC 1331-2000 电热工艺设备自愿安全标准

This standard establishes requirements and other considerations

Voluntary Safety Standard for Electrically Heated Process Equipment

IPC 4121-2000 为多层印制电路板应用选择核心建筑的指南,取代IPC-CC-110A

This specification defines guidelines for selecting core constructions in terms of fiberglass fabric style and configuration for use in multilayer PWB applications. Each core construction is given a registration number for ordering purposes. Every effort shall be made to periodically review the construction guideline and include or exclude constructions based on current data.

Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications Supersedes IPC-CC-110A

DLA DSCC-DWG-88022 REV C-2000 固定极化电解质氧化铝及单端安装的电容器

This drawing and MIL-PRF-39018 describes the complete requirements for aluminum oxide, electrolytic capacitors.

CAPACITORS, FIXED, ELECROLYTIC, POLARIZED, ALUMINUM OXIDE, SINGLE END MOUNTING

IPC 2515A-2000 执行董事会裸露电气产品测试数据描述[BDTST]的分段要求

This standard specifies data formats used to describe printed board assembly in-circuit testing methodologies. These formats may be used for transmitting information between printed circuit board designers and printed board manufacturers. The formats are also useful when the manufacturing cycle includes computer-aided processes and numerical control machines.

Sectional Requirements for Implementation of Bare Board Product Electrical Testing Data Description [BDTST]

IPC 2517A-2000 执行大会在电路测试数据描述[ASEMT]的分段要求

This standard specifies data formats used to describe printed board assembly in-circuit testing methodologies. These formats may be used for transmitting information between printed board designers, board fabricators, and assembly manufacturers. The formats are also useful when the manufacturing cycle includes computer-aided processes and numerical control machines.

Sectional Requirements for Implementation of Assembly In-Circuit Testing Data Description [ASEMT]

DLA SMD-5962-87762 REV A-2000 硅单片8位类比至数位转换器跟踪/保持线性微电路

This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A.

MICROCIRCUIT, LINEAR, 8-BIT, ANALOG-TO-DIGITAL CONVERTER, WITH TRACK/HOLD, MONOLITHIC SILICON