L10 电子元件综合 标准查询与下载

ASTM F1190-99(2005) 未加偏压的电子元件的中子照射标准指南

Semiconductor devices are permanently damaged by reactor spectrum neutrons. The effect of such damage on the performance of an electronic component can be determined by measuring the component electrical characteristics before and after exposure to fast neutrons in the neutron fluence range of interest. The resulting data can be utilized in the design of electronic circuits that are tolerant of the degradation exhibited by that component. This guide provides a method by which the exposure of silicon and gallium arsenide semiconductor devices to neutron irradiation may be performed in a manner that is repeatable and which will allow comparison to be made of data taken at different facilities. For semiconductors other than silicon and gallium arsenide, this guide provides a method that can improve consistency in the measurements and assurance that data from various facilities can be compared on the same equivalence fluence scale when the applicable validated 1-MeV damage functions are codified in National standards. In the absence of a validated 1-MeV damage function, the non-ionizing energy loss (NIEL) as a function incident neutron energy, normalized to the NIEL at 1 MeV, may be used as an approximation. See Practice E 722 for a description of the method.1.1 This guide strictly applies only to the exposure of unbiased silicon (SI) or gallium arsenide (GaAs) semiconductor components (integrated circuits, transistors, and diodes) to neutron radiation from a nuclear reactor source to determine the permanent damage in the components. Validated 1-MeV damage functions codified in National Standards are not currently available for other semiconductor materials.1.2 Elements of this guide with the deviations noted may also be applicable to the exposure of semiconductors comprised of other materials except that validated 1-MeV damage functions codified in National standards are not currently available.1.3 Only the conditions of exposure are addressed in this guide. The effects of radiation on the test sample should be determined using appropriate electrical test methods.1.4 This guide addresses those issues and concerns pertaining to irradiations with reactor spectrum neutrons.1.5 System and subsystem exposures and test methods are not included in this guide.1.6 This guide is applicable to irradiations conducted with the reactor operating in either the pulsed or steady-state mode. The range of interest for neutron fluence in displacement damage semiconductor testing range from approximately 109 to 1016 n/cm 2.1.7 This guide does not address neutron-induced single or multiple neutron event effects or transient annealing.1.8 This guide provides an alternative to Test Method 1017.3, Neutron Displacement Testing, a component of MIL-STD-883 and MIL-STD-750. The Department of Defense has restricted use of these MIL-STDs to programs existing in 1995 and earlier.This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Standard Guide for Neutron Irradiation of Unbiased Electronic Components

IPC 9504-1998 评价非集成电路元件(预处理非集成电路元件)的装配过程模拟

This document describes manufacturing process simulations for use with applicable component specifications to assure that electronic components can meet expected reliability requirements after exposure to assembly factory processes. It is not intended as an assembly production specification or a stand-alone qualification document. The procedure consists of a set of assembly process simulations that can be performed by either the component user or manufacturer prior to reliability testing as specified in the applicable component qualification and reliability monitoring documents. The simulations include alternative conditions depending on the component type, physical characteristics and anticipated use. The levels defined can be used for describing either expected performance characteristics by the manufacturer or the required characteristics for the users assembly process.

Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)

ARMY MIL-HDBK-1184-1998 自动车辆电子元件防水测试

This commercial item description covers brown kraft paper used for general wrapping applications.

ELECTRICAL COMPONENTS FOR AUTOMOTIVE VEHICLES; WATERPROOFNESS TESTS

SJ 20716-1998 电子元器件用铍青铜线棒材规范

本规范规定了电子元器件用铍青铜线棒材的要求，质量保证规定、交货准备及有关规则。 本规范适用于军用电子元器件用铍青铜线棒材。

Specification for copper-beryllium alloy wire and bor for use in electronic components

SJ 20715-1998 电子元器件用铍青铜板带材规范

本规范规定了电子元器件用铍青铜板带材的要求，质量保证规定、交货准备及有关规则。 本规范适用于军用电子元器件用铍青铜板带材。

Specification for copper-beryllium alloy plate and strip for use in electronic components

BS EN 160200-2:1998 电子元器件质量评定协调体系.分规范:经质量评定的微波模数电子器件.试验方法索引

This Part 2 of the Sectional Specification EN 160200 defines standard/reference test methods for Electrical, Mechanical and Visual Inspection as prescribed in Part 1 of the Sectional Specification EN 160200 and Blank Detail Specification EN 160201 for Microwave Modular Electronic Units (MMEUs). Section three of EN 160200-1 details general requirements for test and measurement procedures (including environmental test requirements). This Standard specifies a wide range of documents which relate to microwave test methods. Many of which are not covered by IEC or CECC specifications. Although a number of test methods are under preparation by IEC and CECC they are considered acceptable for use in this Standard. Where test methods have been considered suitable for insertion into this Standard they are either referenced under clause 2.4 - Standard Test Methods or detailed in full under clause 2.5 - Special Test Methods. Examples of MMEUs which are covered by these test methods are: - Amplifiers - Attenuators - Couplers/Power dividers - Filters - Isolators/Circulators - Limiters - Mixers - Noise Sources - Oscillators - Phase Shifters - Switches - Transmitters (e.g. Integrated Multichannel) Guidance on the prime electrical characteristics to be measured is given in annex C of the Blank Detail Specification (BDS) - EN 160201. This Part 2 of EN 160200 will be reviewed as other test methods become available.

Harmonized system of quality assessment for electronic components - Sectional specification - Microwave modular electronic units of assessed quality - Index of test methods

NF C93-490-6:1998 无焊连接.第6部分:绝缘刺穿连接.一般要求.试验方法和操作指南

SOLDERLESS CONNECTIONS. PART 6 : INSULATION PIERCING CONNECTIONS. GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE. (EUROPEAN STANDARD EN 60 352-6).

BS EN 60512-19-3:1998 电子设备连接器 测试和测量 耐化学性测试 流体阻力

This section of IEC 60512-19, when required by the detail specification, is used for testing electromechanical components within the scope of IEC technical committee 48. This test may also be used for similar components when specified in a detail specification. The object of this test is to define a standard test method to assess the effects of accidental exposure to fluids and lubricants on electrical connecting devices.

Connectors for electronic equipment. Tests and measurements. Chemical resistance tests. Fluid resistance

IPC 2224-1998 电脑卡设计PWBs的分段标准

This standard establishes the requiremenftos r the design of printed boards for PC card form factors. The organic materials may be homogeneous, reinforced, or useidn combination with inorganic materials: the interconnections may be single, double, or multilayered

Sectional Standard for Design of PWBs for PC Cards

ECA 540H000-1998 电子设备用圆栅极阵列器件烧进插孔的分规范

This sectional specification relates to the bum-in sockets for Ball Grid Array (BGA) devices of assessed quality. The purpose of this specification is to provide a means of interchangeability between qualified devices and compatibility between the board a

Sectional Specification for Burn-In Sockets Used with Ball Grid Array Devices for Use in Electronic Equipment

IPC FC-234-1998 单面和双面柔性印刷电路的PSA组装方针

This document is intended to provide the designeduser with information related to the use of pressure sensitive adhesives (PSA's) for assembly of flexible printed circuitdwiring (FF'CEPW) and membrane switches. This guide provides information on adhesive types available and processes suggested for their proper use, highlight.. strengths, weaknesses, or limitations; how to start implementation and where to find additional information.

PSA Assembly Guidelines for Single-Sided and Double-Sided Flexible Printed Circuits

IEC 60940:1988/COR1:1998 抑制无线电干扰用电容器、电阻器、电感器及整套滤波装置应用的指导信息

This standard is Guidance information on the application of capacitors, resistors, inductors and complete filter units for radio interference suppression;Corrigendum 1

Guidance information on the application of capacitors, resistors, inductors and complete filter units for radio interference suppression;Corrigendum 1

ASTM F542-98 电子元件及微电子元件封装用密封化合物发热温度的试验方法

1.1 This test method covers a means for measuring the maximum temperature reached in a specific volume by a reacting liquid encapsulating compound, and the time from initial mixing to the time when this peak exothermic temperature is reached. 1.2 This test method measures the potential heat output of an encapsulating compound under conditions that provide no significant heat sink. 1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements see Section 6.

Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation

IEEE 1499-1998 电子元器件的硬件描述模型用接口

Defines an open interface between models and simulators that enables model interoperability while protecting the model provider's intellectual property. This software interface is called the Open Model Interface (OMI). Permits an OMI-compiled model to be used with any OMI-compliant application that supports that class of OMI model, regardless of the programming language in which the model was developed.

Interface for hardware description models of electronic components

ANSI NCITS 316-1998 有关AT附件的IEEE 1394.尾板(修订5)

Specifies the protocol for passing ATA and ATAPI commands over the 1394 bus. It provides a common attachment interface for systems manufacturers, system integrators, software suppliers, and suppliers of intelligent storage devices.The application environment for the 1394 to AT Attachment Interface is any system that interfaces AT Attachment storage devices via the 1394 Bus.

IEEE 1394 to AT Attachment - Tailgate (Revision 5)

NF C93-784*NF EN 61249-5-4:1997 互连结构用材料.第5部分:有涂层或无涂层的导电箔和薄膜的分规范集.第4节:导电油墨

Materials for interconnection structures. Part 5 : sectional specification set for conductive foils and films with or without coatings. Section 4 : conductive inks.

NF C93-747*NF EN 61249-8-7:1997 互连结构用材料.第8部分:非导电薄膜和涂层的分规范集.第7节:标记图例链路

Materials for interconnection structures. Part 8 : sectional specification set for non conductive films and coatings. Section 7 : marking legend links.

NF C93-400-15-8*NF EN 60512-15-8:1997 电子设备用机电元件.基本试验程序和测量方法.第15部分:触点和终端的机械试验.第8节:试验 15h:触点保持系统对工具应用的抗力

Electromechanical components for electronic equipment. Basic testing procedures and measuring methods. Part 15 : mechanichal tests on contacts and terminations. Section 8 : test 15h : contact retention system resistance to tool application.

JIS C 5063:1997 电阻器和电容器用优先数值系列

この規格は，抵抗器及びコンデンサの標準数列について規定する。

Preferred number series for resistors and capacitors

JIS C 5062:1997 电阻器和电容器的标记代码

この規格は，抵抗器及びコンデンサの表示記号について規定する。

Marking codes for resistors and capacitors