L10 电子元件综合 标准查询与下载

NF C93-400-13-1:1997 电子设备用机电元件.基本试验程序和测量方法.第13部分:机械运行试验.第1节:试验 13a:啮合力及分离力

Electromechanical components for electronic equipment. Basic testing procedures and measuring methods. Part 13 : mechanical operating tests. Section 1 : test 13a : engaging and separating forces.

IEC 60512-6-5:1997 电子设备用机电元件 基本试验程序和测量方法 第6部分:动态应力试验 第5节:试验6e:随机振动

This section of IEC 60512-6 defines a test method which is intended to assess the ability of components to withstand specified severities of random vibration.

Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 6: Dynamic stress tests - Section 5: Test 6e: Random vibration

NF C93-475-1:1997 电子设备用机电元件.基本试验规程和测量方法.第13部分:机械操作试验.第1节:试验13a:啮合和离心力

ELECTROMECHANICAL COMPONENTS FOR ELECTRONIC EQUIPMENT. BASIC TESTING PROCEDURES AND MEASURING METHODS. PART 13 : MECHANICAL OPERATING TESTS. SECTION 1 : TEST 13A : ENGAGING AND SEPARATING FORCES. (EUROPEAN STANDARD EN 60 512-13-1).

NF C93-474-20:1997 电子设备用机电元件.基本试验规程和测量方法.第16部分:触点和终端机械试验.第20节:试验16T:机械强度(无焊接连接的布线终端)

ELECTROMECHANICAL COMPONENTS FOR ELECTRONIC EQUIPMENT. BASIC TESTING PROCEDURES AND MEASURING METHODS. PART 16 : MECHANICAL TESTS ON CONTACTS AND TERMINATIONS. SECTION 20 : TEST 16T : MECHANICAL STRENGTH (WIRED TERMINATION OF SOLDERLESS CONNECTIONS). (EUR

IEC 60512-14-7:1997 电子设备用机电元件 基本试验程序和测量方法 第14部分:密封性试验 第7节:试验14g:冲水试验

This section of IEC 60512-14, when required by the detail specification, is used for testing electromechanical components within the scope of IEC technical committee 48. This test may also be used for similar components when specified in a detail specification. This section of IEC 60512-14 defines a standard test method to assess the effects of impacting water or specified fluid on electrical connecting devices.

Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 14: Sealing tests - Section 7: Test 14g: Impacting water

BS EN 61189-1:1997 电气材料、印刷板和其他互连结构和组件的测试方法 一般测试方法和方法

This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods and methodology

ECA EIA-677-1997 小型动力连接销的规范

Specification for Small Form Factor Power Connector Pin Dimensions

Specification for Small Form Factor Power Connector Pin Dimensions

IPC AJ-820 SECTION 6.0-1997 IPC-CM770,印制电路板组件安装方针

Whether a printed circuit is to be a prototype, or a high-volume

IPC-CM770,Guidelines for Printed Board Component Mounting

IPC AJ-820 SECTION 4.0-1997 电子电路元件

Whether a printed circuit is to be a prototype, or a high-volume

Electronic Circuit Components

IEC 61360-4:1997 电气元器件标准数据元素类型和相关分类模式 第4部分:IEC标准数据元素类型、元器件分类和项的基准集

Standard data element types with associated classification scheme for electric components - Part 4: IEC reference collection of standard data element types, component classes and terms

DLA SMD-5962-96794-1997 12-BIT数字对类似体转换器混合线型微电路

This drawing documents five product assurance classes, class D (lowest reliability), class E, (exceptions), class G (lowest high reliability), class H (high reliability), and class K, (highest reliability) and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levelsare reflected in the PIN.

MICROCIRCUIT, HYBRID, LINEAR, 12-BIT, DIGITAL TO ANALOG CONVERTER

ITU-R P.843-1-1997 通过流行猝发传播的通信

that scattering from ionization caused by meteor trails can provide a convenient means of communication at HF and VHF

Communication by Meteor-Burst Propagation

IPC PE-740A SECTION 10-1997 电镀

IPC Standards and Publications are designed to serve the public interest through

Electroplating

ANSI/EIA 710:1997 空间级电连接器的要求指南

Provides the information concerning what the minimum requirements are for all electrical connectors being used in any space flight application.

Requirements Guide for Space Grade Electrical Connectors

IPC PE-740A SECTION 18-1997 印制电路板组件清洗

IPC Standards and Publications are designed to serve the public interest through

Cleaning of Printed Board Assemblies

IPC PE-740A SECTION 7-1997 电镀过程

IPC Standards and Publications are designed to serve the public interest through

Electroless Processes

IPC PE-740A-1997 印制电路板制造和装配的修订版A的疑难解答

IPC Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standards and Publications shall not in any respect preclude any member or nonmember of IPC from manufacturing or selling products not conforming to such Standards and Publication, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than IPC members, whether the standard is to be used either domestically or internationally.

Troubleshooting for Printed Board Manufacture and Assembly Revision A

ANSI/EIA 706:1997 元件标志标准

Describes the requirements for using formatted two dimensional machine readable symbols for the marking of electronic components of first level assemblies.

Component Marking Standard

NAVY MIL-DTL-15024 F-1997 设备识别的电容器板,标签和传送带总说明书

This performance specification covers the physical characteristics of plates, tags and bands (identification devices) used for identification of equipment. Examples of information to be marked on the identification devices are covered in the applicable specification sheets.

PLATES, TAGS, AND BANDS FOR IDENTIFICATION OF EQUIPMENT, GENERAL SPECIFICATION FOR

IPC PE-740A INTRO-1997 印制电路板制造和装配的疑难解答

Just include spec information Focus on end product performance Include a feed back system on use and problems for future improvement

Troubleshooting for Printed Board Manufacture and Assembly