L10 电子元件综合 标准查询与下载

IEC 60512-13-1:1996 电子设备用机电元件 基本试验程序和测量方法 第13部分:机械操作试验 第1节:试验13a:啮合和分离力

Details a standard test method to measure the force and/or torque required to fully engage or separate mating componenets, including the effect of any device that assists the engaging/separating operations. Replaces clause 1 of IEC 512-7 (Test 13a).

Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 13: Mechanical operating tests - Section 1: Test 13a: Engaging and separating forces

IEC 61605:1996 电子和通信设备用固定电感器 标记代码

Fixed inductors for use in electronic and telecommunication equipment - Marking codes

IEC 60512-11-14:1996 电子设备用机电元件 基本试验程序和测量方法 第11部分:气候试验 第14节:试验11p:流动单气体腐蚀试验

Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 11: Climatic tests - Section 14: Test 11p - Flowing single gas corrosion test

ECA 705-1996 电子工业协会-自动组成处理小组-出版在ACH-2000中自动化组件处理新技术的指导方针和登记程序

This document defines the means for review and registration of new technologies pertaining to automated handihg of electronic components.

Electronic Industries Association - Automated Component Handling Committee - Guidelines and Procedures for Registration of New Technologies for Automated Component Handling for Publication in ACH-2000

DIN 45808:1996 指导文件:塑料包封件的使用和应用

Guidance document: Use and application of plastic encapsulated devices; German version CECC 00808:1996

SJ 50676/1-1996 HTP009A、HTP017A型射频带线环行器.详细规范

Type HTP009A and HTP017A radio frequency strip-line circulators detail specification for

SJ 20614-1996 交流薄膜电致发光矩阵显示器件总规范

General specification for a.c.thin film electroluminescent matrix display devices

SJ 20613-1996 交流薄膜电致发光矩阵显示器件测试方法

Methods of measurement for a.c.thin film electroluminescent matrix display devices

SJ 20470.1-1996 40PHX90型波导转换驱动器详细规范

Driver of waveguide switch type 40PHX90,detail specification for

ECA EIA-5400000-A-1996 电子设备的集成线路包装插座的一般规范

Generic Specification for Sockets for Use in Electronic Equipment

Generic Specification for Sockets for Use in Electronic Equipment

ECA 540BAAA-A-1996 详细规范:用于电子设备的格网排列装置的2.54mm和2.55mm空间的低插入机械启动插座

The pin grid array (PGA) sockets of assessed quality covered by this detail specification have:- Maximum enclosure dimensions as shown in figure 1.- A working voltage not xceeding 250 volts (rms).

Detail Specification for Mechanically Actuated (Zero and Low Insertion Force) Sockets for Pin Grid Array Devices with 2.54 mm X 2.54 mm (0.1 in X 0.1 in) Spacing for Use in Electronic Equipment

IEC 60512-16-20:1996 电子设备用机电元件 基本试验程序和测量方法 第16部分:接触件及引出端的机械试验 第20节:试验16t:机械强度(无焊连接绕线端)

Object of this test is to detail an standard method to assess the mechanical strength of solderless connections including integrated strain relief features. Should be used in conjunction with IEC 512-1.

Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 16: Mechanical tests on contacts and terminations - Section 20: Test 16t: Mechanical strength (wired termination of solderless connections)

BS CECC 00804:1996 电子元器件用质量评估协调体系.对 'EN ISO 9000-1994'标准的解释.电子元器件可靠性特点

Implementation of CECC 00804:1996 Harmonized system of quality assessment for electronic components Interpretation of 'EN ISO 9000 : 1994' Reliability aspects for electronic components SECTION A - GUIDE INTRODUCTION 0.1 General introduction to CECC 00 804 0.2 Application of CECC 00 804 by component manufacturers and specialist contractors 0.3 Application of CECC 00 804 by other organisations 0.4 Application of CECC 00 804 by auditing bodies GUIDANCE 1 Management responsibility 2 Quality system 3 Contract review 4 Design control 5 Documentation control 6 Purchasing 7 Purchaser supplied product 8 Identification and traceability 9 Process control 10 Inspection and test 11 Inspection, measurement and test equipment 12 Inspection and test status 13 Control of non-conforming products 14 Corrective action 15 Handling, storage, packaging and delivery 16 Quality records 17 Audits 18 Training 19 Servicing 20 Statistical techniques SECTION B - CHECK LIST INTRODUCTION CHECK LIST QUESTIONS

Harmonized system of quality assessment for electronic components - Interpretation of 'EN ISO 9000:1994': Reliability aspects for electronic components

IPC 9201-1996 外部绝缘电阻手册

Surface Insulation Resistance (SIR) testing has been with the electronics industry since the advent of the transistor and printed circuit board. It has been used as a tool for: incoming inspection; materials investigations and qualifications; quality conformance; prediction of long-term failure mechanisms; and as a predictive tool for estimated service life.

Surface Insulation Resistance Handbook

IPC 3406-1996 导电外部贴装胶粘剂准则

This document covers guidelines for selecting electrically conductive adhesives for use in assembly of components to printed circuit boards (PCB) or similar wiring interconnect systems. The focus is on the use of adhesives as solder alternatives. The process discussion attempts to stay within the bounds of the existing solder assembly infrastructure as much as possible. Both major types of adhesives, isotropic (conducting equally in all directions) and anisotropic (unidirectional conductivity), are covered. The two major divisions of polymer adhesives, thermosets and thermoplastics, are described.

Guidelines for Electrically Conductive Surface Mount Adhesives

IPC D-279-1996 可靠的外部贴装技术印制电路板组件设计指南

This document establishes design concepts, guidelines, and procedures intended to promote appropriate ‘Design for Reliability (DfR)’ procedures and to ensure reliable printed wiring assembly (PWA) characteristics. The major focus of the information presented is directed toward those PWAs that have surface mount (SM) components, either totally, or intermixed with through-hole components, mounted on one or both sides of the mounting structure.

Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

SJ 20527.2-1995 微波组件.WFZ817型压控振荡器详细规范

Microwave assembly.detail specification for model WFZ817 voltage controlled oscillator

SJ 20529-1995 脉冲调制管总规范

General specification for pulse modulation tubes

ECA 364-85-1996 TP-85,电子连接器接触末端机械磨损试验和评价磨损的常规测试程序

The purpose of this procedure is to determine the presence of mechanical damage, wearthrough,and other gross defects in the contact finish. Most contact finishes are intended to be protective, and the presence of gross defects in the finish indicates a se

TP-85 General Test Procedure for Assessing Wear and Mechanical Damage Testing of Contact Finishes for Electrical Connectors

ECA 364-86-1996 TP-86.电子连接器和插座偏振/编码键压力过重的测试程序

The objective of this test procedure is to determine the &&venes of polarizationlcoding keys when a connector pair is misregistered (improperly mated).

TP-86 Polarizing/Coding Key Overstress Test Procedure for Electrical Connectors and Sockets