共找到 348 条与 安装、接线连接件 相关的标准,共 24 页
Provides all the information required for the identification and quality assessment of chip carriers sockets for leadless A, B, and D chip carriers.
Chip Carrier Sockets for Leadless type A,B,D Chip Carriers for use in Electronic Equipment, Blank Detail Specification for
Provides all the information required for the identification and quality assessment of chip carrier sockets for plastic quad flat packages.
Chip Carrier Sockets for Plastic Quad Flat Packages for Use in Electronic Equipment, Blank Detail Specification for
Defines a unified numbering system to be used with multi-package module carrier sockets standardized by EIA.
Multi-Package Module Sockets for Use in Electronic Equipment, Sectional Specification for
Dual-In-Line Package Sockets, Specification for
Provides all information required for the identification and quality assessment of dual in-line package sockets for the NECQ quality system.
Dual-In-Line Package Sockets for Use in Electronic Equipment, Blank Detail Specification for
Describes dual in-line sockets or assessed quality having working voltage not to exceed 250 volts.
Detail Specification for Flexible Carrier 2-Piece Dual-In-Line Socket for Use in Electronic Equipment
Provides all information required for the identification and quality assessment of chip carrier sockets for plastic chip carriers with "J" type leads.
Chip Carrier Sockets for Plastic Chip Carrier (PCC) Packages with J Type Leads for Use in Electronic Equipment, Blank Detail Specification for
Provides all the information required for the identification and quality assessment of the chip carrier sockets for plastic chip carrier (PCC) family with lead spacing.
Chip Carrier Sockets for Plastic Chip Carrier Family 1.27 mm (0.50 inch) Lead Spacing, Detail Specification for
Relates to the plug-in sockets designed for in-line electronic packages of assessing quality.
In-Line Package Sockets for Use in Electronic Equipment, Sectional Specification for
Provides all the information required for the identification and quality assessment of the chip carrier sockets for plastic quad flat packages (PQFP) with lead spacing on 0.635 mm (0.025 in) centers and "Gullwing" shaped leads.
Detail Specification for Chip Carrier Sockets for Plastic Quad Flat Pack 0.635-mm (0.25-in) Lead Spacing (Gullwing)
Requirements, tests and practical guidance information.
Solderless connections. Specification for solderless crimped connections (including test methods and practical guidance)
Connecting devices for low voltage circuits for household and similar purposes; part 1: general requirements
the 1988 amendments to the International Convention for the Safety of Life at Sea, 1974, which permits ships, engaged exclusively on voyages in areas where an HF direct-printing telegraphy maritime safety information service is provided and which are fi
TECHNICAL CHARACTERISTICS FOR A HIGH FREQUENCY DIRECT-PRINTING TELEGRAPH SYSTEM FOR PROMULGATION OF HIGH SEAS AND NAVTEX-TYPE MARITIME SAFETY INFORMATION
Provides all information required for the identification and quality assessment of pin grid array sockets for the NECQ quality assesment system.
Nonmechanically Actuated Flexible Carrier Sockets for Pin Grid Array for Use in Electronic Equipment, Detail Specification for
Provides all the information required for the identification and quality assessment of the chip carrier sockets for leadless type A packages (CCS/LLA described)
Chip Carrier Sockets for Leadless Type A 1.27 mm (.050”) Spacing Chip Carriers for Use in Electronic Equipment
Provides information for the identification and quality assessment of the pin grid array socket described.
Blank Detail Specification: Sockets for Pin Grid Array Devices with 2.54 mm ¥ 2.54 mm (0.1" ¥ 0.1") Spacing for Use in Electronic Equipment
Provides a means of assuring interchangeability between devices, compatibility between circuit boards and the chip carriers, and also provides standard test methods.
Sectional Specification for Sockets for Chip Carriers for Use in Electronic Equipment
This standard contains dimensions, requirements and test for connectors, which are designed for high current (10, 20 and 40 A). They have to be snapped in into connectorsbodys, which are in accordance to DIN 41612 part 8.
Special contacts for multi two-part connectors; contacts for high current (type H); dimensions, ratings, requirements, tests
Detail Specification for Dual-In-Line Package Sockets
Relates to the sockets for pin grid array devices of assessed quality.
Sectional Specification for Sockets for Pin-Grid Array Devices with 2.54 mm ¥ 2.54 mm (0.1" ¥ 0.1") Spacing for Use in Electronic Equipment
Copyright ©2007-2022 ANTPEDIA, All Rights Reserved
京ICP备07018254号 京公网安备1101085018 电信与信息服务业务经营许可证:京ICP证110310号