Topic

Speaker

09:00-

09:20

Grand Opening-Introductionof OIPT Products Line

欢迎致辞—牛津仪器等离子技术部全产品介绍

Ian Wright, Asia VP,

Oxford Instruments Plasma  Technology

09:20-

09:40

Grand Opening-Introductionof OI China

欢迎致辞—牛津仪器公司介绍

Peng ZHANG, GM,

Oxford Instruments China

09:40-

10:30

Etching Process in GaN

氮化硅中的刻蚀工艺

Professor

Xi'an University

10:30-

11:15

InP  etching process instruction in opto device

光学器件中InP刻蚀工艺

Dr.  Ligang DENG, Principal Process Engineer

Oxford  Instruments Plasma Technology

11:15-

12:00

Etching  and deposition challenge in modern power device

功率半导体器件制造中的挑战

Dr.  Young HUANG, Senior Application Engineer

Oxford  Instruments Plasma Technology

12:00-

13:00

Lunch  (Buffet)

13:20-

14:15

Plasma solution in VSCEL

VCSEL制造的等离子体解决方案

Dr.  Ligang DENG, Principal Process Engineer

Oxford  Instruments Plasma Technology

14:15-

14:30

Lucky Draw

14:30-

15:15

Etch process in MEMS Application

刻蚀在MEMS中的应用

 Professor

 Northwestern Polytechnical University

15:15-

15:45

Tea Break

15:45-

16:30

Deep Si Etch process in MEMS and TSV application

深硅刻蚀在MEMS和TSV中的应用

Dr.  Young HUANG, Senior Application Engineer

Oxford  Instruments Plasma Technology

16:00-

16:30

Free  Discussion