产品描述

Features

• Unique pressure and temperature uniformity

• Compatible with EVG mechanical and optical aligners

• Flexible design and configurations for research and piloting

• Form single chips to wafers

• Various processes (eutectic, solder, TLP, direct bonding)

• Optional turbopump (<1E-5 mbar)

• Upgradeable for anodic bonding

• Open chamber design for easy conversion and maintenance

• Production compatible

• High throughput with fast heating and pumping specifications

• High yield through automatic wedge compensation

• Open chamber design for fast conversion and maintenance

• Smallest footprint for a 200 mm bonding system: 0.8 m2

• Recipes are fully compatible with EVG’s high-volume-manufacturing bonding systems

Technical Data

Loading chamber
Manual