NPC-3500(A)全自动等离子清洗/去胶机应用:
有机物以及无机物的残留物去除
光刻胶剥离或灰化
去残胶以及内腐蚀(深腐蚀)应用
清洗微电子元件,电路板上的钻孔或铜线框架
提高黏附性,消除键合问题
塑料的表面改型:O2处理以改进涂覆性能
产生亲水或疏水表面
NPC-3500(A)全自动等离子清洗/去胶机Features:
Stand Alone System
Auto wafer Load/Unload with load lock
Stainless Steel, Aluminum or Bell Jar Chambers
Class 100 Clean Room Compatible
Shower Head, ICP or Microwave Plasma Sources
Rotating Platen
RF Biasable Heated up to 300 °C PID Controlled or Cooled Platen
Fully Automated or Manual RF tuning
Up to 5 Mass Flow Controllers with Electropolished Gas Lines
PC Controlled Pneumatic Valves
Multiple Levels of Access with Password Protection
PC Controlled with LabVIEW
Mechanical Pump with Pressure goes to 10 mTorr
250 l/sec Turbomolecular Pump
5x10-7 Torr Base Pressure
Fully Safety Interlocked
NPC-3500(A)全自动等离子清洗/去胶机Applications:
Removal of Organic and Inorganic Materials without Residues
Photoresist Stripping or Ashing
Desmearing and Etch Back Applications
Cleaning Microelectronics, Drilled Holes on Circuit Boards or Cu Lead Frames
Adhesion Promotion, Elimination of Bonding Problems
urface Modification of Plastics: O2 Treatment for Paintability
Producing Hydrophilic or Hydrophobic Surfaces