FSM 128薄膜应力及基底翘曲测试设备参数指标

技术参数
Operating temperature: Ambient
Measurement technique: Non-contact laser scanning
Wafer size: FSM 128NT: 50mm to 200mm (standard)
                     FSM 128L: 150mm, 200mm, and 300mm
                     FSM 128G: Panels up to 550 x 650mm
Scanning method: High precision single line scan and programmable multiple diametric scans for 2-D and 3-D map profiles with motorlzed rotational stage
Auto intensity:Automatically adjusts laser intensity according to reflectivity of samples
Auto switching dual lasers: 650nm and 780nm
Film stress measurement range: 1 MPA to 4 GPA for a typical Si wafer (provided curvature or bow1 height change is at least 1μm)
Bow height change measurement range: 1μm to 4mm
Repeatability: 1% (1 sigma) on a 20m curvature mirror standard2
Accuracy: Better than 2.5% based on a 20m radius curvature mirror2
Laser class: Class 1
Data compatibility: Measurement results or maps are exportable to spreadsheet programs like Excel? or to jpeg image files
Optional accessories:FSM Reflectometry for film thickness mapping for dielectric films and calibration standards
Computer:CPU: Intel core i5 or better, Ram: 2Gb min hard drive: 1Tb optical drive: DVD R/W, USB Port (Min) 4. Ethernet connections: 2 RJ-45
Dimensions & weight:
FSM 128NT: 14” (W) x 22”(L) x 15”(H); 50lbs
FSM 128L: 14”(W) x 26”(L) x 15”(H); 70lbs
FSM 128G: 37”(W) x 48”(D) x 19”(H); 200lbs

Power: 100v/220v; 20A