Lyncee Tec MEMS全息...
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FeaturesDHM®3D LDVLDV
Dynamic topography××
3D vibrations (X,Y,Z) XYZ XYZ Z only
Maximum frequency25 MHz25 MHzup to 1.2 GHz
Full field measurement with XY scanning with XY scanning
Diffraction limited resolution limited by laser spot size limited by laser spot size
Objective turret××
No need of sample preparation

 

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Measurement of complex structures××
Measurement of complex motions (simultaneous in-, out- of plane, tilt, … )++
Measurement of in-plane displacement lager than MEMS structures××



 


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