天美公司赛里安Versa顶空进样器参数指标

仪器简介

顶空技术广泛应用于各种类型样品中挥发性有机物（VOCs）分析，相对于其他进样技术，顶空进样不仅可完成样品准备，还可以有效避免样品交叉污染问题。Teledyne Tekmar 作为VOC行业引领者，整合以往经验推出Versa全自动顶空进样系统，在完全满足客户顶空分析应用要求的同时并大幅降低运行成本。

主要特点
■ 体积小，便于操作
■ 标配20位自动进样器
■ 样品管路可加热至200℃，控温精确
■ 内置压力控制系统，保证了所有气体的精确控制
■ 样品传输管路、进样针、定量环等均采用惰性材料，防止样品残留和损失，保证了分析结果准确
■ 全自动泄漏测试、仪器状态核查等全部在线故障诊断功能
■ 方法开发简便
■ 可与市场上所有GC/GC-MS连接

Autosampler Capacity 20-Position

Platen Heater Single position; ambient  to 200 °C via resistance heater settable in 1 °C increments

Vial Size 22 mL vials

Sample Loop Ships with a  standard 1 mL Silco ®  coated loop. Other optional loop sizes include 100, 250, 500 µL  as well as 2, 3, and 5 mL

Sample Mixing System allows variable power settings from low / medium / high

Sample Pathway SilcoNert ®  1000 tubing. Entire sample pathway temperature controlled up to 200 °C

Software Versa TekLink™2G software in a Windows ®  XP or greater environment via USB connection  

Versa TekLink™2G can be configured for full 21 CFR Part 11 compliance tool capability

GC Interface Interface to virtually all commercially available GC instruments. Supplies or accepts GC and Data  

System start/ready signals via software selectable GC/IO configuration

Pressure Control Software has the ability to control pressure to ensure consistent volume regardless of external  

conditions for all samples via a pressure transducer

Valving Motor-actuated 6-port valve with removable rotor (controlled from ambient to 200 °C)

Voltage Requirements 100/115 VAC ±5%, 50/60 Hz, 5 amps & 220/240 VAC ±5%, 50/60 Hz, 2.5 amps

Gas Requirements Ultra-high purity (99.999%) Helium or Nitrogen; incoming pressure: 45 - 140 psig

Unit Dimensions  

(H x W x D)

21 in (53.34 cm) x 12 in (30.48 cm) x 21 in (53.34 cm)

 Weight  40 lbs (18.14 kg)

Environmental Conditions Operating Temperature: 10° to 30 °C; Storage Temperature: -20° to 60 °C;  

Relative Humidity: 10% to 90%

Corrosion Resistance The chassis and carousel tray are resistant to aqueous samples with pH range 1-10

Certifications CE, CETL, CSA, ETL

Windows ®  is a registered trademark of Microsoft ® ,  SilcoNert ®  1000 is a registered trademark of SilcoTek. TekLink™ is a registered trademark of Teledyne Tekmar.