GSO IEC 61188-5-1:2014

Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements

GSO IEC 61188-5-1:2014 发布历史

GSO IEC 61188-5-1:2014由GSO 发布于 2014-12-25。

GSO IEC 61188-5-1:2014在国际标准分类中归属于: 31.180 印制电路和印制电路板。

GSO IEC 61188-5-1:2014 的最新版本是哪一版？

最新版本是 GSO IEC 61188-5-1:2014 。

GSO IEC 61188-5-1:2014的历代版本如下：

• 2014年 GSO IEC 61188-5-1:2014

This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.

标准号

GSO IEC 61188-5-1:2014

发布

2014年

发布单位

GSO

当前最新

GSO IEC 61188-5-1:2014

 

 

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