GSO IEC 62137-1-4:2013

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test

GSO IEC 62137-1-4:2013 发布历史

GSO IEC 62137-1-4:2013由GSO 发布于 2013-12-31。

GSO IEC 62137-1-4:2013在国际标准分类中归属于: 31.190 电子元器件组件。

GSO IEC 62137-1-4:2013 的最新版本是哪一版？

最新版本是 GSO IEC 62137-1-4:2013 。

GSO IEC 62137-1-4:2013的历代版本如下：

• 2013年 GSO IEC 62137-1-4:2013

The test method described in IEC 62137-1-4:2009 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of substrate. This test also evaluates the effects of repeated mechanical stress, such as key pushing in cell phones, the strength of the solder joint between component terminals and lands on a substrate.

标准号

GSO IEC 62137-1-4:2013

发布

2013年

发布单位

GSO

当前最新

GSO IEC 62137-1-4:2013

 

 

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