IEC 60371-3-5:2005由IEC - International Electrotechnical Commission 发布于 2005-11-01,并于 2005-11-22 实施。
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本标准有修改采用的 中文版 GB/T 5019.7-2009 以云母为基的绝缘材料.第7部分:真空压力浸渍(VPI)用玻璃布及薄膜补强环氧树脂粘合云母带
This part of IEC 60371 gives requirements for electrical insulating materials made by combining mica paper with glass fabric and bonding them together with a small amount of epoxy resin. The material is supplied in a flexible state and is designed for use in conjunction with vacuum pressure impregnation (VPI) with compatible impregnates. The final cured properties will be primarily dependent on the VPI resin used. Two bond contents are specified: ?C low bond with a resin content of (8 ?? 3) %; ?C medium bond with a resin content of (16 ?? 3) %. Materials which conform to this specification meet established levels of performance. However@ the selection of a material by a user for a specific application should be based on the actual requirements necessary for adequate performance in that application and not based on this specification alone.
, and mechanical characteristics of sustainable tannin bio-based foams reinforced with wood cellulosic fibers4、Improved thermal conductivity of epoxy resin by graphene–nickel three-dimensional filler5、...
of epoxy resin by graphene–nickel three-dimensional filler5、A synergistic strategy for fabricating an ultralight and thermal insulating aramid nanofiber/polyimide aerogel 6、Fabrication of Graphene/TiO...
conductivity enhancers for epoxy resin3、Thermal, morphological, and mechanical characteristics of sustainable tannin bio-based foams reinforced with wood cellulosic fibers4、Improved thermal conductivity...
相关成果以Nacre-inspired bacterial cellulose/mica nanopaper with excellent mechanical and electrical insulating properties by biosynthesis为题发表在《先进材料》(Advanced Materials)上。...
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