EN 62435-5:2017

Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices

EN 62435-5:2017 发布历史

IEC 62435-5:2017 is applicable to long-term storage of die and wafer devices and establishes specific storage regimen and conditions for singulated bare die and partial or complete wafers of die including die with added structures such as redistribution layers and solder balls or bumps or other metallisation. This part also provides guidelines for special requirements and primary packaging that contain the die or wafers for handling purposes. Typically, this part is used in conjunction with IEC 62435-1:2017 for long-term storage of devices whose duration can be more than 12 months for products scheduled for long duration storage.

EN 62435-5:2017由欧洲电工标准化委员会 IX-CENELEC 发布于 2017-03-31，并于 2017-05-24 (7) 实施，于 2020-02-24 (7) 废止。

EN 62435-5:2017在国际标准分类中归属于: 31.020 电子元器件综合。

EN 62435-5:2017的历代版本如下：

• 2017年 EN 62435-5:2017

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标准号

EN 62435-5:2017

发布

2017年

发布单位

欧洲电工标准化委员会

当前最新

EN 62435-5:2017

 

 

适用范围

IEC 62435-5:2017 is applicable to long-term storage of die and wafer devices and establishes specific storage regimen and conditions for singulated bare die and partial or complete wafers of die including die with added structures such as redistribution layers and solder balls or bumps or other metallisation. This part also provides guidelines for special requirements and primary packaging that contain the die or wafers for handling purposes. Typically, this part is used in conjunction with IEC 62435-1:2017 for long-term storage of devices whose duration can be more than 12 months for products scheduled for long duration storage.

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