GSO IEC PAS 62326-14:2013由GSO 发布于 2013-12-31。
GSO IEC PAS 62326-14:2013在国际标准分类中归属于: 31.180 印制电路和印制电路板。
GSO IEC PAS 62326-14:2013 的最新版本是哪一版？
最新版本是 GSO IEC PAS 62326-14:2013 。
IEC/PAS 62326-14:2010(E) is applicable to device embedded substrates fabricated by embedding discrete active and passive electronic devices into an inner layer of a substrate with electric connections by vias, conductor plating, conductive paste, and printing. The device embedded substrate may be used as a substrate to mount SMDs to form electronic circuits, as conductor and insulator layers may be formed after embedding electronic devices. The purpose of this PAS is to obtain common understanding in design, fabrication and use of device embedded substrates in the industry. This PAS describes the substrate embedding devices including but not limited to module, integrated passive device (IPD), microelectrochemical systems (MEMS), discrete component formed in the fabrication process of the electronic wiring board, and sheet form component. This PAS does not specify the fabrication process of device embedded substrates, via diameter/via land diameter, conductor width/conductor spacing nor conductor line density.
Copyright ©2007-2022 ANTPEDIA, All Rights Reserved
京ICP备07018254号 京公网安备1101085018 电信与信息服务业务经营许可证：京ICP证110310号